Substrate treating apparatus and substrate treating method

Patent metadata

Field	Value
Publication number	US-12083551-B2
Application number	US-202217884709-A
Country	US
Kind code	B2
Filing date	Aug 10, 2022
Priority date	Aug 12, 2021
Publication date	Sep 10, 2024
Grant date	Sep 10, 2024

Abstract

The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a chamber providing a treating space; and a fluid supply unit supplying a treating fluid to the chamber, and wherein the fluid supply unit includes: a supply tank storing the treating fluid; a supply line connecting the supply tank and the chamber; and a plurality of valves installed at the supply line, and wherein any one valve among the plurality of valves is provided as a safety valve, and wherein the safety valve is opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from a tank to the chamber.

First claim

What is claimed is:

1. A substrate treating apparatus comprising:
a chamber providing a treating space; and
a fluid supply unit configured to supply a treating fluid to the chamber, and
wherein the fluid supply unit comprises:
a supply tank configured to store the treating fluid;
a supply line connecting the supply tank and the chamber; and
a plurality of valves installed at the supply line, and
wherein any one valve among the plurality of valves is provided as a safety valve, and
wherein the safety valve is configured to be opened after confirming that the chamber has been switched to a closed state when supplying the treating fluid from the supply tank to the chamber,
wherein the safety valve and a remaining valve except for the safety valve among the plurality of valves are configured to be controlled by different control modules,

wherein the safety valve is configured to be controlled by a first control module, and the remaining valve is configured to be controlled by a second control module, and
wherein the first control module includes
a first controller configured to control an open/close of the safety valve; and
a safety controller configured to control an operation of the first controller, and
wherein the safety controller is configured to control a power supplied to the first controller to control the first controller.

2. The substrate treating apparatus of claim 1 , wherein the safety valve is provided closest to the supply tank among the plurality of valves.

3. The substrate treating apparatus of claim 1 , wherein the first control module further comprises a relay configured to be operated by receiving a power supply signal of the safety controller and transmitting a power supplied by the safety controller to the first controller.

4. The substrate treating apparatus of claim 1 , wherein the fluid supply unit further comprises an integrated controller configured to control the plurality of valves, and
wherein the first controller is configured to receive an open signal of the integrated controller and an open signal of the safety controller to control the safety valve to open the safety valve.

5. The substrate treating apparatus of claim 1 , wherein the safety valve includes a solenoid valve.

6. The substrate treating apparatus of claim 1 , wherein the safety valve includes a normal close valve (N/C valve).

7. The substrate treating apparatus of claim 1 , wherein the supply tank is a high pressure tank, and the chamber is a high pressure chamber.

8. A substrate treating apparatus comprising:
a chamber providing a treating space;
a fluid supply unit configured to supply a treating fluid to the chamber, and
wherein the fluid supply unit comprises:
a supply tank configured to store the treating fluid;
a supply line connecting the supply tank and the chamber; and
a plurality of valves installed at the supply line, including a safety valve; and
a control module configured to control the plurality of valves, and
wherein the safety valve is provided closest to the supply tank among the plurality of valves, and is configured to be controlled by another control module,
wherein the safety valve is configured to be controlled to supply the treating fluid after confirming that the chamber has been switched to a closed state when supplying the treating fluid from the supply tank to the chamber,
wherein the safety valve is configured to be controlled by a first control module,
a remaining valve except for the safety valve among the plurality of valves is configured to be controlled by a second control module, and
wherein the first control module includes
a first controller configured to control an open/close of the safety valve;
a safety controller configured to control an operation of the first controller; and
a relay configured to be operated by receiving a signal of the safety controller and configured to transmit a power supplied by the safety controller to the first controller, and

wherein the safety controller is configured to control a power supplied to the first controller to control the first controller.

9. The substrate treating apparatus of claim 8 , wherein the safety valve is a normally closed valve (N/C valve).

Assignees

• Semes Co Ltd

Inventors

• Lee Sang Min
• Chung Woo Jin
• Kim Ki Bong

Classifications

• H10P70/20

  Cleaning during device manufacture · CPC title

• H10P72/0604

  Process monitoring, e.g. flow or thickness monitoring · CPC title

• H10P72/0402

  Apparatus for fluid treatment (H10P72/0441, H10P72/0448 take precedence) · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• H10P72/0432

  mainly by conduction · CPC title