Chip resistor

Patent metadata

Field	Value
Publication number	US-12087477-B2
Application number	US-202017755584-A
Country	US
Kind code	B2
Filing date	Nov 17, 2020
Priority date	Nov 25, 2019
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

An object is to provide a chip resistor capable of coping with high power. A chip resistor of the present disclosure includes insulating substrate, a pair of electrodes, and resistance member. A pair of electrodes are provided at both ends of the upper face of insulating substrate. Resistance member is provided on insulating substrate and connected to the pair of electrodes. Insulating substrate has first region in the center thereof and second regions at both ends of first region. Recess is provided in first region of insulating substrate. Resistance member formed in first region has a meandering shape in a top view. At least a part of resistance member is embedded in recess. Trimming groove is provided in resistance member formed in second region.

First claim

The invention claimed is:

1. A chip resistor comprising:
an insulating substrate having a rectangular shape and provided with a recess on an upper face;
a pair of upper-face electrodes provided on the upper face of the insulating substrate;
a resistance member provided on the insulating substrate and electrically connected to the pair of upper-face electrodes, the resistance member having a trimming groove;
a protective layer provided on the upper face of the insulating substrate to cover at least the resistance member;
an end-face electrode provided on an outer face in a longitudinal direction of the insulating substrate and electrically connected to the upper-face electrode; and
a lower-face electrode provided on a lower face of the insulating substrate and electrically connected to the end-face electrode,
wherein the resistance member is provided on both the upper face of the insulating substrate and an embedded portion embedded in the recess, and
wherein a length, in a lateral direction of the insulating substrate, of a first trimming groove provided in the resistance member provided in the embedded portion is larger than a length, in the lateral direction of the insulating substrate, of a second trimming groove provided in the resistance member provided on the upper face of the insulating substrate.

2. A chip resistor comprising:
an insulating substrate provided with a meandering recess on an upper face;
a pair of upper-face electrodes provided at both ends of the upper face of the insulating substrate;
a resistance member including a meandering resistance portion embedded in the meandering recess of the insulating substrate and a pair of rectangular parallelepiped resistance portions provided on both end sides of the meandering resistance portion, the pair of rectangular parallelepiped resistance portions being electrically connected to the pair of upper-face electrodes, respectively;
a first protective film provided on an upper face of the resistance member; and
an end-face electrode provided from an outer face in a longitudinal direction of the insulating substrate to a lower face of the insulating substrate and electrically connected to the upper-face electrode,
wherein in the meandering recess of the insulating substrate, a trimming groove is provided from an upper face of the first protective film via the rectangular parallelepiped resistance portion of the resistance member, and the trimming groove is filled with a second protective film.

Assignees

• Panasonic Ip Man Co Ltd

Inventors

• Yamamoto Yuusuke
• Fujita Ryusei

Classifications

• H01C7/00

  Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material (consisting of loose powdered or granular material H01C8/00; resistors having potential barriers, e.g. field-effect resistors, H10D1/40 - H10D1/43, H10K10/10; semiconductor devices sensitive to electromagnetic or corpuscular radiation, e.g. photoresistors, H10F30/00; magnetic field controlled resistors H10N50/10; bulk negative resistance effect devices H10N80/00) · CPC title

• H01C1/032

  plural layers surrounding the resistive element (H01C1/028 takes precedence) · CPC title

• H01C17/065

  by thick film techniques, e.g. serigraphy · CPC title

• H01C7/22

  Elongated resistive element being bent or curved, e.g. sinusoidal, helical · CPC title

• H01C1/028

  the resistive element being embedded in insulation with outer enclosing sheath · CPC title