Method for manufacturing film-formed molded product

US12083722B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12083722-B2
Application numberUS-201917420715-A
CountryUS
Kind codeB2
Filing dateDec 24, 2019
Priority dateJan 11, 2019
Publication dateSep 10, 2024
Grant dateSep 10, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention achieves cost reduction by simplifying the manufacturing process for a film-formed molded product provided with a metal coating film capable of transmitting electromagnetic waves therethrough. This method for manufacturing a film-formed molded product which includes a molded product and a metal coating film covering the molded product comprises: forming the molded product between a movable mold and a fixed mold; and then forming the metal coating film which covers the molded product by a film-forming part of a second mold without taking the molded product out from between the movable mold and the fixed mold. The metal coating film is capable of transmitting electromagnetic waves therethrough as a result of generation of cracks after being formed.

First claim

Opening claim text (preview).

What is claimed is: 1. A method for manufacturing a film-formed molded product which comprises a non-conductive first molded product and a metal coating film that covers the first molded product and has an electromagnetic wave transmission performance, comprising: a process (a) in which a first mold and a second mold are mold-clamped, a first material is injected into a first space between the first mold and the second mold, and thereby the first molded product comprising the first material is formed; a process (b) in which after the first mold and the second mold are mold-opened, the first molded product is moved with respect to the second mold between the first mold and the second mold; and a process (c) in which after the process (b), the first mold and the second mold are mold-clamped, and the metal coating film is formed on a surface of the first molded product by a first film-forming part comprised in the second mold, a process (c1) in which after the process (c), the first mold and the second mold are mold-opened, the first molded product is moved with respect to the second mold, the first mold and the second mold are mold-clamped at a second film-forming part formed adjacent to the first film-forming part, and a protective film made of aluminum oxide, magnesium fluoride or silicon oxide is formed on a surface of the metal coating film; a process (d) in which after the process (c1), the first molded product, the metal coating film and the protective film are heated; wherein cracks are generated on the metal coating film when temperatures of the first molded product, the metal coating film and the protective film are changed after the process (d), and thereby an electromagnetic wave transmission performance is imparted to the metal coating film and the protective film, wherein the first film-forming part comprises a sputtering device, a target disposed opposite to the first molded product for forming the metal coating film is curved or bent along a surface of the first molded product. 2. The method for manufacturing a film-formed molded product according to claim 1 , wherein the first molded product is located between the first mold and the second mold from the process (a) to the process (d). 3. The method for manufacturing a film-formed molded product according to claim 1 , wherein the first material and a second material which constitutes the metal coating film have coefficients of thermal expansion different from each other. 4. The method for manufacturing a film-formed molded product according to claim 1 , wherein after being formed in the process (a), the first molded product is maintained at a temperature of 100° C. or higher until the metal coating film is formed in the process (c). 5. The method for manufacturing a film-formed molded product according to claim 1 , wherein in the process (b) to the process (c1), the first molded product supported by the first mold is moved by rotating the first mold. 6. The method for manufacturing a film-formed molded product according to claim 1 , wherein a film thickness of the metal coating film is 800 to 1500 Å. 7. The method for manufacturing a film-formed molded product according to claim 1 , wherein a second material constituting the metal coating film is stainless steel, chromium, or aluminum.

Assignees

Inventors

Classifications

  • using displaceable mould parts, e.g. retractable partition between adjacent mould cavities · CPC title

  • for rotation of the substrates · CPC title

  • Sputtering · CPC title

  • the article consisting of a material with particular properties, e.g. porous, brittle · CPC title

  • Antennas, e.g. radomes · CPC title

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What does patent US12083722B2 cover?
The present invention achieves cost reduction by simplifying the manufacturing process for a film-formed molded product provided with a metal coating film capable of transmitting electromagnetic waves therethrough. This method for manufacturing a film-formed molded product which includes a molded product and a metal coating film covering the molded product comprises: forming the molded product …
Who is the assignee on this patent?
Mitsuba Corp
What technology area does this patent fall under?
Primary CPC classification B29C45/0053. Mapped technology areas include Operations & Transport.
When was this patent published?
Publication date Tue Sep 10 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).