Three dimensional antenna array module

Patent metadata

Field	Value
Publication number	US-12095164-B2
Application number	US-202217898706-A
Country	US
Kind code	B2
Filing date	Aug 30, 2022
Priority date	May 30, 2017
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

An apparatus includes a plurality of antenna modules and a printed circuit board (PCB) having a plurality of holes embedded with a heat sink. Each antenna module includes an antenna substrate, a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate, and a plurality of packaged circuitry mounted on a second surface of the antenna substrate. The plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells. Each of the plurality of antenna modules is mounted on a plurality of portions of the heat sink such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the plurality of portions of the heat sink embedded within the plurality of holes.

First claim

What is claimed is:

1. An apparatus, comprising:
a plurality of antenna modules; and
a printed circuit board (PCB) having a plurality of holes embedded with a heat sink,
wherein each antenna module of the plurality of antenna modules comprises:
an antenna substrate;
a plurality of three-dimensional (3-D) antenna cells mounted on a first surface of the antenna substrate; and
a plurality of packaged circuitry mounted on a second surface of the antenna substrate, wherein the plurality of packaged circuitry are electrically connected with the plurality of 3-D antenna cells,
wherein each antenna module of the plurality of antenna modules is mounted within a respective hole of the plurality of holes such that a corresponding packaged circuitry of the plurality of packaged circuitry is in a direct contact with the heat sink.

2. The apparatus according to claim 1 , wherein each antenna module of the plurality of antenna modules further comprises a plurality of supporting balls mounted on the second surface of the antenna substrate.

3. The apparatus according to claim 2 , wherein the plurality of supporting balls are mounted on the second surface of the antenna substrate such that a uniform space and support is maintained between each antenna module of the plurality of antenna modules and the printed circuit board (PCB) when each antenna module is mounted on the PCB.

4. The apparatus according to claim 1 , wherein each of the plurality of 3-D antenna cells is a 3-D metal stamped antenna configured for millimeter wave (mmWave) wireless communication.

5. The apparatus according to claim 1 , wherein a height of each of the plurality of 3-D antenna cells is one-fourth of wavelength at an operational frequency, and wherein a width of each of the plurality of 3-D antenna cells is half of the wavelength at the operational frequency.

6. The apparatus according to claim 1 , wherein a distance between two 3-D antenna cells of the plurality of 3-D antenna cells is half of wavelength at an operational millimeter wave (mmWave) frequency.

7. The apparatus according to claim 1 , wherein each of the plurality of 3-D antenna cells comprises a raised antenna patch with air dielectric.

8. The apparatus according to claim 7 , wherein the raised antenna patch comprises a top plate over a ground plane in each of the plurality of 3-D antenna cells.

9. The apparatus according to claim 7 , wherein the raised antenna patch comprises four projections having outwardly increasing widths.

10. The apparatus according to claim 7 , wherein the raised antenna patch comprises a top plate at a height greater than a ground plane in each of the plurality of 3-D antenna cells.

11. The apparatus according to claim 1 , wherein each of the plurality of 3-D antenna cells further comprises four supporting legs.

12. The apparatus according to claim 11 , wherein each of the four supporting legs is located between a pair of adjacent projections of four projections associated with a raised antenna patch of each of the plurality of 3-D antenna cells.

13. The apparatus according to claim 1 , further comprises a first supporting ball on a first side of a packaged circuitry of the plurality of packaged circuitry and a second supporting ball on a second side of the packaged circuitry on the second surface of the antenna substrate.

14. The apparatus according to claim 1 , wherein the plurality of packaged circuitry comprises a plurality of radio-frequency (RF) chips and at least one mixer chip that are mounted on a second surface of the antenna substrate.

15. The apparatus according to claim 14 , wherein the plurality of packaged circuitry is further mounted on a printed circuit board (PCB) based on the plurality of holes in the PCB.

16. The apparatus according to claim 1 , wherein the plurality of packaged circuitry of each antenna module comprises a first radio-frequency (RF) chip, a second RF chip, a third RF chip, and a fourth RF chip, and at least one mixer chip that are mounted on a second surface of the antenna substrate.

17. The apparatus according to claim 16 , wherein a specified count of 3-D antenna cells from the plurality of 3-D antenna cells is connected with each of the first RF chip, the second RF chip, the third RF chip, and the fourth RF chip.

18. The apparatus according to claim 16 , wherein at least one of the first RF chip, the second RF chip, the third RF chip, or the fourth RF chip is connected with the mixer chip.

19. The apparatus according to claim 1 , wherein each antenna module of the plurality of antenna modules is mounted on the plurality of holes via a corresponding packaged circuitry of the plurality of packaged circuitry.

20. The apparatus according to claim 1 , wherein the first surface of the PCB and a plurality of portions of the heat sink embedded within the plurality of holes forms a mounting surface of the PCB on which the plurality of antenna modules are mounted.

Assignees

• Movandi Corp

Inventors

• Yoon Seunghwan
• De Flaviis Franco
• Besoli Alfred Grau
• Sridharan Kartik
• Rofougaran Ahmadreza
• Boers Michael
• Gharavi Sam
• Shin Donghyup
• Shirinfar Farid
• Wu Stephen
• Rofougaran Maryam

Classifications

• H01Q9/045

  with particular feeding means (for circular polarisation H01Q9/0428) · CPC title

• H01Q1/2283

  mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package · CPC title

• H01Q21/0025

  Modular arrays · CPC title

• H01Q21/065 Primary

  Patch antenna array · CPC title