Diffusion bonding heat exchanger

Patent metadata

Field	Value
Publication number	US-12092401-B2
Application number	US-201917295928-A
Country	US
Kind code	B2
Filing date	Nov 20, 2019
Priority date	Nov 22, 2018
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

An object of the present invention is to provide a diffusion bonding heat exchanger with which it is possible to reduce a thermal stress that is generated due to heat exchange between fluids significantly different from each other in temperature even in a case where the number of stacked heat transfer plates is made large. A diffusion bonding heat exchanger (100) includes a core (1) in which a plurality of heat transfer plates (HP) are stacked and diffusion-bonded to each other. The core includes a plurality of flow path blocks (40) each of which is configured to include a plurality of flow path layers (30) and a partition wall layer (50) that divides the plurality of flow path blocks. A thickness (t3) of the partition wall layer in a stacking direction is larger than an interval (t2) between flow paths arranged in the stacking direction.

First claim

The invention claimed is:

1. A diffusion bonding heat exchanger comprising:
a core in which a plurality of heat transfer plates are stacked and diffusion-bonded to each other, wherein
the core includes a plurality of flow path blocks each of which is configured to include a plurality of flow path layers in which flow paths are formed and a partition wall layer that is disposed to divide the plurality of flow path blocks,
a thickness of the partition wall layer in a stacking direction is larger than a pitch of the flow path layers constituting the flow path blocks, and
the pitch of the flow path layers is a distance from an upper surface of a flow path layer to an upper surface of next flow path layer separated from the flow path in the stacking direction, the flow path layer being one of the flow path layers.

2. The diffusion bonding heat exchanger according to claim 1 ,
wherein, in a cross-section orthogonal to the flow paths, a proportion of a solid portion in the partition wall layer is larger than a proportion of a solid portion in the flow path layer.

3. The diffusion bonding heat exchanger according to claim 1 ,
wherein the partition wall layer includes a solid portion that is continuous in a direction along the flow path layers in a cross-section orthogonal to the flow paths from one end to the other end of an area in which the flow paths of the flow path layers are formed.

4. The diffusion bonding heat exchanger according to claim 1 ,
wherein the flow path layers are composed of first heat transfer plates which are the heat transfer plates in which groove portions constituting the flow paths by diffusion bonding are formed, and
the partition wall layer is composed of a second heat transfer plate which is the heat transfer plate in which no groove portion is formed.

5. The diffusion bonding heat exchanger according to claim 4 ,
wherein the partition wall layer is composed of a plurality of the second heat transfer plates that are stacked.

6. The diffusion bonding heat exchanger according to claim 1 ,
wherein the flow path layers are composed of a first heat transfer plate in which groove portions constituting the flow paths are formed by diffusion bonding and a third heat transfer plate in which the groove portions are formed and that has a larger thickness than the first heat transfer plate, and
the partition wall layer is composed of a portion of the third heat transfer plate excluding the groove portions.

7. The diffusion bonding heat exchanger according to claim 1 ,
wherein the flow path layers constituting the flow path blocks and the partition wall layer are formed of the same material and are diffusion-bonded to each other without using a bonding material.

8. A diffusion bonding heat exchanger comprising:
a core in which a plurality of heat transfer plates are stacked and diffusion-bonded to each other, wherein
the core includes a plurality of flow path blocks and a partition wall layer that is disposed to divide the plurality of flow path blocks,
the plurality of flow path blocks are configured to include a plurality of flow path layers in each of which a flow path is formed, and a first solid portion in which the flow path is not formed, and
the first solid portion is provided adjacent to a flow path layer in the stacking direction, the flow path layer being one of the plurality of flow path layers,
a thickness of the partition wall layer in a stacking direction is larger than a pitch of the flow path layers constituting the flow path blocks, and
the flow path layers and the partition wall layer in which no flow path is formed are formed of the same material.

9. The diffusion bonding heat exchanger according to claim 8 ,
wherein, in a cross-section orthogonal to the flow paths, a proportion of a second solid portion in the partition wall layer is larger than a proportion of the first solid portion in the flow path layer.

10. The diffusion bonding heat exchanger according to claim 8 ,
wherein the partition wall layer includes a second solid portion that is continuous in a direction along the flow path layers in a cross-section orthogonal to the flow paths from one end to the other end of an area in which the flow paths of the flow path layers are formed.

11. The diffusion bonding heat exchanger according to claim 8 ,
wherein the flow path layers are composed of first heat transfer plates which are the heat transfer plates in which groove portions constituting the flow paths by diffusion bonding are formed, and
the partition wall layer is composed of a second heat transfer plate which is the heat transfer plate in which no groove portion is formed.

12. The diffusion bonding heat exchanger according to claim 11 ,
wherein the partition wall layer is composed of a plurality of the second heat transfer plates that are stacked.

13. The diffusion bonding heat exchanger according to claim 8 ,
wherein the flow path layers are composed of a first heat transfer plate in which groove portions constituting the flow paths are formed by diffusion bonding and a third heat transfer plate in which the groove portions are formed and that has a larger thickness than the first heat transfer plate, and
the partition wall layer is composed of a portion of the third heat transfer plate excluding the groove portions.

14. A diffusion bonding heat exchanger comprising:
a core in which a plurality of heat transfer plates are stacked and diffusion-bonded to each other, wherein
the core includes a plurality of flow path blocks and a partition wall layer that is disposed to divide the plurality of flow path blocks,
the plurality of flow path blocks are configured to include a plurality of flow path layers in each of which a flow path is formed, and a first solid portion in which the flow path is not formed, and
the first solid portion is provided adjacent to a flow path layer in the stacking direction, the flow path layer being one of the plurality of flow path layers,
a thickness of the partition wall layer in a stacking direction is larger than a pitch of the flow path layers constituting the flow path blocks, and
the flow path layers and the partition wall layer in which no flow path is formed are formed of the same material and are bonded to each other without interposing a bonding material therebetween.

15. The diffusion bonding heat exchanger according to claim 14 ,
wherein, in a cross-section orthogonal to the flow paths, a proportion of a second solid portion in the partition wall layer is larger than a proportion of the first solid portion in the flow path layer.

16. The diffusion bonding heat exchanger according to claim 14 ,
wherein the partition wall layer includes a solid portion that is continuous in a direction along the flow path layers in a cross-section orthogonal to the flow paths from one end to the other end of an area in which the flow paths of the flow path layers are formed.

17. The diffusion bonding heat exchanger according to claim 14 ,
wherein the flow path layers are composed of first heat transfer plates which are the heat transfer plates in which groove portions constituting the flow paths by diffusion bonding are formed, and
the partition wall layer is composed of a second heat transfer plate which is the heat transfer plate in which no groove portion is formed.

18. The diffusion bonding heat exchanger according to claim 17 ,
wherein the partition wall layer is composed of a plurality of the second heat transfer plates that are stacked.

19. The diffusion bonding h

Assignees

• Sumitomo Precision Prod Co

Inventors

• Takahashi Suguru
• Fujita Yasuhiro

Classifications

• F28F2275/061

  by diffusion bonding · CPC title

• F28F9/26

  Arrangements for connecting different sections of heat-exchange elements, e.g. of radiators (connecting different sections in water heaters F24H9/14 {, connecting headers with inlet or outlet fittings F28F9/0246}) · CPC title

• B23K20/02

  by means of a press {; Diffusion bonding} · CPC title

• F28F3/12

  Elements constructed in the shape of a hollow panel, e.g. with channels {(F28D1/02, F28D1/03 take precedence)} · CPC title

• F28F3/08

  Elements constructed for building-up into stacks, e.g. capable of being taken apart for cleaning · CPC title