Cable connector systems

US12100908B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12100908-B2
Application numberUS-202318096605-A
CountryUS
Kind codeB2
Filing dateJan 13, 2023
Priority dateOct 9, 2018
Publication dateSep 24, 2024
Grant dateSep 24, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.

First claim

Opening claim text (preview).

What is claimed is: 1. A front panel of a rack-mountable equipment comprising: a 1RU area of the front panel defined by an approximately 1.75 inches by approximately 19 inches area; a plurality of cable connectors each including eight shielded differential twin axial cables, each of the eight shielded differential twin axial cables including respective center cable conductors each having a gauge of 32 AWG to 36 AWG; and at least thirty-two panel I/O connectors positioned within the 1RU area of the front panel such that one-thousand and twenty-four 56-GHz NRZ capable differential signal pairs are provided in the 1RU area, wherein the plurality of cable connectors are each individually terminated with a corresponding one of the at least thirty-two panel I/O connectors, each of the thirty-two panel I/O connectors includes first, second, third, and fourth rows of electrical conductors, and each of the first, second, third, and fourth rows of electrical conductors includes eight differential signal pairs and a plurality of ground conductors arranged in a S-S-G configuration. 2. The front panel of claim 1 , further comprising a plurality of board connectors physically connected to a first die substrate surface of a die substrate, wherein respective ones of the plurality of cable connectors are connected to respective ones of the plurality of board connectors. 3. The front panel of claim 2 , wherein the plurality of board connectors includes twelve two-row board connectors positioned on the first die substrate surface of the die substrate; and at least two of the plurality of cable connectors are connected to a respective one of the twelve two-row board connectors such that at least one hundred and ninety-two of the one-thousand and twenty-four 56-GHz NRZ capable differential signal pairs are provided on the first die substrate surface. 4. The front panel of claim 3 , wherein the plurality of board connectors includes twelve two-row board connectors positioned on a second die substrate surface of the die substrate; and at least two of the plurality of cable connectors are connected to a respective one of the twelve two-row board connectors such that at least one hundred and ninety-two of the one thousand and twenty-four 56-GHz NRZ capable differential signal pairs are provided on the second die substrate surface. 5. The front panel of claim 2 , wherein the plurality of board connectors includes twelve four-row board connectors positioned on the first die substrate surface of the die substrate; and at least four of the plurality of cable connectors are connected to a respective one of the twelve four-row board connectors such that at least three hundred and eighty-four of the one-thousand and twenty-four 56-GHz NRZ capable differential signal pairs are provided on the first die substrate surface. 6. The front panel of claim 5 , wherein the plurality of board connectors includes twelve four-row board connectors positioned on a second die substrate surface of the die substrate; and at least four of the plurality of cable connectors are connected to a respective one of the twelve four-row board connectors such that at least three hundred and eighty-four of the one thousand and twenty-four 56-GHz NRZ capable differential signal pairs are provided on the second die substrate surface. 7. The front panel of claim 1 , wherein the front panel is capable of transporting at least 50 terabytes of data with a frequency domain crosstalk of −40 dB or better. 8. The front panel of claim 1 , wherein a first pitch between the first and the second rows of electrical conductors is different from a second pitch between the second and the third rows of electrical conductors. 9. The front panel of claim 1 , further comprising a magnetic absorbing material that is either electrically conductive or electrically non-conductive and that is located on and/or in at least one of the plurality of cable connectors. 10. The front panel of claim 1 , further comprising a plurality of board connectors attached to a die substrate, attached to an extension card attached to the die substrate, or attached to a host substrate, wherein the plurality of cable connectors is connected to a respective one of the plurality of board connectors. 11. The front panel of claim 1 , wherein differential far end crosstalk is between −30 dB and −100 dB through frequencies up to 40 GHz when transporting 56-GHz NRZ signals. 12. The front panel of claim 1 , wherein differential near end crosstalk is between −40 dB and −100 dB through frequencies up to 40 GHz when transporting 56-GHz NRZ signals. 13. The front panel of claim 2 , wherein dimensions of the die package substrate are N by N, where N is greater than or equal to 70 mm and N is less than or equal to 200 mm. 14. The front panel of claim 2 , wherein dimensions of the die package substrate are 85 mm by 85 mm, 90 mm by 90 mm, 95 mm by 95 mm, 100 mm by 100 mm, 105 mm by 105 mm, or 110 mm by 110 mm. 15. The front panel of claim 2 , further comprising a magnetic absorbing material that is either electrically conductive or electrically non-conductive and that is located on and/or in at least one of the plurality of board connectors. 16. The front panel of claim 2 , wherein at least one of the plurality of board connectors includes a housing; and a height of the housing is approximately 1.5 mm to approximately 7 mm. 17. The front panel of claim 2 , wherein at least one of the plurality of board connectors includes a housing; and a height of the housing is approximately 4 mm to approximately 7 mm. 18. The front panel of claim 2 , wherein the plurality of cable connectors includes first and second cable connectors; the first and the second cable connectors are vertically stacked on a corresponding one of the plurality of board connectors such that the first and the second cable connectors are immediately adjacent; and the first cable connector does not fully overlap the second cable connector. 19. The front panel of claim 2 , wherein the plurality of cable connectors includes first, second, and third cable connectors; the first, the second, and the third cable connectors are vertically stacked on a corresponding one of the plurality of board connectors such that the first and the second cable connectors are immediately adjacent and such that the second and the third cable connectors are immediately adjacent; and an overlap between the first cable connector and the second cable connector is larger than an overlap between the second cable connector and the third cable connector. 20. The front panel of claim 3 , wherein a mated stack height of one of the twelve two-row board connectors of the plurality of board connectors and the at least two of the plurality of cable connectors is greater than zero but less than approximately 5 mm.

Assignees

Inventors

Classifications

  • Dismountable connectors, i.e. comprising plugs · CPC title

  • with connections to the front board · CPC title

  • Means for preventing cross-talk · CPC title

  • for mounting on PCBs · CPC title

  • for holding or embracing several coupling parts, e.g. frames · CPC title

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Frequently asked questions

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What does patent US12100908B2 cover?
A cable connector system can include a board connector that attaches to a die package, a cable connector that attaches to the board connector, and a 1RU panel I/O connector attached to the cable connector.
Who is the assignee on this patent?
Samtec Inc
What technology area does this patent fall under?
Primary CPC classification H01R13/6587. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 24 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 7 related publications on this page (citations in our corpus or others sharing the same primary CPC).