Temperature sensor assembly

US12098963B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12098963-B2
Application numberUS-202017075085-A
CountryUS
Kind codeB2
Filing dateOct 20, 2020
Priority dateDec 4, 2019
Publication dateSep 24, 2024
Grant dateSep 24, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A temperature sensor assembly including a carrier part having a receptacle for a temperature pin, a sensor element for measuring a temperature, and a pushing element pushing the sensor element into the receptacle.

First claim

Opening claim text (preview).

What is claimed is: 1. A temperature sensor assembly, comprising: a carrier part having a receptacle for a temperature pin; a sensor element for measuring a temperature of the temperature pin; and a pushing element pushing the sensor element into the receptacle and deflecting the sensor element against the temperature pin, the pushing element being a spring element. 2. The temperature sensor assembly of claim 1 , wherein the pushing element pushes the sensor element into the receptacle at a side of the receptacle. 3. The temperature sensor assembly of claim 1 , further comprising a recess in the carrier part at least partially accommodating the pushing element. 4. The temperature sensor assembly of claim 3 , wherein the recess is slot-shaped. 5. The temperature sensor assembly of claim 1 , wherein the spring element is a leaf spring. 6. The temperature sensor assembly of claim 5 , wherein the leaf spring has a plurality of curves with alternating curve directions. 7. The temperature sensor assembly of claim 6 , wherein the leaf spring is attached to the carrier part at a pair of end sections of the leaf spring. 8. The temperature sensor assembly of claim 1 , further comprising a connection section with a terminal, the connection section being attachable to the carrier part and the terminal connecting to a processing module. 9. The temperature sensor assembly of claim 8 , wherein the receptacle is at a first side of the temperature sensor assembly and the connection section is at a second side of the temperature sensor assembly opposite the first side. 10. The temperature sensor assembly of claim 8 , wherein the connection section is located in a housing part detachable from the carrier part. 11. The temperature sensor assembly of claim 10 , wherein the carrier part has a housing part receptacle at least partially receiving the housing part. 12. The temperature sensor assembly of claim 10 , wherein the housing part is fixed to an external element. 13. The temperature sensor assembly of claim 12 , wherein the external element is an element of an automobile. 14. A set for a temperature sensor assembly, comprising: a carrier part having a receptacle for a pin; a sensor element for measuring a temperature of the pin; and a pushing element pushing the sensor element into the receptacle and deflecting the sensor element against the pin, the pushing element being a spring element; and a housing part detachable from the carrier part, the housing part having a connection section with a terminal for connection to a processing module. 15. The set of claim 14 , wherein the housing part can be any of a plurality of different housing parts.

Assignees

Inventors

Classifications

  • G01K1/14Primary

    Supports; Fastening devices; Arrangements for mounting thermometers in particular locations · CPC title

  • G01K1/08Primary

    Protective devices, e.g. casings · CPC title

  • G01K7/16Primary

    using resistive elements · CPC title

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Frequently asked questions

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What does patent US12098963B2 cover?
A temperature sensor assembly including a carrier part having a receptacle for a temperature pin, a sensor element for measuring a temperature, and a pushing element pushing the sensor element into the receptacle.
Who is the assignee on this patent?
Te Connectivity Germany Gmbh, Te Connectivity India Private Ltd
What technology area does this patent fall under?
Primary CPC classification G01K1/14. Mapped technology areas include Physics.
When was this patent published?
Publication date Tue Sep 24 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).