Exterior vehicle-attached device removal

US12092440B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12092440-B2
Application numberUS-202117483775-A
CountryUS
Kind codeB2
Filing dateSep 23, 2021
Priority dateSep 23, 2020
Publication dateSep 17, 2024
Grant dateSep 17, 2024

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  1. Title

    What the patent document calls the invention.

  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Various methods and devices have been invented to remove IEDs and tracking devices from substrates such as the body of vehicles. For example, highly localized heat can be used to denature strong magnets or weaken applied adhesives.

First claim

Opening claim text (preview).

What is claimed: 1. A method of removing an IED from a substrate, wherein the IED is bonded to the substrate by at least one rare earth ferromagnet, comprising: applying a conductive portion of a spot heater in direct contact with the at least one rare earth ferromagnet; applying heat from the spot heater to the at least one rare earth ferromagnet; wherein the heat from the spot heater is sufficient to cause the magnetic strength of the at least one rare earth ferromagnet to be reduced by at least 20%; and removing the IED from the substrate without destroying the IED. 2. A method of removing an IED from a substrate, comprising: applying heat from a spot heater to an adhesive bond between the IED and the substrate; wherein a conductive portion of the spot heater is in direct contact with the adhesive; wherein the bond is created, at least in part, by an adhesive layer between the IED and the substrate; wherein the heat reduces the viscosity of the adhesive, or decreases adhesion of the adhesive, or both to weaken the adhesive bond between the IED and the substrate; and removing the IED from the substrate without destroying the IED. 3. The method of claim 2 further comprising: applying an expanding gas between the IED and substrate to force apart the IED and the substrate. 4. The method of claim 3 wherein the gas is contained in a balloon. 5. The method of claim 2 further comprising injecting a hot fluid directly onto or into the adhesive to disrupt the bond between the IED and the substrate. 6. The method of claim 1 wherein the spot heater comprises materials that can withstand power densities in a range of 50,000 to 200,000 W/in, or 100,000 to 150,000 W/in, or about 12,000 W/in. 7. The method of claim 1 wherein the spot heater comprises conductive materials with thermal conductivity less than about 50 W/mK or of sufficiently low thermal mass. 8. The method of claim 7 wherein the spot heater further comprises the conductive materials on a thermally insulating substrate. 9. The method of claim 1 wherein the spot heater comprises carbon nanotubes. 10. The method of claim 2 wherein the spot heater comprises materials that can withstand power densities in a range of 50,000 to 200,000 W/in, or 100,000 to 150,000 W/in, or about 12,000 W/in. 11. The method of claim 2 wherein the spot heater comprises conductive materials with thermal conductivity less than about 50 W/mK or of sufficiently low thermal mass. 12. The method of claim 11 wherein the spot heater further comprises the conductive materials on a thermally insulating substrate. 13. The method of claim 2 wherein the spot heater comprises carbon nanotubes. 14. The method of claim 2 wherein heat from the spot heater reduces viscosity of the adhesive to weaken the adhesive bond between the IED and the substrate. 15. The method of claim 2 wherein heat from the spot heater decreases adhesion of the adhesive to weaken the adhesive bond between the IED and the substrate. 16. The method of claim 2 wherein heat from the spot heater reduces viscosity of the adhesive and reduces adhesion of the adhesive to weaken the adhesive bond between the IED and the substrate. 17. The method of claim 2 wherein a conductive portion of the spot heater is in direct contact with the adhesive layer. 18. The method of claim 3 wherein the expanding gas is a result of decomposition of H 2 O 2 to H 2 O and O 2 . 19. The method of claim 3 wherein heat from a spot heater initiates a chemical reaction to form the expanding gas via a chemical reaction.

Assignees

Inventors

Classifications

  • Defence installations; Defence devices (constructional aspects see Section E, e.g. {air-raid shelters} E04H9/04; {protective arrangements for buildings E04B1/92; extinguishing or preventing the spread of fire from, incendiary bombs A62C3/06; dynamic armour F41H5/007; ballistically deployed systems for restraining persons or animals F41H13/0006; electronic countermeasures G01S}) · CPC title

  • F42B33/06Primary

    Dismantling fuzes, cartridges, projectiles, missiles, rockets or bombs ({F42B33/004 and} F42B33/04 take precedence; {elimination of undesirable components of explosives C06B21/0091}) · CPC title

  • F41H11/12Primary

    Means for clearing land minefields; Systems specially adapted for detection of landmines · CPC title

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Frequently asked questions

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What does patent US12092440B2 cover?
Various methods and devices have been invented to remove IEDs and tracking devices from substrates such as the body of vehicles. For example, highly localized heat can be used to denature strong magnets or weaken applied adhesives.
Who is the assignee on this patent?
Battelle Memorial Institute
What technology area does this patent fall under?
Primary CPC classification F42B33/06. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue Sep 17 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).