Manufacturing method of electronic device

Patent metadata

Field	Value
Publication number	US-12089345-B2
Application number	US-202217742415-A
Country	US
Kind code	B2
Filing date	May 12, 2022
Priority date	Jun 1, 2021
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

A manufacturing method of an electronic device is provided. The manufacturing method of the electronic device includes following steps: providing a substrate; bonding at least one electronic component to the substrate, wherein the at least one electronic component is mainly driven by a reverse bias in an operating mode; applying a forward bias to the at least one electronic component, and determining whether the at least one electronic component is normal or failed; and transporting the substrate configured with the at least one electronic component determined to be normal to a next production site or repairing the at least one electronic component determined to be failed.

First claim

What is claimed is:

1. A manufacturing method of an electronic device, comprising:
providing a substrate;
bonding at least one electronic component to the substrate, wherein the at least one electronic component is mainly driven by a reverse bias in an operating mode to implement a capacitance modulation function of the at least one electronic component;
applying a forward bias to the at least one electronic component to test a diode function of the at least one electronic component and determining whether the at least one electronic component is normal or failed based on the diode function of the at least one electronic component; and
transporting the substrate configured with the at least one electronic component determined to be normal to a next production site or repairing the at least one electronic component determined to be failed.

2. The manufacturing method of the electronic device according to claim 1 , wherein the step of determining whether the at least one electronic component is normal or failed is based on light emitted by the at least one electronic component.

3. The manufacturing method of the electronic device according to claim 2 , wherein the at least one electronic component comprises a variable capacitor, and the light is emitted from the variable capacitor.

4. The manufacturing method of the electronic device according to claim 3 , wherein the at least one electronic component comprises a variable capacitor and a light-emitting diode electrically connected in series to the variable capacitor, and the light is emitted from the light-emitting diode.

5. The manufacturing method of the electronic device according to claim 3 , wherein the electronic component comprises a variable capacitor and a light-emitting diode electrically connected in parallel with the variable capacitor, and the light is emitted from the light-emitting diode.

6. The manufacturing method of the electronic device according to claim 1 , further comprising:
forming a test pad, wherein the at least one electronic component is electrically connected to the test pad, and the at least one electronic component receives the forward bias through the test pad.

7. The manufacturing method of the electronic device according to claim 6 , further comprising:
using the test pad as a bonding pad, and forming a driving circuit on the test pad, wherein the driving circuit is electrically connected to the at least one electronic component through the test pad.

8. The manufacturing method of the electronic device according to claim 6 , wherein the test pad is formed in a peripheral area of the substrate.

9. The manufacturing method of the electronic device according to claim 6 , wherein after testing, the test pad is removed.

10. The manufacturing method of the electronic device according to claim 6 , wherein after testing, the test pad is remained.

11. The manufacturing method of the electronic device according to claim 6 , further comprising:
forming a driving circuit on the substrate,
wherein the test pad is formed on the substrate and at a position of a side edge different from where the driving circuit is located.

12. The manufacturing method of the electronic device according to claim 6 , further comprising:
forming a driving circuit on the substrate,
wherein the test pad is formed on the substrate and at a position of a side edge the same as where the driving circuit is located, and the test pad is electrically connected to the at least one electronic component through the driving circuit.

13. The manufacturing method of the electronic device according to claim 6 , wherein the at least one electronic component is arranged in an active area of the substrate in an array.

14. The manufacturing method of the electronic device according to claim 6 , wherein the at least one electronic component is arranged in an active area of the substrate in random arrangement and connection.

15. The manufacturing method of the electronic device according to claim 6 , further comprising:
forming a circuit trace on the substrate,
wherein the circuit trace is electrically connected to the at least one electronic component and the test pad.

16. The manufacturing method of the electronic device according to claim 15 , further comprising:
performing at least one of an open circuit test and a short circuit test on the circuit trace to determine whether the circuit trace and the test pad are normally connected.

17. The manufacturing method of the electronic device according to claim 15 , further comprising:
forming a circuit component on the circuit trace.

Assignees

• Innolux Corp

Inventors

• Lin Yi-Hung
• Tsai Hsiu-Yi
• Ting Chin-Lung
• Wei Chung-Kuang

Classifications

• H10P74/273

  Interconnections for measuring or testing, e.g. probe pads · CPC title

• H10P74/207 Primary

  Electrical properties, e.g. testing or measuring of resistance, deep levels or capacitance-voltage characteristics · CPC title

• H10H20/01

  Manufacture or treatment · CPC title

• H05K2203/16

  Inspection; Monitoring; Aligning · CPC title

• H05K2201/10106

  Light emitting diode [LED] · CPC title