Methods of lapping while heating one or more features, and related sliders, row bars, and systems
US-11389924-B2 · Jul 19, 2022 · US
US12106786B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12106786-B2 |
| Application number | US-202217978480-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 1, 2022 |
| Priority date | Aug 1, 2022 |
| Publication date | Oct 1, 2024 |
| Grant date | Oct 1, 2024 |
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The present disclosure discloses a magnetic head, a head gimbal assembly, a hard disk drive, and a method for processing a magnetic head. The method comprises irradiating at a fixed point proximal to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded; orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar; and disassembling the magnetic strip to obtain a lapped magnetic head. Through laser heating induced compensation, the heights of lapped read head and write head of the magnetic head meet their respective target values, ensuring the normal reading and writing of the storage medium of the magnetic disk.
Opening claim text (preview).
What is claimed is: 1. A method for processing a magnetic head, the magnetic head comprising a substrate and a thin-film magnetic head formed at an end of the substrate, the thin-film magnetic head comprising a read/write part and a bonding pad part proximate to the read/write part, the read/write part is in the form of a protruding part and is arranged on an air bearing surface opposite to a storage medium, and the read/write part has a write head for writing information in the storage medium and a read head for reading information from the storage medium; the bonding pad part comprises a welding contact point formed on an end surface of the thin-film magnetic head, wherein the method for processing the magnetic head comprises: irradiating at a fixed point proximate to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded to produce target expansion; orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar, so that the heights of the read head and the write head of each of the plurality of magnetic heads meet their respective target values; and disassembling the magnetic strip to obtain a lapped magnetic head; wherein the step of irradiating at the fixed point proximate to the read/write part with the laser irradiation device until the read head and the write head are thermally expanded comprises: irradiating the bonding pad part at the fixed point with the laser irradiation device until the heated welding contact point transfers heat to the read head and the write head, resulting in thermal expansion of the read head and the write head; and wherein the irradiating of the bonding pad part at the fixed point with the laser irradiation device comprises: irradiating the welding contact point located at a preset distance from the write head with the laser irradiating device, wherein the preset distance is 10 μm to 20 μm. 2. A method for processing a magnetic head, the magnetic head comprising a substrate and a thin-film magnetic head formed at an end of the substrate, the thin-film magnetic head comprising a read/write part and a bonding pad part proximate to the read/write part, the read/write part is in the form of a protruding part and is arranged on an air bearing surface opposite to a storage medium, and the read/write part has a write head for writing information in the storage medium and a read head for reading information from the storage medium; the bonding pad part comprises a welding contact point formed on an end surface of the thin-film magnetic head, wherein the method for processing the magnetic head comprises: irradiating at a fixed point proximate to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded to produce target expansion; orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar, so that the heights of the read head and the write head of each of the plurality of magnetic heads meet their respective target values; and disassembling the magnetic strip to obtain a lapped magnetic head; wherein the step of irradiating at the fixed point proximate to the read/write part with the laser irradiation device until the read head and the write head are thermally expanded comprises: irradiating the air bearing surface proximal to the read/write part with the laser irradiation device until an open end of the read head, which protrudes from the air bearing surface and is exposed, transfers heat to the read head and the write head, resulting in thermal expansion of the read head and the write head. 3. A method for processing a magnetic head, the magnetic head comprising a substrate and a thin-film magnetic head formed at an end of the substrate, the thin-film magnetic head comprising a read/write part and a bonding pad part proximate to the read/write part, the read/write part is in the form of a protruding part and is arranged on an air bearing surface opposite to a storage medium, and the read/write part has a write head for writing information in the storage medium and a read head for reading information from the storage medium; the bonding pad part comprises a welding contact point formed on an end surface of the thin-film magnetic head, wherein the method for processing the magnetic head comprises: irradiating at a fixed point proximate to the read/write part with a laser irradiation device until the read head and the write head are thermally expanded to produce target expansion; orientating air bearing surfaces of a plurality of magnetic heads forming a magnetic strip toward a lapping surface of a lapping device after laser irradiation, holding the air bearing surfaces in place, lapping with the lapping device until the air bearing surfaces are coplanar, so that the heights of the read head and the write head of each of the plurality of magnetic heads meet their respective target values; and disassembling the magnetic strip to obtain a lapped magnetic head; wherein the step of irradiating at the fixed point proximate to the read/write part with the laser irradiation device until the read head and the write head are thermally expanded comprises: irradiating the air bearing surface proximal to the read/write part with the laser irradiation device until an open end of the write head, which protrudes from the air bearing surface and is exposed, transfers heat to the read head and the write head, resulting in thermal expansion of the read head and the write head.
including at least one magnetic thin film · CPC title
Batch fabrication, i.e. producing a plurality of head structures in one batch · CPC title
Fixed mounting {or arrangements, e.g. one head per track} · CPC title
Thermally assisted recording using an auxiliary energy source for heating the recording layer locally to assist the magnetization reversal · CPC title
Working or finishing the interfacing surface of heads, e.g. lapping of heads · CPC title
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