Spherical silica powder

US12091528B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12091528-B2
Application numberUS-202017436013-A
CountryUS
Kind codeB2
Filing dateJan 30, 2020
Priority dateMar 26, 2019
Publication dateSep 17, 2024
Grant dateSep 17, 2024

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Abstract

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A spherical silica powder with a low dielectric tangent, wherein after formulating the spherical silica powder in a resin and molding it into a sheet, in a dielectric tangent of the spherical silica powder calculated by using the following Formula (I) based on a dielectric tangent (tan δc) of the sheet which is measured under the conditions a frequency is 35-40 GHz with a resonator method, B/A is 0.70 or lower, wherein “A” represents a dielectric tangent (tan δf A ) of the spherical silica powder before a dielectric tangent reduction treatment and “B” represents a dielectric tangent (tan δf B ) of the spherical silica powder after a dielectric tangent reduction treatment; and a specific surface area of said spherical silica powder after a dielectric tangent reduction treatment is 1-30 m 2 /g.

First claim

Opening claim text (preview).

The invention claimed is: 1. Spherical fused silica powder that has been subjected to a dielectric tangent reduction treatment comprising heat treating a raw material spherical fused silica powder having a specific surface area of 1-30 m 2 /g at a temperature of 500-1100° C. and for a predetermined time in which heating temperature (° C.)×heating time (h) is 1000-26400° C.·h, the spherical fused silica powder having: a dielectric tangent ratio B/A of 0.70 or lower, wherein “A” represents a dielectric tangent (tan δf A ) of the spherical fused silica powder before the dielectric tangent reduction treatment and “B” represents a dielectric tangent (tan δf B ) of the spherical fused silica powder after the dielectric tangent reduction treatment, the dielectric tangent (tan δf A , tan δf B ) of the spherical fused silica powder before and after the dielectric tangent reduction treatment being measured with a resonator method at a frequency of 35-40 GHz, a temperature of 20° C., and a humidity of 60% RH after formulating the spherical fused silica powder in a resin and thereafter molding the formulation into a sheet, and being calculated from the following Formula (I): log ⁡ ( tan ⁢ δ ⁢ c ) = Vf · log ⁡ ( tan ⁢ δ ⁢ f ) + ( 1 - Vf ) · log ⁡ ( tan ⁢ δ ⁢ r ) Formula ⁢ ( I ) wherein, in Formula (I), the symbols have the following meanings: tan δc: dielectric tangent of the sheet; Vf: a volume fraction of the spherical fused silica powder in the sheet; tan δr: a dielectric tangent of a resin sheet without the spherical fused silica powder therein; and a specific surface area of 1-30 m 2 /g. 2. The spherical fused silica powder of claim 1 , wherein the fused spherical silica powder has an average circularity of 0.85 or higher. 3. The spherical fused silica powder of claim 1 , wherein the fused spherical silica powder is surface treated with a surface treatment agent. 4. The spherical fused silica powder of claim 1 , wherein the spherical fused silica powder has a density of 1.8-2.4 g/cm 3 . 5. An article comprising the spherical fused silica powder of claim 1 and a moisture-proof bag storing the fused spherical silica powder, the moisture-proof bag having a permeability of 0.1 (g/m 2 ·24h) or lower under the condition of B (Temperature 40° C.−Relative humidity 90%) defined by JIS Z 0208-1976. 6. A resin sheet comprising the spherical fused silica powder of claim 1 . 7. A method for storing the spherical fused silica powder of claim 1 , comprising a step of storing the spherical fused silica powder in a moisture-proof bag with a permeability of 0.1 (g/m 2 ·24h) or lower under the condition of B (Temperature 40° C.−Relative humidity 90%) defined by JIS Z 0208-1976.

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What does patent US12091528B2 cover?
A spherical silica powder with a low dielectric tangent, wherein after formulating the spherical silica powder in a resin and molding it into a sheet, in a dielectric tangent of the spherical silica powder calculated by using the following Formula (I) based on a dielectric tangent (tan δc) of the sheet which is measured under the conditions a frequency is 35-40 GHz with a resonator method, B/A …
Who is the assignee on this patent?
Denka Company Ltd
What technology area does this patent fall under?
Primary CPC classification C08K7/18. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Sep 17 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).