Spherical silica powder
US-2023147757-A1 · May 11, 2023 · US
Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder
US12098290B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12098290-B2 |
| Application number | US-202117321827-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 17, 2021 |
| Priority date | Jun 2, 2020 |
| Publication date | Sep 24, 2024 |
| Grant date | Sep 24, 2024 |
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- Title
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Abstract
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The present invention is a low dielectric silica powder, which has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz. An object is to provide: a silica powder with an extremely small dielectric loss tangent; a resin composition containing the same; and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesion at the interface to resin.
First claim
Opening claim text (preview).
The invention claimed is: 1. A low dielectric silica powder, which has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz, wherein the low dielectric silica powder has, inside and on a surface thereof, 200 ppm or less of a metal and/or a metal oxide in terms of mass of each metal, the metal selected from aluminum, magnesium, and titanium, and 10 ppm or less of an alkali metal and an alkaline earth metal in terms of mass of each, wherein a hydroxy group (Si—OH) content of the low dielectric silica powder is from 135 ppm or more to 300 ppm or less in terms of mass, wherein the hydroxy group content is quantified by measuring the transmittance of a peak near 3680 cm −1 by infrared spectroscopic analysis, and wherein the hydroxy group is inner silanol. 2. The low dielectric silica powder according to claim 1 , wherein boron content is 1 ppm or less, phosphorus content is 1 ppm or less, and uranium and thorium contents are each 0.1 ppb or less. 3. A low dielectric silica powder-containing resin composition, being a mixture of the low dielectric silica powder according to claim 1 .
Assignees
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Classifications
Electric properties · CPC title
Compositional purity · CPC title
Micrometer sized, i.e. from 1-100 micrometer · CPC title
Submicrometer sized, i.e. from 0.1-1 micrometer · CPC title
obtained by SEM · CPC title
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- What does patent US12098290B2 cover?
- The present invention is a low dielectric silica powder, which has an average particle size of 0.1 to 30 μm and a dielectric loss tangent of 0.0005 or less at 10 GHz. An object is to provide: a silica powder with an extremely small dielectric loss tangent; a resin composition containing the same; and a method for manufacturing a silica powder with a low dielectric loss tangent and strong adhesi…
- Who is the assignee on this patent?
- Shinetsu Chemical Co
- What technology area does this patent fall under?
- Primary CPC classification C01B33/18. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Sep 24 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).