Thermally softenable adhesive tape and method for jacketing elongated items, especially leads
US-11680189-B2 · Jun 20, 2023 · US
Thermally softenable strip and method for covering elongated articles, in particular lines
US12091594B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12091594-B2 |
| Application number | US-202017637608-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 20, 2020 |
| Priority date | Aug 23, 2019 |
| Publication date | Sep 17, 2024 |
| Grant date | Sep 17, 2024 |
How to read this patent
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
- Title
What the patent document calls the invention.
- Abstract
A short plain-language summary of the technical disclosure.
- Assignees and inventors
Who owns or filed the patent and who is credited as inventor.
- Key dates
Filing, priority, publication, and grant dates set the timeline.
- First independent claim
The legal scope of protection — read this for what is actually claimed.
- CPC / IPC classifications
Technology tags used to group this patent with similar filings.
- Citations and related patents
Prior art links and similar publications in this corpus.
Abstract
Official abstract text for this publication.
The invention relates to a strip for covering elongated articles, comprising a carrier in the form of a strip, characterized in that at least one side of the carrier in the form of a strip is provided with a plastic material that thermally softens at a temperature of preferably 100° C. to 135° C. and that comprises a thermoplastic material.
First claim
Opening claim text (preview).
The invention claimed is: 1. A tape for jacketing elongated articles, comprising a tapelike carrier, wherein the tapelike carrier is provided on at least one side with a layer of plastic which consists of a thermoplastic and which is thermally softenable at a temperature of >100° C., wherein the thermoplastic is a polyolefin or a mixture of a polyolefin and another thermoplastic, and wherein the layer has a thickness between 50 μm and 1000 μm. 2. The tape as claimed in claim 1 , wherein the carrier material comprises a polyester nonwoven. 3. The tape as claimed in claim 1 , wherein the softenable plastic has sunk into the carrier to an extent of more than 10%. 4. A method for jacketing elongated articles, said method comprising softening a coated tape as claimed in claim 1 by supplying heat at a temperature between 130° C. and 150° C. and subsequently guiding the tape in a helical line around the elongated article or wrapping the elongated article in an axial direction with the tape, bringing the elongated article together with the tape into a desired disposition, and holding the elongated article in this disposition until the tape has solidified again by cooling. 5. The method as claimed in claim 4 , wherein the softenable plastic is softened by the supply of thermal energy at a temperature of 110° C. to 140° C. 6. The method as claimed in claim 4 , wherein the thermal energy is supplied over a period of 0.5 sec to 2 min. 7. A jacketed elongated article obtained according to claim 4 . 8. A vehicle comprising a jacketed elongated article as claimed in claim 7 .
Assignees
Inventors
Classifications
in the substrate · CPC title
Presence of polyolefin · CPC title
in the substrate · CPC title
for bundling cables · CPC title
Polyesters · CPC title
Patent family
Related publications grouped by family.
External sources
Frequently asked questions
Answers are generated from the same data shown on this page.
- What does patent US12091594B2 cover?
- The invention relates to a strip for covering elongated articles, comprising a carrier in the form of a strip, characterized in that at least one side of the carrier in the form of a strip is provided with a plastic material that thermally softens at a temperature of preferably 100° C. to 135° C. and that comprises a thermoplastic material.
- Who is the assignee on this patent?
- Tesa Se
- What technology area does this patent fall under?
- Primary CPC classification C09J7/35. Mapped technology areas include Chemistry & Metallurgy.
- When was this patent published?
- Publication date Tue Sep 17 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 4 related publications on this page (citations in our corpus or others sharing the same primary CPC).