Display device and method of fabricating the same

Patent metadata

Field	Value
Publication number	US-12094865-B2
Application number	US-202217841247-A
Country	US
Kind code	B2
Filing date	Jun 15, 2022
Priority date	Aug 9, 2018
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A display device and a method for fabricating the same. The display device includes a substrate including a circuit layer and a first pad unit; an auxiliary substrate disposed below the substrate and comprising a driving circuit and a second pad unit; a light-emitting unit disposed on the circuit layer; and a connection electrode in contact with a side surface of the substrate and electrically connecting the first pad unit with the second pad unit. The method includes forming a circuit layer and a first pad unit on a first surface of a substrate; forming a driving circuit and a second pad unit on a fourth surface of an auxiliary substrate; and attaching a second surface of the substrate opposite the first surface to a third surface of the auxiliary substrate opposite the fourth surface.

First claim

What is claimed is:

1. A method of fabricating a display device, the method comprising:
forming both a circuit layer and a first pad unit on a first surface of a substrate the substrate having a display area and a non-display area outside the display area;
forming both a driving circuit and a second pad unit on a fourth surface of an auxiliary substrate; and
attaching a second surface the substrate opposite the first surface to a third surface of the auxiliary substrate opposite the fourth surface, wherein a distal side surface connects the first surface to the second surface and a distal side surface connects the third surface to the fourth surface; and
forming a connection electrode that electrically connects a pad of the first pad unit with a pad of the second pad unit, the connection electrode being in direct contact with both of the distal side surface of the substrate and the distal side surface of the auxiliary substrate, wherein
the second pad unit is disposed in the non-display area between the auxiliary substrate and a portion of the connection electrode in a direction perpendicular to the first surface of a substrate.

2. The method of claim 1 , further comprising forming a plurality of connection electrodes, each connection electrode electrically connecting a respective pad of both the first pad unit and the second pad unit and being in direct contact with both of the side surface of the substrate and the side surface of the auxiliary substrate.

3. The method of claim 2 , further comprising forming a light-emitting unit on the circuit layer.

4. The method of claim 3 , wherein the auxiliary substrate is made of a glass material.

5. The method of claim 4 , wherein the light-emitting unit comprises a light-emitting diode.

6. The method of claim 5 , wherein
the light-emitting diode comprises a first semiconductor layer, a second semiconductor layer, and an intermediate layer between the first semiconductor layer and the second semiconductor layer; and
a first electrode pad is formed on the first semiconductor layer and a second electrode pad is formed on the second semiconductor layer.

7. The method of claim 2 , wherein each connection electrode of the plurality of connection electrodes electrically connects the first pad unit with the second pad unit.

8. A method of fabricating a display device, the method comprising:
forming a circuit layer and a first pad unit on a first surface of a substrate the substrate having a display area and a non-display area outside the display area;
forming a light-emitting unit on the circuit layer, wherein the light-emitting unit comprises a light-emitting diode;
forming a driving circuit and a second pad unit on a fourth surface of an auxiliary substrate; and
attaching a second surface the substrate opposite the first surface to a third surface of the auxiliary substrate opposite the fourth surface, wherein a distal side surface connects the first surface to the second surface and a distal side surface connects the third surface to the fourth surface; and
forming a connection electrode that electrically connects a pad of the first pad unit with a pad of the second pad unit, the first connection electrode traversing across an entirety of both of the distal side surface of the substrate and the distal side surface of the auxiliary substrate as seen in side view, wherein
the second pad unit is disposed in the non-display area between the auxiliary substrate and a portion of the connection electrode in a direction perpendicular to the first surface of a substrate.

9. The method of claim 8 , wherein the connection electrode bends around an edge connecting the first surface and the side surface connecting the first surface to the second surface.

10. The method of claim 9 , wherein the connection electrode also bends around an edge connecting the fourth surface and the side surface connecting the third surface to the fourth surface.

11. The method of claim 8 , further comprising forming a plurality of connection electrodes, each connection electrode electrically connecting a respective pad of both the first pad unit and the second pad unit and traversing across an entirety of both of the side surface of the substrate and the side surface of the auxiliary substrate as seen in side view.

Assignees

• Samsung Display Co Ltd

Inventors

• Lee Seung Chan
• Kim Gun Hee
• Park Sang Ho
• Yoon Ju Won
• Jeon Joo Hee
• Kim Hyun Joon

Classifications

• H10W90/00 Primary

  Package configurations · CPC title

• H10K59/131 Primary

  Interconnections, e.g. wiring lines or terminals · CPC title

• H10H20/83

  Electrodes · CPC title

• H10H29/142 Primary

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10H20/857

  Interconnections, e.g. lead-frames, bond wires or solder balls · CPC title