Device and method for processing micro-channel on microfluidic chip using multi-focus ultrafast laser

Patent metadata

Field	Value
Publication number	US-12090576-B2
Application number	US-202117329251-A
Country	US
Kind code	B2
Filing date	May 25, 2021
Priority date	Jun 11, 2020
Publication date	Sep 17, 2024
Grant date	Sep 17, 2024

Abstract

A method for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser, in which an array-type multi-focus femtosecond laser is used to perform fractional ablation on the micro-fluidic chip, and then pulse laser is used to perform secondary ablation on the micro-fluidic chip. Ultrasonic-assisted hydrofluoric acid etching is performed on the micro-fluidic chip after ablation to obtain a true three-dimensional micro-channel on the micro-fluidic chip. A device for processing a micro-channel of a micro-fluidic chip using multi-focus ultrafast laser is also provided.

First claim

What is claimed is:

1. A method for processing micro-channels of a micro-fluidic chip using multi-focus ultrafast laser, comprising:
(1) performing a fractional ablation on a section of the micro-channels to be processed in the micro-fluidic chip using an array-type multi-focus femtosecond laser, wherein the array-type multi-focus femtosecond laser is prepared from a femtosecond laser by a multi-focus array device using a laser multi-focus technology;
(2) performing a secondary ablation on the micro-channels to be processed of the micro-fluidic chip using a picosecond or femtosecond ultra-short pulse laser; and
(3) subjecting the micro-fluidic chip to ultrasonic-assisted hydrofluoric acid etching to dredge the micro-channels to be processed after undergoing the fractional ablation and the secondary ablation;
wherein the fractional ablation is a main ablation process in processing of the micro-channels to be processed of the micro-fluidic chip; and the secondary ablation is a secondary ablation process in the processing of the micro-channels to be processed of the micro-fluidic chip;
wherein in step (1) the femtosecond laser is a laser with medium-high energy, and used as a main light source in the processing of the micro-channels of the micro-fluidic chip; the femtosecond laser has a single pulse energy equal to or greater than 10 μJ and a pulse width equal to or less than 200 fs; center wavelengths of the femtosecond laser are 260 nm, 343 nm and 355 nm in ultraviolet range; 400 nm, 515 nm and 532 nm in visible light range; and 800 nm, 1030 nm, 1064 nm and 1550 nm in infrared range; and
wherein in step (2) the picosecond or femtosecond ultra-short pulse laser for the secondary ablation is used as a secondary light source in the processing of the micro-channels to be processed of the micro-fluidic chip; center wavelengths of the picosecond or femtosecond ultra-short pulse laser are 1030 nm and 1064 nm; individual focuses of the femtosecond laser are synchronous or asynchronous.

2. The method of claim 1 , wherein after the fractional ablation, a size of a non-ablated area between the individual focuses is less than or equal to 200 μm; and the micro-fluidic chip is made of a fused silica material, calcium fluoride, a transparent ceramic or an organic polymer doped with SiO 2 .

3. The method of claim 1 , wherein in step (1) the laser multi-focus technology enables an array output of the femtosecond laser, and the array-type multi-focus femtosecond laser is an array-type planar two-dimensional multi-focus femtosecond laser or an array-type spatial three-dimensional multi-focus femtosecond laser; and the laser multi-focus technology is spatial light modulation technology, micro-lens array technology, micro-hole array technology, optical fiber array technology or a combination thereof;
the spatial light modulation technology is used to output the array-type spatial three-dimensional multi-focus femtosecond laser using a spatial light modulator through tight focusing of a high-power objective lens;
the micro-lens array technology is used to output the array-type planar two-dimensional multi-focus femtosecond laser by using a micro-lens array;
the micro-hole array technology is able to split the femtosecond laser into an array-type by using a microhole array, and then focus the array-type beam to output the array-type planar two-dimensional multi-focus femtosecond laser; and
the optical fiber array technology enables a laser to directly output an array-type beam by using optical fiber beam splitting cascade amplification or seed light beam splitting multipath amplification, and then focuses the array-type beam to output the array-type planar two-dimensional multi-focus femtosecond laser.

4. The method of claim 3 , wherein the array-type planar two-dimensional multi-focus femtosecond laser adopts a loose focusing mode with a focal length of 5-100 mm; the array-type planar two-dimensional multi-focus femtosecond laser has an array-type multi-focus distribution in a section direction of a laser beam; the array-type planar two-dimensional multi-focus femtosecond laser generates multiple plasma light filaments in a transmission direction of the laser beam; and the array-type planar two-dimensional multi-focus femtosecond laser is used to process longitudinal and transverse micro-channels of the micro-fluidic chip by femtosecond laser multi-focus ablation and femtosecond laser multi-light-filament ablation;
the array-type spatial three-dimensional multi-focus femtosecond laser adopts a tight focusing mode with a focal length of 0-5 mm; the array-type spatial three-dimensional multi-focus femtosecond laser has an array-type multi-focus distribution in both the section direction and the transmission direction of the laser beam; and the array-type spatial three-dimensional multi-focus femtosecond laser is used to process the longitudinal and transverse micro-channels of the micro-fluidic chip by using the femtosecond laser multi-focus ablation;
array mode, array pitch and array range of the array-type planar two-dimensional multi-focus femtosecond laser and the array-type spatial three-dimensional multi-focus femtosecond laser are adjustable; and the multiple plasma light filaments in the transmission direction of the laser beam are adjustable, so as to meet requirements of shape and size of the micro-channels to be processed of the micro-fluidic chip.

5. The method of claim 4 , wherein the array-type spatial three-dimensional multi-focus femtosecond laser is distributed in a spatial array, and the array mode, array pitch and array range are adjustable to make a contour size of the array-type spatial three-dimensional multi-focus femtosecond laser consistent with a size of the micro-channels to be processed; the number of the individual focuses and a focus distance of the femtosecond laser are adjusted to control and improve a processing precision for a shape of sections of the micro-channels to be processed, so that the sections of the micro-channels processed in different directions are kept consistent; the shape of the sections of the micro-channels to be processed is circle, ellipse, rectangle or triangle; and a single scanning ablation of the multi-focus femtosecond laser is able to complete processing of micro-channels of a millimeter-level micro-fluidic chip.

6. The method of claim 3 , wherein the array-type spatial three-dimensional multi-focus laser is configured to distribute laser energy according to positions of the focuses of the femtosecond laser, and adjust a power of multi-focus laser to be greater than a damage threshold of a material of the micro-fluidic chip, so as to meet ablation processing requirements of the micro-channels to be processed on the micro-fluidic chip.

7. The method of claim 1 , wherein in step (2), the secondary ablation is performed by scanning the micro-channels to be processed of the micro-fluidic chip single time or multiple times, and enhance an impact effect, thermal effect and multiphoton effect on a non-ablated area of the micro-channels to be processed.

8. The method of claim 1 , wherein a pulse delay of the picosecond or femtosecond ultra-short pulse laser in step (2) is controlled, such that a pulse of the picosecond or femtosecond ultra-short pulse laser in step (2) is controlled to be after a pulse of the multi-focus femtosecond laser, enabling the secondary ablation while the fractional ablation is performed;
a pulse delay time is 10 ps-200 ns; or
the secondary ablation is performed in the same scan path as the fractional ablation after the fractional ablation is completed.

9. The method of claim 1 , wherein the array-type multi-focus femtosecond laser in step (1) and the picosecond or femtosecond ultra-sh

Assignees

• Chongqing Institute Of East China Normal Univ
• Shanghai Langyan Optoelectronics Tech Co Ltd
• Univ East China Normal

Inventors

• Zeng Heping
• Yang Chuan
• Hu Mengyun
• Yuan Shuai

Classifications

• B23K26/067

  Dividing the beam into multiple beams, e.g. multi-focusing · CPC title

• B01L3/502707

  characterised by the manufacture of the container or its components · CPC title

• B23K26/702

  Auxiliary equipment · CPC title

• B23K26/361

  for deburring or mechanical trimming (B23K26/351 takes precedence) · CPC title

• B23K26/36

  Removing material (B23K26/55, B23K26/57 take precedence) · CPC title