Method and system for drilling ceramic

Patent metadata

Field	Value
Publication number	US-12103136-B2
Application number	US-202117406536-A
Country	US
Kind code	B2
Filing date	Aug 19, 2021
Priority date	Aug 19, 2021
Publication date	Oct 1, 2024
Grant date	Oct 1, 2024

Abstract

A method of machining includes mounting a component in a drilling machine. The component has a target region where the hole is to be drilled. The component and a jet head are situated relative to each other in a drilling arrangement in which the target region is at a first position that is vertically equal to or vertically above a second position at which the jet head is located. A liquid stream is jetted from the jet head and contains either abrasive particles or a laser beam. The stream impinges the target region, and the abrasive particles or the laser beam cause removal of material from the component to form the hole. The liquid stream rebounds off of the component as back-splash. The drilling arrangement causes gravitational draining of the back-splash from the target region to reduce interference between the back-splash and the liquid stream.

First claim

What is claimed is:

1. A method of machining a hole in a component, the method comprising:
mounting the component in a drilling machine, the component having a target region at which the hole is to be drilled, and the component and a jet head being situated relative to each other in a drilling arrangement in which the target region is at a first position that is vertically equal to or vertically above a second position at which the jet head is located;
jetting a liquid stream from the jet head, the liquid stream containing either abrasive particles or a laser beam, the liquid stream impinging the target region, the abrasive particles or the laser beam causing removal of material from the component at the target region to form the hole in the component, the liquid stream rebounding off of the component as back-splash liquid, and the drilling arrangement causing gravitational draining of the back-splash liquid from the hole to reduce interference between the back-splash liquid in the hole and the liquid stream; and
providing a computerized 3-dimensional model of the hole that is to be drilled, dividing the model into a series of successive 2-dimensional layers, and relative to the component moving the jet head such that the liquid stream moves across the target region layer-by-layer of the series of successive 2-dimensional layers and such that the liquid stream moves across the target region in a series of spiral patterns layer-by-layer of the series of successive 2-dimensional layers such that the abrasive particles or the laser beam causes removal of the material layer-by-layer, wherein the spiral patterns alternate layer-by-layer between inside-out movement of the jet head and outside-in movement of the jet head.

2. The method as recited in claim 1 , wherein initial layers of the series of successive 2-dimensional layers successively decrease in area such that the hole includes a tapered section.

3. The method as recited in claim 2 , wherein after the initial layers, subsequent layers of the series of successive 2-dimensional layers are successively equal in area such that the hole includes a uniform section.

4. The method as recited in claim 1 , wherein the liquid stream is continuous through the series of spiral patterns.

5. The method as recited in claim 1 , wherein the first position is vertically above the second position.

6. A system for machining a hole in a component, the system comprising:
a drilling machine having a holder and a jet head, the holder operable to mount the component that has a target region at which the hole is to be drilled, the holder and the jet head situated or capable of being situated relative to each other in a drilling arrangement in which the target region is at a first position that is vertically equal to or vertically above a second position at which the jet head is located;
the drilling machine operable to jet a liquid stream from the jet head, the liquid stream containing either abrasive particles or a laser beam, the liquid stream to impinge the target region such that the abrasive particles or the laser beam causes removal of material from the component at the target region to form the hole in the component, where the liquid stream rebounds off of the component as back-splash liquid, and the drilling arrangement causes gravitational draining of the back-splash liquid from the hole to reduce interference between the back-splash liquid in the hole and the liquid stream; and
the drilling machine includes an electronic controller that is configured, relative to the component, to move the jet head such that the liquid stream moves across the target region, the electronic controller includes a computerized 3-dimensional model of the hole that is to be drilled, to divide the model into a series of successive 2-dimensional layers, and the controller is configured to move the jet head such that the liquid stream moves across the target region layer-by-layer of the series of successive 2-dimensional layers and such that the liquid stream moves across the target region in a series of spiral patterns layer-by-layer of the series of successive 2-dimensional layers such that the abrasive particles or the laser beam causes removal of the material layer-by-layer, and the controller is configured to alternate the spiral patterns layer-by-layer between inside-out movement of the jet head and outside-in movement of the jet head.

7. The system as recited in claim 6 , wherein initial layers of the series of successive 2-dimensional layers successively decrease in area such that the hole includes a tapered section.

8. The system as recited in claim 7 , wherein after the initial layers, subsequent layers of the series of successive 2-dimensional layers are successively equal in area such that the hole includes a uniform section.

9. The system as recited in claim 6 , wherein the controller is operable to continuously maintain the liquid stream throughout the series of spiral patterns.

10. The system as recited in claim 6 , wherein the first position is vertically above the second position.

Assignees

• Raytheon Tech Corp
• Rtx Corp

Inventors

• Wang Zhigang
• Croteau Paul F
• Srinivasan Gajawalli V
• Riehl John D
• Fernandez Robin H

Classifications

• B24C7/0007

  the abrasive material being fed in a liquid carrier · CPC title

• B23K26/0869

  Devices involving movement of the laser head in at least one axial direction · CPC title

• B23K26/0823

  Devices involving rotation of the workpiece · CPC title

• B23K37/0452

  Orientable fixtures (B23K37/0461 takes precedence) · CPC title

• B23K37/0229

  the guide member being situated alongside the workpiece · CPC title