Laser dicing glass wafers using advanced laser sources

Patent metadata

Field	Value
Publication number	US-12091349-B2
Application number	US-202217836162-A
Country	US
Kind code	B2
Filing date	Jun 9, 2022
Priority date	Jun 30, 2021
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A method and apparatus for substrate dicing are described. The method includes utilizing a laser to dice a substrate along a dicing path to form a perforated line around each device within the substrate. The dicing path is created by exposing the substrate to bursts of laser pulses at different locations around each device. The laser pulses are delivered to the substrate and may have a pulse repetition frequency of greater than about 25 MHz, a pulse width of less than about 15 picoseconds, and a laser wavelength of about 1.0 μm to about 5 μm.

First claim

What is claimed is:

1. A method comprising:
forming a plurality of voids within a substrate along a dicing path by exposing the substrate to a first burst of laser pulses at a first location along the dicing path of a respective waveguide combiner, the substrate having a plurality of waveguides, each waveguide having optical device structures, each of the laser pulses within the first burst having a pulse width of less than about 15 picoseconds and a pulse repetition frequency of greater than about 30 MHz and each laser pulse within the first burst forming a respective void within a first column at the first location to form the plurality of voids;
exposing the substrate to a second burst of laser pulses at a second location along the dicing path of the respective waveguide combiner, each laser pulse within the second burst forming the respective void within a second column at the second location to form the plurality of voids, the first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path; and
separating the respective waveguide combiner from the substrate.

2. The method of claim 1 , wherein each of the laser pulses has a laser wavelength of about 1.0 μm to about 5 μm.

3. The method of claim 1 , wherein the substrate is a glass material and has a bandgap of about 5 eV to about 12 eV.

4. The method of claim 1 , wherein each laser pulse has a pulse energy of less than about 100 μJ.

5. The method of claim 1 , wherein each of the plurality of voids has a diameter of less than about 2 μm.

6. The method of claim 1 , wherein there are 5 to 40 laser pulses within the first burst.

7. The method of claim 1 , wherein the first burst of laser pulses is repeated at a burst frequency of greater than about 65 KHz.

8. A method comprising:
exposing a substrate to a first plurality of laser pulses at a first location along a dicing path of a respective waveguide combiner, the substrate having a plurality of waveguides, each waveguide having optical device structures, each of the laser pulses within the first plurality of laser pulses having a laser wavelength of about 1.0 μm to about 5 μm and a pulse repetition frequency of greater than about 50 MHz and each laser pulse within the first plurality of laser pulses forming a respective void within a first column at the first location to form a plurality of voids;
exposing the substrate to a second plurality of laser pulses at a second location along the dicing path of the respective waveguide combiner, each laser pulse within the second plurality of laser pulses forming the respective void within a second column at the second location to form the plurality of voids, the first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path; and
separating the respective waveguide combiner from the substrate.

9. The method of claim 8 , wherein each of the laser pulses has a pulse width of less than about 12 picoseconds.

10. The method of claim 8 , wherein the pulse repetition frequency is greater than about 1 GHz.

11. The method of claim 8 , wherein the first plurality of laser pulses are delivered to the substrate in a first burst of 5 to 40 laser pulses at the first location on the substrate along the dicing path and the second plurality of laser pulses are delivered to the substrate in a second burst of 5 to 40 laser pulses at the second location on the substrate along the dicing path.

12. The method of claim 11 , wherein the pitch between the first column and the second column is less than about 3 μm.

13. The method of claim 11 , wherein a focal point of each laser pulse of the first burst is delivered at varying depth within the substrate.

14. The method of claim 8 , wherein the laser pulses are delivered to the substrate as a Bessel beam or a Gaussian beam.

15. The method of claim 8 , wherein a focal point of each of a laser delivering the laser pulses is disposed within the substrate during delivery of each of the laser pulses.

16. The method of claim 8 , wherein each laser pulse has a pulse energy of less than about 100 μJ.

17. A non-transitory computer-readable medium storing instructions that, when executed by a processor, cause a computer system to perform operations of:
exposing a substrate to a first plurality of laser pulses at a first location along a dicing path of a respective waveguide combiner, the substrate having a plurality of waveguides, each waveguide having optical device structures, each of the laser pulses within the first plurality of laser pulses having a laser wavelength of about 1.0 μm to about 5 μm and a pulse repetition frequency of greater than about 50 MHz and each laser pulse within the first plurality of laser pulses forming a respective void within a first column at the first location to form a plurality of voids;
exposing the substrate to a second plurality of laser pulses at a second location along the dicing path of the respective waveguide combiner, each laser pulse within the second plurality of laser pulses forming the respective void within a second column at the second location to form the plurality of voids, the first column and the second column are spaced by a pitch between a center of the first column and the second column along the dicing path; and
separating the respective waveguide combiner from the substrate.

18. The medium of claim 17 , wherein the first plurality of laser pulses are delivered to the substrate in a first burst of 5 to 40 laser pulses at the first location on the substrate along the dicing path and the second plurality of laser pulses are delivered to the substrate in a second burst of 5 to 40 laser pulses at the second location on the substrate along the dicing path.

19. The medium of claim 18 , wherein the pitch between the first column and the second column is less than about 3 μm.

20. The medium of claim 19 , wherein the pulse repetition frequency is greater than about 1 GHz.

21. The method of claim 1 , wherein separating the respective waveguide combiner from the substrate comprises mechanically separating the respective waveguide combiner along the dicing path.

22. The method of claim 1 , wherein separating the respective waveguide combiner from the substrate comprises thermally separating the respective waveguide combiner along the dicing path.

23. The method of claim 1 , wherein the optical device structures have dimensions less than one micron.

Assignees

• Applied Materials Inc

Inventors

• Lei Wei-Sheng
• Chidambaram Mahendran
• Wang Kangkang
• Godet Ludovic
• Sivaramakrishnan Visweswaren

Classifications

• C03B33/102

  involving a focussed radiation beam, e.g. lasers · CPC title

• B23K26/0861

  in at least three axial directions · CPC title

• B23K26/0006

  taking account of the properties of the material involved (B23K26/32, B23K26/40 take precedence) · CPC title

• C03C23/0025

  by a laser beam · CPC title

• B23K2103/50

  Inorganic materials other than metals or composite materials · CPC title