Near-infrared sensor cover
US-2021096221-A1 · Apr 1, 2021 · US
Electromagnetic wave sensor cover
US12098999B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12098999-B2 |
| Application number | US-202217677486-A |
| Country | US |
| Kind code | B2 |
| Filing date | Feb 22, 2022 |
| Priority date | Feb 24, 2021 |
| Publication date | Sep 24, 2024 |
| Grant date | Sep 24, 2024 |
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- Title
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- Abstract
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Abstract
Official abstract text for this publication.
An electromagnetic wave sensor cover, applied to an electromagnetic wave sensor including a transmission unit and a reception unit, includes a cover main body portion that covers the transmission unit and the reception unit. The cover main body portion includes: a base material formed of a resin material and having a transmission property of an electromagnetic wave from the transmission unit; an undercoat layer formed on a rear surface of the base material and having the transmission property of the electromagnetic wave from the transmission unit; a heater portion that is formed of copper in a band shape on a rear surface of the undercoat layer, is configured to generate heat by being energized, and adheres to the base material via the undercoat layer; and a SiO 2 coating film having the transmission property of the electromagnetic wave from the transmission unit and covering the heater portion.
First claim
Opening claim text (preview).
What is claimed is: 1. An electromagnetic wave sensor cover, applied to an electromagnetic wave sensor including a transmission unit configured to transmit an electromagnetic wave and a reception unit configured to receive the electromagnetic wave, the electromagnetic wave sensor cover comprising a cover main body portion that covers the transmission unit and the reception unit from a front side in a transmission direction of the electromagnetic wave from the transmission unit, wherein the cover main body portion includes a base material formed of a resin material and having a transmission property of the electromagnetic wave from the transmission unit, an undercoat layer formed on a rear surface of the base material in the transmission direction and having the transmission property of the electromagnetic wave from the transmission unit, a heater portion that is formed of copper in a band shape on a rear surface of the undercoat layer in the transmission direction, is configured to generate heat by being energized, and adheres to the base material via the undercoat layer, and a SiO 2 coating film having the transmission property of the electromagnetic wave from the transmission unit and covering the heater portion, wherein a reflection suppression layer that prevents reflection of the electromagnetic wave transmitted from the transmission unit is formed behind the SiO 2 coating film in the transmission direction. 2. The electromagnetic wave sensor cover according to claim 1 , wherein the SiO 2 coating film covers, in addition to the heater portion, a region of the undercoat layer in which the heater portion is not formed from a rear side in the transmission direction. 3. The electromagnetic wave sensor cover according to claim 1 , wherein a protective film having the transmission property of the electromagnetic wave from the transmission unit that protects and insulates the heater portion is formed of a resin material between the SiO 2 coating film and the reflection suppression layer.
Assignees
Inventors
Classifications
- G01S7/4813Primary
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Frequently asked questions
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- What does patent US12098999B2 cover?
- An electromagnetic wave sensor cover, applied to an electromagnetic wave sensor including a transmission unit and a reception unit, includes a cover main body portion that covers the transmission unit and the reception unit. The cover main body portion includes: a base material formed of a resin material and having a transmission property of an electromagnetic wave from the transmission unit; a…
- Who is the assignee on this patent?
- Toyoda Gosei Kk
- What technology area does this patent fall under?
- Primary CPC classification G01S7/4813. Mapped technology areas include Physics.
- When was this patent published?
- Publication date Tue Sep 24 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 3 related publications on this page (citations in our corpus or others sharing the same primary CPC).