Three dimensional antenna array module

Patent metadata

Field	Value
Publication number	US-12095165-B2
Application number	US-202217943300-A
Country	US
Kind code	B2
Filing date	Sep 13, 2022
Priority date	May 30, 2017
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

An antenna module that includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, a plurality of packaged circuitry on a second surface of the antenna substrate, and a plurality of supporting balls mounted on the second surface of the antenna substrate. The plurality of packaged circuitry includes a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate. Each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, where at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs.

First claim

What is claimed is:

1. An antenna module, comprising:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate;
a plurality of packaged circuitry on a second surface of the antenna substrate, wherein the plurality of packaged circuitry comprises a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate; and
a plurality of supporting balls mounted on the second surface of the antenna substrate,
wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs, wherein at least a relief cut is provided between one of the plurality of projections and one of the plurality of supporting legs, and wherein the plurality of supporting legs are configured to carry RF signals between a top plate of the raised antenna patch and the plurality of packaged circuitry.

2. The antenna module according to claim 1 , wherein each of the plurality of 3-D antenna cells is a 3-D metal stamped antenna configured for millimeter wave wireless communication.

3. The antenna module according to claim 1 , wherein a height of each of the plurality of 3-D antenna cells is one-fourth of wavelength at an operational frequency.

4. The antenna module according to claim 1 , wherein a width of each of the plurality of 3-D antenna cells is half of wavelength at an operational frequency.

5. The antenna module according to claim 1 , wherein each of the plurality of 3-D antenna cells comprises the raised antenna patch with air dielectric.

6. The antenna module according to claim 1 , wherein the raised antenna patch comprises four projections having outwardly increasing widths.

7. The antenna module according to claim 1 , wherein each of the plurality of supporting legs is between a pair of adjacent projections of the plurality of projections associated with the raised antenna patch of each of the plurality of 3-D antenna cells.

8. The antenna module according to claim 1 , wherein the plurality of packaged circuitry is further mounted on a printed circuit board (PCB) based on a plurality of holes in the PCB.

9. The antenna module according to claim 8 , wherein the plurality of supporting balls is mounted on the second surface of the antenna substrate such that a uniform space and support is maintained between the antenna module and the PCB when the antenna module is mounted on the PCB.

10. The antenna module according to claim 8 , wherein the plurality of holes in the PCB is embedded with a heat sink.

11. The antenna module according to claim 10 , wherein a top PCB surface of the PCB and a plurality of portions of the heat sink within the plurality of holes form a mounting surface on which the antenna module is mounted on the PCB.

12. The antenna module according to claim 1 , wherein each supporting leg of the plurality of supporting legs is between a pair of adjacent projections of the plurality of projections associated with the raised antenna patch and each supporting leg of the plurality of supporting legs is directly connected with the top plate of the raised antenna patch of each of the plurality of 3-D antenna cells.

13. The antenna module according to claim 1 , wherein the plurality of packaged circuitry comprises a first radio-frequency (RF) chip, a second RF chip, a third RF chip, and a fourth RF chip, and at least one mixer chip that are mounted on the second surface of the antenna substrate.

14. The antenna module according to claim 13 , wherein a specified count of 3-D antenna cells from the plurality of 3-D antenna cells is connected with each of the first RF chip, the second RF chip, the third RF chip, and the fourth RF chip.

15. The antenna module according to claim 13 , wherein at least one of the first RF chip, the second RF chip, the third RF chip, or the fourth RF chip is connected with the mixer chip.

16. The antenna module according to claim 1 , wherein the antenna module is a 3-D antenna module configured to integrate the plurality of 3-D antenna cells and the plurality of RF chips in a single package implementation.

17. The antenna module according to claim 1 , further comprising an electromagnetic transmission line, wherein the plurality of packaged circuitry is connected through the electromagnetic transmission line with the plurality of 3-D antenna cells.

18. An antenna module, comprising:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells on a first surface of the antenna substrate, wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch with a plurality of projections and a plurality of supporting legs;
a plurality of packaged circuitry on a second surface of the antenna substrate, wherein the plurality of packaged circuitry comprises a plurality of radio-frequency (RF) chips on the second surface of the antenna substrate, and wherein the plurality of packaged circuitry is further mounted on a printed circuit board (PCB) based on a plurality of holes in the PCB, wherein the plurality of supporting legs are configured to carry RF signals between a top plate of the raised antenna patch and the plurality of packaged circuitry; and
a plurality of supporting balls are mounted on the second surface of the antenna substrate such that a uniform space and support is maintained between the antenna module and the PCB when the antenna module is mounted on the PCB,
wherein the antenna module is a 3-D antenna module configured to integrate the plurality of 3-D antenna cells and the plurality of RF chips in a single package implementation.

19. The antenna module according to claim 18 , further comprising an electromagnetic transmission line, wherein the plurality of packaged circuitry is connected through the electromagnetic transmission line with the plurality of 3-D antenna cells.

Assignees

• Movandi Corp

Inventors

• Yoon Seunghwan
• Wang Zhihui
• De Flaviis Franco
• Besoli Alfred Grau
• Sridharan Kartik
• Rofougaran Ahmadreza
• Boers Michael
• Gharavi Sam
• Shin Donghyup
• Shirinfar Farid
• Wu Stephen
• Rofougaran Maryam

Classifications

• H01Q9/045

  with particular feeding means (for circular polarisation H01Q9/0428) · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q21/0025

  Modular arrays · CPC title

• H01Q21/065 Primary

  Patch antenna array · CPC title