Electronic device comprising plurality of antennas

US12100899B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12100899-B2
Application numberUS-202217943679-A
CountryUS
Kind codeB2
Filing dateSep 13, 2022
Priority dateMar 19, 2020
Publication dateSep 24, 2024
Grant dateSep 24, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

An electronic device including a plurality of antennas is provided. The electronic device includes a housing, a first antenna disposed in the housing, a second antenna disposed in the housing, and spaced apart from the first antenna, a printed circuit board disposed in the housing and a wireless communication circuit disposed on the PCB, and transmitting or receiving a RF signal of a frequency band through the first antenna and the second antenna, the first antenna includes a first dielectric substrate including a first surface and a second surface facing away from the first surface, a first conductive pattern disposed on the first surface, and operating as an antenna radiator for transmitting or receiving an RF signal of a first frequency band and a second conductive pattern disposed on the second surface, and operating as an antenna radiator for transmitting or receiving an RF signal of the first frequency band.

First claim

Opening claim text (preview).

What is claimed is: 1. An electronic device comprising: a housing; a first antenna disposed in the housing; a second antenna disposed in the housing, and spaced apart from the first antenna; a printed circuit board disposed in the housing; and a wireless communication circuit disposed on the printed circuit board, the wireless communication circuit configured to transmit or receive a radio frequency (RF) signal of a designated frequency band through the first antenna and the second antenna, wherein the first antenna comprises: a first dielectric substrate comprising a first surface and a second surface facing away from the first surface, a first conductive pattern disposed on the first surface, the first conductive pattern operating as an antenna radiator for transmitting or receiving an RF signal of a first frequency band, and a second conductive pattern disposed on the second surface, the second conductive pattern operating as an antenna radiator for transmitting or receiving an RF signal of the first frequency band, wherein the second antenna comprises: a second dielectric substrate comprising a third surface and a fourth surface facing away from the third surface, a third conductive pattern disposed on the third surface, the third conductive pattern operating as an antenna radiator for transmitting or receiving an RF signal of the first frequency band, and a fourth conductive pattern disposed on the fourth surface, the fourth conductive pattern operating as an antenna radiator for transmitting or receiving an RF signal of the first frequency band, wherein, when viewed from the first surface of the first antenna, the first conductive pattern and the second conductive pattern are perpendicular to each other, wherein, when viewed from the fourth surface of the second antenna, the third conductive pattern and the fourth conductive pattern are perpendicular to each other, and wherein the second surface of the first antenna and the third surface of the second antenna are disposed to face each other. 2. The electronic device of claim 1 , wherein the first dielectric substrate comprises: a first through hole penetrating at least one region of the first dielectric substrate; and a first via positioned in the first through hole, and electrically connected to the first conductive pattern disposed on the first surface of the first dielectric substrate. 3. The electronic device of claim 2 , further comprising: a first electrical connection member disposed on the second surface of the first dielectric substrate, wherein the first electrical connection member is electrically connected to the first via and the wireless communication circuit, and wherein the wireless communication circuit is configured to feed an RF signal of the first frequency band to the first conductive pattern through the first via and the first electrical connection member. 4. The electronic device of claim 3 , further comprising: a second electrical connection member disposed on the second surface of the first dielectric substrate, wherein the second electrical connection is electrically connected to the second conductive pattern and the wireless communication circuit, and wherein the wireless communication circuit is configured to feed an RF signal of the first frequency band to the second conductive pattern through the second electrical connection member. 5. The electronic device of claim 1 , wherein the second dielectric substrate comprises: a second through hole penetrating at least one region of the second dielectric substrate; and a second via positioned in the second through hole, and wherein the second via is electrically connected to the fourth conductive pattern disposed on the fourth surface of the second dielectric substrate. 6. The electronic device of claim 5 , further comprising: a third electrical connection member disposed on the third surface of the second dielectric substrate, wherein the third electrical connection member is electrically connected to the third conductive pattern and the wireless communication circuit, and wherein the wireless communication circuit is configured to feed an RF signal of the first frequency band to the third conductive pattern through the third electrical connection member. 7. The electronic device of claim 6 , further comprising: a fourth electrical connection member disposed on the third surface of the second dielectric substrate, wherein the fourth electrical connection member is electrically connected to the second via and the wireless communication circuit, and wherein the wireless communication circuit is configured to feed an RF signal of the first frequency band to the fourth conductive pattern through the second via and the fourth electrical connection member. 8. The electronic device of claim 1 , further comprising: a third antenna disposed in the housing, the third antenna electrically connected to the wireless communication circuit; and a fourth antenna disposed in the housing, the fourth antenna electrically connected to the wireless communication circuit, wherein the third antenna comprises: a third dielectric substrate comprising a fifth surface and a sixth surface facing away from the fifth surface, a fifth conductive pattern disposed on the fifth surface, the fifth conductive pattern operating as an antenna radiator transmitting or receiving an RF signal of a second frequency band, and a sixth conductive pattern disposed on the sixth surface, the sixth conductive pattern operating as an antenna radiator transmitting or receiving an RF signal of the second frequency band, and wherein the fourth antenna comprises: a fourth dielectric substrate comprising a seventh surface facing the sixth surface of the third dielectric substrate and an eighth surface facing away from the seventh surface, a seventh conductive pattern disposed on the seventh surface, the seventh conductive pattern operating as an antenna radiator of the second frequency band, and an eighth conductive pattern disposed on the eighth surface, the eighth conductive pattern operating as an antenna radiator of the second frequency band. 9. The electronic device of claim 8 , wherein, when viewed from the fifth surface of the third antenna, the fifth conductive pattern and the sixth conductive pattern are perpendicular to each other, and wherein when viewed from the eighth surface of the fourth antenna, the seventh conductive pattern and the sixth conductive pattern are perpendicular to each other. 10. The electronic device of claim 8 , wherein the first antenna, the second antenna, the third antenna and the fourth antenna are radially disposed based on a virtual center of the housing. 11. The electronic device of claim 8 , further comprising: a fifth antenna disposed in the housing, the fifth antenna electrically connected to the wireless communication circuit; and a sixth antenna disposed in the housing, the sixth antenna electrically connected to the wireless communication circuit, wherein the fifth antenna comprises: a fifth dielectric substrate comprising a ninth surface and a tenth surface facing away from the ninth surface, a ninth conductive pattern disposed on the ninth surface, the ninth conductive pattern operating as an antenna radiator transmitting or receiving an RF signal of a third frequency band, and a tenth conductive pattern disposed on the tenth surface, the tenth conductive pattern operating as an antenna radiator transmitting or receiving an RF signal of the third frequency band, and wherein the sixth antenna comprises: a sixth dielectric substrate comprising an eleventh surface facing the tenth surface o

Assignees

Inventors

Classifications

  • MIMO systems · CPC title

  • Microstrip dipole antennas (patch antenna H01Q9/0407) · CPC title

  • used in Bluetooth® or Wi-Fi® devices of Wireless Local Area Networks [WLAN] (H01Q1/241 takes precedence; WLAN in general H04W) · CPC title

  • with built-in antennas · CPC title

  • Combinations of antenna units polarised in different directions for transmitting or receiving circularly and elliptically polarised waves or waves linearly polarised in any direction {(circularly polarised patch antennas H01Q9/0428; circularly polarised horns H01Q13/0241; cross-polarised horns H01Q13/0258; polarisation converters H01Q15/242; cross-polarised rear feeds H01Q19/136; crossed polarisation dual antenna H01Q25/001)} · CPC title

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What does patent US12100899B2 cover?
An electronic device including a plurality of antennas is provided. The electronic device includes a housing, a first antenna disposed in the housing, a second antenna disposed in the housing, and spaced apart from the first antenna, a printed circuit board disposed in the housing and a wireless communication circuit disposed on the PCB, and transmitting or receiving a RF signal of a frequency …
Who is the assignee on this patent?
Samsung Electronics Co Ltd
What technology area does this patent fall under?
Primary CPC classification H01Q21/205. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 24 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 9 related publications on this page (citations in our corpus or others sharing the same primary CPC).