Process to manufacture novel inhibited hydrofluoric acid composition

Patent metadata

Field	Value
Publication number	US-12091601-B2
Application number	US-202217987004-A
Country	US
Kind code	B2
Filing date	Nov 15, 2022
Priority date	Jun 12, 2020
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A process for controlling the heat generated during the manufacture an inhibited hydrofluoric acid aqueous composition comprising:
hydrofluoric acid in solution; a weak base; and an alkanolamine;

said process comprising the steps of:
providing a pre-determined amount of weak base; adding a pre-determined amount of said hydrofluoric acid to said weak base and obtaining a solution; adding said alkanolamine to the resulting solution of hydrofluoric acid and weak base; mixing until all components are dissolved;

wherein said alkanolamine and hydrofluoric acid are present in a molar ratio of at least 1:1.

First claim

The invention claimed is:

1. An inhibited hydrofluoric acid aqueous composition comprising:
hydrofluoric acid in solution;
a weak base; and
an alkanolamine;
wherein the molar ratio of weak base and alkanolamine to hydrofluoric acid in the composition is at least 1:1, and
wherein the composition is produced by a process comprising:
combining a pre-determined amount of hydrofluoric acid with a predetermined amount of the weak base to obtain a first solution;
adding a predetermined amount of the alkanolamine to the first solution to obtain a second solution; and
mixing the second solution to form the inhibited hydrofluoric acid aqueous composition;
wherein the process is performed such that the inhibited hydrofluoric acid aqueous composition has an HF:alkanolamine:weak base ratio ranging from 1:1:0.02 to 1:1:0.5.

2. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the molar ratio of weak base and alkanolamine to hydrofluoric acid in the composition is at least 1.05:1.

3. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the molar ratio of weak base and alkanolamine to hydrofluoric acid in the composition is at least 1.1:1.

4. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the alkanolamine is selected from the group consisting of monoethanolamine, diethanolamine, triethanolamine, and any combination thereof.

5. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the alkanolamine is monoethanolamine.

6. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the alkanolamine is diethanolamine.

7. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the alkanolamine is triethanolamine.

8. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the weak base is selected from the group consisting of lysine, triazole, imidazole, hydantoin, and n-methylimidazole.

9. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the weak base is imidazole.

10. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the weak base is present in an amount ranging from 0.05 to 0.2 moles for each mole of HF present.

11. The inhibited hydrofluoric acid aqueous composition of claim 1 , wherein the process is performed such that the inhibited hydrofluoric acid aqueous composition has an HF:alkanolamine:weak base ratio ranging from 1:1:0.05 to 1:1:0.1.

12. A glass etching composition comprising:
an inhibited hydrofluoric acid aqueous composition according to claim 1 ; and
a mineral acid.

13. The glass etching composition of claim 12 , wherein the mineral acid is HCl.

14. The glass etching composition of claim 12 , wherein
the alkanolamine is selected from the group consisting of monoethanolamine, diethanolamine, triethanolamine, and any combination thereof; and
the weak base is selected from the group consisting of lysine, triazole, imidazole, hydantoin, and n-methylimidazole.

15. An inhibited hydrofluoric acid aqueous composition comprising:
hydrofluoric acid in solution;
a weak base; and
an alkanolamine;
wherein the molar ratio of weak base and alkanolamine to hydrofluoric acid in the composition is at least 1:1, and
wherein the composition is produced by a process comprising:
preparing a first solution comprising a weak base;
combining a pre-determined amount of hydrofluoric acid with the first solution to obtain a second solution;
adding a predetermined amount of the alkanolamine to the second solution to obtain a third solution; and
mixing the third solution to form the inhibited hydrofluoric acid aqueous composition,
wherein the process is performed such that the inhibited hydrofluoric acid aqueous composition has an HF:alkanolamine:weak base ratio ranging from 1:1:0.02 to 1:1:0.5.

16. The inhibited hydrofluoric acid aqueous composition of claim 15 , wherein the process is performed such that the inhibited hydrofluoric acid aqueous composition has an HF:alkanolamine:weak base ratio ranging from 1:1:0.05 to 1:1:0.1.

17. the inhibited hydrofluoric acid aqueous composition of claim 15 , wherein the alkanolamine is selected from the group consisting of monoethanolamine, diethanolamine, triethanolamine, and any combination thereof.

18. The inhibited hydrofluoric acid aqueous composition of claim 15 , wherein the weak base is selected form the group consisting of lysine, triazole, imidazole, hydantoin, and n-methylimidazole.

19. A glass etching composition comprising:
an inhibited hydrofluoric acid aqueous composition according to claim 15 , and
a mineral acid.

20. The glass etching composition of claim 19 , wherein
the mineral acid is HCl;
the alkanolamine is selected form the group consisting of monoethanolamine, diethanolamine, triethanolamine, and any combination thereof; and
the weak base is selected from the group consisting of lysine, triazole, imidazole, hydantoin, and n-methylimidazole.

Assignees

• Fluid Energy Group Ltd
• Dorf Ketal Chemicals Fze

Inventors

• Purdy Clay
• Weissenberger Markus
• Dawson Karl W
• Wynnyk Kyle G

Classifications

• H10P50/642

  Chemical etching · CPC title

• H10P50/283

  by chemical means · CPC title

• C09K13/06

  with organic material · CPC title

• C09K13/08 Primary

  containing a fluorine compound · CPC title

• H01L21/30604

  Electricity · mapped topic