Printed circuit board and fabricating method thereof, and displaying device

Patent metadata

Field	Value
Publication number	US-12082337-B2
Application number	US-202117800660-A
Country	US
Kind code	B2
Filing date	Nov 2, 2021
Priority date	Feb 23, 2021
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

A printed circuit board and a fabricating method thereof, and a displaying device. The printed circuit board includes a hard-board region ( 30 ) and a soft-board region ( 31 ), the soft-board region ( 31 ) is located at the periphery of the first edge ( 30 a ) of the hard-board region ( 30 ), the printed circuit board within the hard-board region ( 30 ) includes a base plate ( 301 ), and an adhesive film ( 302 ), a covering film ( 303 ) and a first metal layer ( 304 ) that are arranged in layer configuration on one side of the base plate ( 301 ), the adhesive film ( 302 ) is closest to the base plate ( 301 ), a flow guiding groove ( 3030 ) is disposed on the surface of the side of the covering film ( 303 ) that is closer to the adhesive film ( 302 ), and the flow guiding groove ( 3030 ) extends to a second edge ( 30 b ) of the hard-board region ( 30 ).

First claim

The invention claimed is:

1. A printed circuit board, wherein the printed circuit board comprises a hard-board region and a soft-board region, and the soft-board region is located at a periphery of a first edge of the hard-board region; and
the printed circuit board located in the hard-board region comprises a base plate, and an adhesive film, a covering film and a first metal layer that are arranged in layer configuration on one side of the base plate, the adhesive film is closest to the base plate, a flow guiding groove is disposed on a surface of one side of the covering film that is closer to the adhesive film, and the flow guiding groove extends to a second edge of the hard-board region.

2. The printed circuit board according to claim 1 , wherein the hard-board region is quadrilateral, the first edge comprises a first side edge of the hard-board region and a second side edge opposite to the first side edge, the second edge comprises a third side edge of the hard-board region and a fourth side edge opposite to the third side edge, one end of the flow guiding groove extends to the third side edge, and the other end of the flow guiding groove extends to the fourth side edge.

3. The printed circuit board according to claim 1 , wherein the flow guiding groove is a plurality of flow guiding grooves, and the plurality of flow guiding grooves have equal spacings therebetween and are parallel.

4. The printed circuit board according to claim 1 , wherein an extension direction of the flow guiding groove is parallel to a border line between the hard-board region and the soft-board region.

5. The printed circuit board according to claim 1 , wherein the flow guiding groove comprises a first groove and a second groove that are in communication with each other, an extension direction of the first groove is parallel to a border line between the hard-board region and the soft-board region, and the second groove is bent toward the border line.

6. The printed circuit board according to claim 1 , wherein a spacing between the flow guiding groove and the soft-board region is greater than or equal to 1 mm.

7. The printed circuit board according to claim 1 , wherein a depth of the flow guiding groove is less than or equal to a half of a thickness of the covering film.

8. The printed circuit board according to claim 1 , wherein a depth of the flow guiding groove is greater than or equal to 2 μm, and less than or equal to 10 μm.

9. The printed circuit board according to claim 1 , wherein an orthographic projection of a groove opening of the flow guiding groove on the base plate covers an orthographic projection of a groove bottom of the flow guiding groove on the base plate.

10. The printed circuit board according to claim 9 , wherein in an extension direction perpendicular to the flow guiding groove, a width of a groove opening of the flow guiding groove is greater than or equal to 0.5 mm, and less than or equal to 1 mm.

11. The printed circuit board according to claim 1 , wherein a material of the covering film comprises polyimide.

12. The printed circuit board according to claim 1 , wherein the adhesive film is formed by solidification of a half-solidified insulating-adhesive sheet.

13. The printed circuit board according to claim 1 , wherein the adhesive film, the covering film and the first metal layer are arranged symmetrically on two sides of the base plate, and a solder resisting layer is disposed on one side of the first metal layer that is away from the base plate.

14. A displaying device, wherein the displaying device comprises a display panel and the printed circuit board according to claim 1 , wherein the printed circuit board is connected to the display panel.

15. The displaying device according to claim 14 , wherein the displaying device further comprises a Chip-on film, and the printed circuit board and the display panel are connected by the Chip-on film.

16. A method for fabricating a printed circuit board, wherein the printed circuit board comprises a hard-board region and a soft-board region, and the soft-board region is located at a periphery of a first edge of the hard-board region; and
the printed circuit board located in the hard-board region is manufactured by:
providing a base plate;
sequentially adhering an adhesive film, a covering film and a first metal layer on one side of the base plate, wherein a flow guiding groove is disposed on a surface of one side of the covering film that is closer to the adhesive film, the flow guiding groove extends to a second edge of the hard-board region, and the flow guiding groove is configured for guiding an overflowing adhesive of the adhesive film to flow to a peripheral region of the second edge; and
cutting along the second edge, to cut off the peripheral region of the second edge, to obtain the printed circuit board.

Assignees

• Chengdu Boe Optoelect Tech Co
• Boe Technology Group Co Ltd

Inventors

• Zhang Jiaxiang
• Bai Jiuyuan
• Mu Xin
• Wang Mingqiang
• Hu Hongjin
• Li Fei
• Chen Yonglin
• Zuo Kun
• Wang Chang
• Bi Xin
• Zhang Bin
• Oh Seungyong

Classifications

• H05K2201/10128

  Display · CPC title

• H05K3/386

  by the use of an organic polymeric bonding layer, e.g. adhesive · CPC title

• H05K1/028 Primary

  Bending or folding regions of flexible printed circuits (H05K1/0283 takes precedence) · CPC title

• H05K2201/09036

  Recesses or grooves in insulating substrate · CPC title

• G09G3/00

  Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes · CPC title