Cable termination for information handling systems

US12088029B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12088029-B2
Application numberUS-202117443046-A
CountryUS
Kind codeB2
Filing dateJul 20, 2021
Priority dateJul 20, 2021
Publication dateSep 10, 2024
Grant dateSep 10, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cable such as a server cable may have a tapered termination portion that when connected to other information handling system components reduces the loss of signal between the cable and the information handling system component. A method of making a cable with a tapered termination portion comprising heating a wire having an end and a body portion, the body portion having a first diameter; pulling the end relative to the body portion, for example with a clamp coupled to the end under tension, to obtain a location between the end and the body portion having a second diameter smaller than the first diameter; and cutting the wire at the location.

First claim

Opening claim text (preview).

What is claimed is: 1. A method comprising: heating a wire, the wire having an end and a body, the body having a first diameter; pulling the end relative to the body to obtain a location between the end and the body that has a second diameter smaller than the first diameter; and cutting the wire at the location to separate the end from the body. 2. The method of claim 1 , further comprising pulling the end relative to the body until the second diameter is less than or equal to 50% of the first diameter. 3. The method of claim 1 , further comprising ceasing to pull the end relative to the body when the distance between the end and the body reaches a predetermined distance. 4. The method of claim 1 , further comprising heating the wire with a broadly-focused YAG laser. 5. The method of claim 1 , further comprising cutting the wire with a tightly-focused YAG laser. 6. The method of claim 1 , further comprising heating and cutting the wire with a YAG laser. 7. The method of claim 1 , further comprising cutting insulation from the wire to expose the end of the wire using a first laser and cutting the wire at the location using a second laser. 8. The method of claim 1 , further comprising pulling the end relative to the body with a clamp coupled under tension to at least the end. 9. The method of claim 8 , further comprising pulling the end relative to the body with the clamp while the wire is heated. 10. The method of claim 1 , further comprising heating the wire with electrical current prior to or while pulling the end relative to the body. 11. The method of claim 10 , wherein the electrical current is alternating current.

Assignees

Inventors

Classifications

  • for reducing the size of conductors or cables · CPC title

  • for heat treatment · CPC title

  • H02G1/128Primary

    using radiant energy, e.g. a laser beam · CPC title

  • for network, e.g. LAN connectors · CPC title

  • using irradiation · CPC title

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Frequently asked questions

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What does patent US12088029B2 cover?
A cable such as a server cable may have a tapered termination portion that when connected to other information handling system components reduces the loss of signal between the cable and the information handling system component. A method of making a cable with a tapered termination portion comprising heating a wire having an end and a body portion, the body portion having a first diameter; pul…
Who is the assignee on this patent?
Dell Products Lp
What technology area does this patent fall under?
Primary CPC classification H02G1/128. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 12 related publications on this page (citations in our corpus or others sharing the same primary CPC).