Energy harvesting device for electronic devices
US-2018351066-A1 · Dec 6, 2018 · US
US12096693B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12096693-B2 |
| Application number | US-202217656664-A |
| Country | US |
| Kind code | B2 |
| Filing date | Mar 28, 2022 |
| Priority date | Mar 28, 2022 |
| Publication date | Sep 17, 2024 |
| Grant date | Sep 17, 2024 |
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Described are systems for electronic heatsink safety including a system comprising a thermoelectric generator integrated into a heatsink, where the thermoelectric generator includes a first portion exposed to ambient temperature and a second portion contacting the heatsink, and where the thermoelectric generator is configured to produce a current based on a temperature difference between the first portion and the second portion. The system further comprises a first Light Emitting Diode (LED) electrically connected to the thermoelectric generator, where the current is configured to activate the first LED.
Opening claim text (preview).
What is claimed is: 1. A system comprising: a heatsink disposed on a Computer Processing Unit (CPU), and the CPU disposed on a Printed Circuit Board (PCB), wherein the heatsink includes at least one heat pipe integrated into a body of the heatsink; a thermoelectric generator integrated into the heatsink, wherein the thermoelectric generator includes a first portion exposed to ambient temperature and a second portion contacting the at least one heat pipe, wherein the thermoelectric generator is configured to produce a current based on a temperature difference between the first portion and the second portion; a first Light Emitting Diode (LED), wherein the first LED is configured to operate when the current satisfies a first current threshold; and a second LED, wherein the second LED is configured to operate when the current satisfies a second current threshold. 2. The system of claim 1 , wherein the first LED is configured to deactivate in response to the current falling below the first current threshold, and wherein the second LED is configured to deactivate in response to the current falling below the second current threshold. 3. The system of claim 2 , wherein the first LED and the second LED provide a safety-related indication of surface temperature of the heatsink. 4. The system of claim 1 , further comprising: an electronic lock, wherein the current is configured to activate the electronic lock. 5. The system of claim 4 , further comprising: an access panel providing access to the CPU, the PCB, and the heatsink, wherein the electronic lock is disposed on the access panel. 6. The system of claim 5 , wherein, when activated, the electronic lock is configured to prevent access to the CPU, the PCB, and the heatsink by locking the access panel. 7. The system of claim 1 , wherein the thermoelectric generator comprises a first material adjacent to a second material and between the first portion and the second portion. 8. The system of claim 7 , wherein the first material and the second material have different Seebeck coefficients. 9. The system of claim 7 , wherein the first material is a p-doped semiconductor, and wherein the second material is an n-doped semiconductor. 10. A system comprising: a thermoelectric generator integrated into a heatsink, wherein the thermoelectric generator includes a first portion exposed to ambient temperature and a second portion contacting the heatsink, wherein the thermoelectric generator is configured to produce a current based on a temperature difference between the first portion and the second portion; a first Light Emitting Diode (LED), wherein the first LED is configured to operate when the current satisfies a first current threshold; and a second LED, wherein the second LED is configured to operate when the current satisfies a second current threshold. 11. The system of claim 10 , wherein the first LED is configured to deactivate in response to the current falling below the first current threshold, and wherein the second LED is configured to deactivate in response to the current falling below the second current threshold. 12. The system of claim 11 , wherein the first LED and the second LED provide a safety-related indication of surface temperature of the heatsink. 13. The system of claim 10 , wherein the thermoelectric generator comprises a first material adjacent to a second material and between the first portion and the second portion. 14. The system of claim 13 , wherein the first material and the second material have different Seebeck coefficients. 15. The system of claim 13 , wherein the first material is a p-doped semiconductor, and wherein the second material is an n-doped semiconductor. 16. A system comprising: a thermoelectric generator integrated into a heatsink, wherein the thermoelectric generator includes a first portion exposed to ambient temperature and a second portion contacting the heatsink, wherein the thermoelectric generator is configured to produce a current based on a temperature difference between the first portion and the second portion; and an electronic lock electrically connected to the thermoelectric generator, wherein the current is configured to activate the electronic lock. 17. The system of claim 16 , further comprising: an access panel providing access to the heatsink, wherein the electronic lock is disposed on the access panel, and wherein, when activated, the electronic lock is configured to prevent access to the heatsink by locking the access panel. 18. The system of claim 16 , wherein the thermoelectric generator comprises a first material adjacent to a second material and between the first portion and the second portion, and wherein the first material and the second material have different Seebeck coefficients.
for cooling by change of state · CPC title
Light emitting diode [LED] · CPC title
characterised by the heat-exchanging means at the junction · CPC title
using visible light sources · CPC title
Current to lock only, i.e. "fail-safe" · CPC title
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