Top electrodes and dielectric spacer layers for bulk acoustic wave resonators

Patent metadata

Field	Value
Publication number	US-12081194-B2
Application number	US-202318192312-A
Country	US
Kind code	B2
Filing date	Mar 29, 2023
Priority date	Jan 14, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

Bulk acoustic wave (BAW) resonators and particularly top electrodes with step arrangements for BAW resonators are disclosed. Top electrodes on piezoelectric layers are disclosed that include a border (BO) region with a dual-step arrangement where an inner step and an outer step are formed with increasing heights toward peripheral edges of the top electrode. Dielectric spacer layers may be provided between the outer steps and the piezoelectric layer. Passivation layers are disclosed that extend over the top electrode either to peripheral edges of the piezoelectric layer or that are inset from peripheral edges of the piezoelectric layer. Piezoelectric layers may be arranged with reduced thickness portions in areas that are uncovered by top electrodes. BAW resonators as disclosed herein are provided with high quality factors and suppression of spurious modes while also providing weakened BO modes that are shifted farther away from passbands of such BAW resonators.

First claim

What is claimed is:

1. A bulk acoustic wave (BAW) resonator comprising:
a bottom electrode;
a piezoelectric layer over the bottom electrode;
a top electrode over the piezoelectric layer, the top electrode defining a central region, an inner region that extends about a periphery of the central region, and a border (BO) region such that the inner region is between the central region and the BO region; and
a dielectric spacer layer arranged between the top electrode and the piezoelectric layer at the BO region, the dielectric spacer layer being in contact with the piezoelectric layer under the top electrode at the BO region;
wherein a height profile is defined across the central region, the inner region, and the BO region, and the height profile relative to the piezoelectric layer decreases from the BO region to the inner region and the height profile increases from the inner region to the central region.

2. The BAW resonator of claim 1 , further comprising a passivation layer on the top electrode such that the height profile includes the top electrode and the passivation layer.

3. The BAW resonator of claim 2 , wherein the dielectric spacer layer comprises silicon dioxide, silicon nitride, or aluminum nitride, and the passivation layer comprises silicon nitride.

4. The BAW resonator of claim 1 , wherein the BO region comprises an outer BO region and an inner BO region, the inner BO region is between the outer BO region and the inner region, the height profile decreases from the outer BO region to the inner BO region, and the height profile further decreases from the inner BO region to the inner region.

5. The BAW resonator of claim 4 , wherein the height profile comprises a first height at the central region, a second height at the inner BO region, a third height at the outer BO region, and a fourth height at the inner region, wherein the fourth height is smaller than each of the first height, the second height, and the third height.

6. The BAW resonator of claim 5 , wherein the first height is smaller than each of the second height and the third height.

7. The BAW resonator of claim 5 , wherein the inner BO region is an inner BO ring about the periphery of the central region, the outer BO region is an outer BO ring about a periphery of the inner BO ring, and the inner region is an inner ring between the inner BO ring and the central region.

8. The BAW resonator of claim 7 , wherein the inner BO ring is a first mass loading region, the outer BO ring is a second mass loading region, and the inner ring is a mass-reducing region.

9. The BAW resonator of claim 1 , further comprising a substrate and at least one layer below the bottom electrode such that the at least one layer is between the bottom electrode and the substrate.

10. The BAW resonator of claim 9 , wherein the at least one layer comprises at least one layer of silicon dioxide.

11. The BAW resonator of claim 1 , wherein the top electrode comprises a first layer of tungsten, a second layer of titanium tungsten alloy, and a third layer of aluminum copper.

12. A method of fabricating a bulk acoustic wave (BAW) resonator, the method comprising:
providing a bottom electrode below a piezoelectric layer;
selectively providing a dielectric spacer layer on one or more portions of the piezoelectric layer such that the piezoelectric layer is between the bottom electrode and the dielectric spacer layer; and
providing a top electrode over the dielectric spacer layer and the piezoelectric layer, the top electrode defining a central region, an inner region that extends about a periphery of the central region, and a border (BO) region such that the inner region is between the central region and the BO region, the dielectric spacer layer being in contact with the piezoelectric layer under the BO region;
wherein a height profile is defined across the central region, the inner region, and the BO region, and the height profile relative to the piezoelectric layer decreases from the BO region to the inner region and the height profile increases from the inner region to the central region.

13. The method of claim 12 , further comprising providing a passivation layer on the top electrode in a conformal manner such that the height profile includes the top electrode and the passivation layer.

14. The method of claim 13 , wherein the dielectric spacer layer comprises silicon dioxide, silicon nitride, or aluminum nitride, and the passivation layer comprises silicon nitride.

15. The method of claim 12 , wherein:
the BO region comprises an outer BO region and an inner BO region such that the inner BO region is between the outer BO region and the inner region;
the height profile comprises a first height at the central region, a second height at the inner BO region, a third height at the outer BO region, and a fourth height at the inner region; and
the fourth height is smaller than each of the first height, the second height, and the third height.

16. The method of claim 15 , wherein the inner BO region is an inner BO ring about the periphery of the central region, the outer BO region is an outer BO ring about a periphery of the inner BO ring, and the inner region is an inner ring between the inner BO ring and the central region.

17. A wireless device comprising,
one or more bulk acoustic wave (BAW) resonators, wherein at least one of the one or more BAW resonators comprises:
a bottom electrode;
a piezoelectric layer over the bottom electrode;
a top electrode over the piezoelectric layer, the top electrode defining a central region, an inner region that extends about a periphery of the central region, and a border (BO) region such that the inner region is between the central region and the BO region; and
a dielectric spacer layer arranged between the BO region and the piezoelectric layer, the dielectric spacer layer being in contact with the piezoelectric layer under the BO region;
wherein a height profile is defined across the central region, the inner region, and the BO region, and the height profile relative to the piezoelectric layer decreases from the BO region to the inner region and the height profile increases from the inner region to the central region.

18. The wireless device of claim 17 , wherein the at least one of the one or more BAW resonators further comprises a passivation layer on the top electrode such that the height profile includes the top electrode and the passivation layer.

19. The wireless device of claim 17 , wherein:
the BO region comprises an outer BO region and an inner BO region such that the inner BO region is between the outer BO region and the inner region;
the height profile comprises a first height at the central region, a second height at the inner BO region, a third height at the outer BO region, and a fourth height at the inner region; and
the fourth height is smaller than each of the first height, the second height, and the third height.

20. The wireless device of claim 19 , wherein the inner BO region is an inner BO ring about the periphery of the central region, the outer BO region is an outer BO ring about a periphery of the inner BO ring, and the inner region is an inner ring between the inner BO ring and the central region.

Assignees

• Qorvo Us Inc

Inventors

• Tajic Alireza
• Stokes Paul
• Aigner Robert

Classifications

• H10N30/883

  Additional insulation means preventing electrical, physical or chemical damage, e.g. protective coatings · CPC title

• H10N30/87

  Electrodes or interconnections, e.g. leads or terminals · CPC title

• H03H9/02062

  Details relating to the vibration mode · CPC title

• H03H9/173

  Air-gaps · CPC title

• H03H9/54

  comprising resonators of piezoelectric or electrostrictive material (comprising resonators using surface acoustic waves H03H9/64) · CPC title