Thermal head and thermal printer

Patent metadata

Field	Value
Publication number	US-12097715-B2
Application number	US-202117907673-A
Country	US
Kind code	B2
Filing date	Mar 26, 2021
Priority date	Mar 31, 2020
Publication date	Sep 24, 2024
Grant date	Sep 24, 2024

Abstract

A thermal head includes a substrate, a bonding material, an electrically conductive member, and a gold electrode. The bonding material is located on the substrate and contains gold and tin. The electrically conductive member is located on the bonding material. The gold electrode is located on the substrate and electrically connected to the bonding material.

First claim

The invention claimed is:

1. A thermal head, comprising:
a substrate;
a bonding material located on the substrate and containing gold and tin;
an electrically conductive member located on the bonding material; and
a gold electrode located on the substrate and electrically connected to the bonding material, wherein
the substrate comprises a plurality of protruding portions facing the gold electrode and the bonding material, and
the bonding material comprises a recessed portion at a periphery of each of the plurality of protruding portions.

2. The thermal head according to claim 1 , further comprising a gap between the substrate and the gold electrode.

3. The thermal head according to claim 1 , wherein the bonding material comprises a first region having a higher content of tin than the gold electrode, and a second region having a higher content of gold than the first region.

4. The thermal head according to claim 3 , wherein the bonding material further comprises a third region located inside the first region, the third region having a higher content of gold than the first region.

5. The thermal head according to claim 3 , wherein the bonding material further comprises a fourth region located inside the second region, the fourth region having a higher content of tin than the second region.

6. The thermal head according to claim 3 , wherein the bonding material comprises a glass component inside the second region.

7. The thermal head according to claim 1 , wherein the electrically conductive member has a thickness greater than an interval between the substrate and the electrically conductive member.

8. The thermal head according to claim 1 , wherein the electrically conductive member comprises a first layer containing copper.

9. The thermal head according to claim 8 , wherein the electrically conductive member comprises a second layer located closer to the substrate than the first layer and containing nickel.

10. A thermal printer, comprising:
the thermal head according to claim 1 ;
a transport mechanism transporting a recording medium on a heat generating part located on the substrate; and
a platen roller pressing the recording medium onto the heat generating part.

11. A thermal head, comprising:
a substrate;
a bonding material located on the substrate and containing gold and tin;
an electrically conductive member located on the bonding material; and
a gold electrode located on the substrate and electrically connected to the bonding material, wherein
the substrate comprises a plurality of recessed portions facing the gold electrode and the bonding material, and
the bonding material comprises a protruding portion in each of the plurality of recessed portions.

12. The thermal head according to claim 11 , further comprising a gap between the substrate and the gold electrode.

13. The thermal head according to claim 11 , wherein
the bonding material comprises a first region having a higher content of tin than the gold electrode, and a second region having a higher content of gold than the first region.

14. The thermal head according to claim 13 , wherein the bonding material further comprises a third region located inside the first region, the third region having a higher content of gold than the first region.

15. The thermal head according to claim 13 , wherein the bonding material further comprises a fourth region located inside the second region, the fourth region having a higher content of tin than the second region.

16. The thermal head according to claim 13 , wherein the bonding material comprises a glass component inside the second region.

17. The thermal head according to claim 11 , wherein the electrically conductive member has a thickness greater than an interval between the substrate and the electrically conductive member.

18. The thermal head according to claim 11 , wherein the electrically conductive member comprises a first layer containing copper.

19. The thermal head according to claim 18 , wherein the electrically conductive member comprises a second layer located closer to the substrate than the first layer and containing nickel.

20. A thermal printer, comprising:
the thermal head according to claim 11 ;
a transport mechanism transporting a recording medium on a heat generating part located on the substrate; and
a platen roller pressing the recording medium onto the heat generating part.

Assignees

• Kyocera Corp

Inventors

• Kato Kenichi
• Miyamoto Makoto

Classifications

• B41J2/3357

  Surface type resistors · CPC title

• B41J2/3354

  characterised by geometry · CPC title

• B41J2/33535

  Substrates · CPC title

• B41J2/3353

  Protective layers · CPC title

• B41J2/33525

  Passivation layers · CPC title