Antenna structure and electronic device including the same

Patent metadata

Field	Value
Publication number	US-12107334-B2
Application number	US-202218075850-A
Country	US
Kind code	B2
Filing date	Dec 6, 2022
Priority date	Oct 8, 2021
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

The disclosure relates to a fifth generation (5G) or pre-5G communication system supporting higher data rates after a fourth generation (4G) communication system such as Long Term Evolution (LTE). A module in a wireless communication system is provided. The module includes a plurality of antenna elements, an antenna substrate coupled to the plurality of antenna elements, a metal plate coupled to the antenna substrate, a calibration substrate coupled to a Radio Frequency (RF) component on a first face, and a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate. The conductive adhesive material may be coupled to the calibration substrate on a second face different from the first face of the calibration substrate. The conductive adhesive material may include an air gap formed along a signal line included in the calibration substrate.

First claim

What is claimed is:

1. A module in a wireless communication system, the module comprising:
a plurality of antenna elements;
an antenna substrate coupled to the plurality of antenna elements;
a metal plate coupled to the antenna substrate;
a calibration substrate coupled to a radio frequency (RF) component on a first face; and
a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate,
wherein the conductive adhesive material is coupled to the calibration substrate on a second face different from the first face of the calibration substrate, and
wherein the conductive adhesive material comprises an air gap formed along a signal line included in the calibration substrate.

2. The module of claim 1 , further comprising:
a connector in a region corresponding to a region in which one antenna element among the plurality of antenna elements is electrically coupled to the signal line.

3. The module of claim 2 ,
wherein the connector is disposed inside the air gap to electrically couple one region of the signal line and the antenna element, and
wherein the connector is a pin connector.

4. The module of claim 3 , wherein a region of the metal plate, corresponding to a region in which the connector is disposed, comprises another air gap.

5. The module of claim 1 , wherein the conductive adhesive material comprises a conductive tape or a metal sheet and adhesive layers.

6. The module of claim 1 , wherein the calibration substrate including the signal line comprises a transmission line of a conductor-backed coplanar waveguide (CPW) structure.

7. The module of claim 6 ,
wherein the calibration substrate comprises a coupler, and
wherein the coupler is a first portion of the transmission line disposed to a region adjacent to a region in which one antenna element among the plurality of antenna elements is electrically coupled to the signal line.

8. The module of claim 7 ,
wherein the calibration substrate further comprises a combiner and a different coupler other than the coupler, and
wherein the combiner is a second portion of the transmission line disposed to a region in which the coupler and the different coupler are coupled.

9. The module of claim 1 , further comprising:
a bonding member,
wherein the bonding member is coupled to the metal plate by penetrating the calibration substrate and the conductive adhesive material, and
wherein the bonding member comprises one of a screw or a rivet.

10. The module of claim 1 , wherein the RF component comprises a filter.

11. A massive multiple input multiple output (MIMO) unit (MMU) device comprising:
a main board;
a radio frequency integrated circuit (RFIC) disposed to the main board; and
a plurality of antenna modules disposed to the main board,
wherein each of the plurality of antenna modules comprises:
a plurality of antenna elements,
an antenna substrate coupled to the plurality of antenna elements,
a metal plate coupled to the antenna substrate,
a calibration substrate coupled to a radio frequency (RF) component on a first face, and
a conductive adhesive material for electrical coupling between the metal plate and the calibration substrate,

wherein the conductive adhesive material is coupled to the calibration substrate on a second face different from the first face of the calibration substrate, and
wherein the conductive adhesive material comprises an air gap formed along a signal line included in the calibration substrate.

12. The MMU device of claim 11 , further comprising:
a connector in a region corresponding to a region in which one antenna element among the plurality of antenna elements is electrically coupled to the signal line.

13. The MMU device of claim 12 ,
wherein the connector is disposed inside the air gap to electrically couple one region of the signal line and the antenna element, and
wherein the connector is a pin connector.

14. The MMU device of claim 13 , wherein a region of the metal plate, corresponding to a region in which the connector is disposed, comprises another air gap.

15. The MMU device of claim 11 , wherein the conductive adhesive material comprises one of a conductive tape or a metal sheet, and adhesive layers.

16. The MMU device of claim 11 , wherein the calibration substrate including the signal line comprises a transmission line of a conductor-backed coplanar waveguide (CPW) structure.

17. The MMU device of claim 16 ,
wherein the calibration substrate comprises a coupler, and
wherein the coupler is a first portion of the transmission line disposed to a region adjacent to a region in which one antenna element among the plurality of antenna elements is electrically coupled to the signal line.

18. The MMU device of claim 17 ,
wherein the calibration substrate further includes a combiner and a different coupler other than the coupler, and
wherein the combiner is a second portion of the transmission line disposed to a region in which the coupler and the different coupler are coupled.

19. The MMU device of claim 11 , further comprising:
a bonding member,
wherein the bonding member is coupled to the metal plate by penetrating the calibration substrate and the conductive adhesive material, and
wherein the bonding member comprises a screw or a rivet.

20. The MMU device of claim 11 , wherein the RF component comprises a filter.

21. The MMU device of claim 11 , wherein the signal line of the calibration substrate comprises a plurality of signal lines.

22. The MMU device of claim 21 , wherein the plurality of signal lines are disposed on a second layer of the calibration substrate.

23. The MMU device of claim 22 , wherein a portion of the second layer of the calibration substrate includes a ground region.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Bumhee
• Ko Seungtae
• KUM Junsig
• Kim Yoongeon
• Lee Seokmin
• Lee Youngju
• Lee Jongmin
• Choi Seungho

Classifications

• H01Q1/246

  specially adapted for base stations · CPC title

• H01Q1/243

  with built-in antennas · CPC title

• H01P1/20

  Frequency-selective devices, e.g. filters · CPC title

• H01Q21/061

  Two dimensional planar arrays · CPC title

• H01Q1/38 Primary

  formed by a conductive layer on an insulating support {(patch antennas H01Q9/0407; microstrip dipole antennas H01Q9/065; microstrip slot antennas H01Q13/106; transmission line microstrip antennas H01Q13/206; manufacturing reflecting surfaces using insulating material for supporting the reflecting surface  H01Q15/142)} · CPC title