Transmission line and circuit board

Patent metadata

Field	Value
Publication number	US-12080935-B2
Application number	US-202217694794-A
Country	US
Kind code	B2
Filing date	Mar 15, 2022
Priority date	Oct 2, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

A transmission line includes a first interlayer connection conductor connecting a first signal conductor and a first mounting electrode, a second interlayer connection conductor connecting a second signal conductor and a second mounting electrode, a third and fourth interlayer connection conductors respectively including third and fourth interlayer connection conductors, and each connecting first and second ground conductors between the first and second signal conductors. The third interlayer connection conductor is closer to the first and second interlayer connection conductors than the fourth interlayer connection conductor is, an adjacent distance between two of the fourth interlayer connection conductors is greater than an adjacent distance between two of the third interlayer connection conductors, and the adjacent distance between the two fourth interlayer connection conductors is less than about ½ of a minimum wavelength of signals transmitted by the first signal conductor and the second signal conductor.

First claim

What is claimed is:

1. A transmission line comprising:
a flexible substrate;
a first signal conductor and a second signal conductor in the substrate and extending parallel or substantially parallel to each other;
a first ground conductor and a second ground conductor in or on the substrate and sandwiching the first signal conductor and the second signal conductor in a lamination direction;
a first mounting electrode and a second mounting electrode on the substrate; and
a first interlayer connection conductor, a second interlayer connection conductor, a third interlayer connection conductor, and a fourth interlayer connection conductor in the substrate; wherein
the first interlayer connection conductor connects the first signal conductor and the first mounting electrode;
the second interlayer connection conductor connects the second signal conductor and the second mounting electrode;
the third interlayer connection conductor and the fourth interlayer connection conductor respectively include a plurality of third interlayer connection conductors and a plurality of fourth interlayer connection conductors, and each connects the first ground conductor and the second ground conductor between the first signal conductor and the second signal conductor;
two of the plurality of third interlayer connection conductors are closer to the first interlayer connection conductor and the second interlayer connection conductor than two of the plurality of fourth interlayer connection conductors are;
an adjacent distance between the two of the plurality of fourth interlayer connection conductors is greater than an adjacent distance between the two of the plurality of third interlayer connection conductors; and
the adjacent distance between the two of the plurality of third interlayer connection conductors is less than about ½ of a minimum wavelength of a signal transmitted by each of the first signal conductor and the second signal conductor.

2. The transmission line according to claim 1 , wherein the adjacent distance between the two of the third interlayer connection conductors is less than about ¼ of the minimum wavelength of the signal.

3. The transmission line according to claim 1 , wherein a diameter of the first interlayer connection conductor is larger than a diameter of the third interlayer connection conductor.

4. The transmission line according to claim 1 , wherein
the third interlayer connection conductor is in a mounting region which is a region overlapping an outer shape of an electronic component to be mounted on the substrate via the first mounting electrode and the second mounting electrode; and
the fourth interlayer connection conductor is a region other than the mounting region.

5. The transmission line according to claim 1 , wherein the plurality of third interlayer connection conductors surround the first interlayer connection conductor and the second interlayer connection conductor in a plan view of the substrate.

6. The transmission line according to claim 1 , wherein
the substrate includes a first region with a first thickness and a second region with a second thickness less than the first thickness;
the first interlayer connection conductor, the second interlayer connection conductor, and the third interlayer connection conductor are in the first region; and
the fourth interlayer connection conductor is in the second region.

7. The transmission line according to claim 6 , wherein a bent portion is provided adjacent to the first region, in the second region.

8. The transmission line according to claim 7 , wherein at least one of the first ground conductor and the second ground conductor includes a mesh-shaped portion in the bent portion.

9. The transmission line according to claim 1 , wherein at least one of the first ground conductor and the second ground conductor includes an opening between adjacent fourth interlayer connection conductors of the plurality of fourth interlayer connection conductors.

10. A circuit board, comprising:
the transmission line according to claim 1 ; and
an electronic component; wherein
the electronic component is a multipolar connector including:
a first signal terminal electrically connected to the first mounting electrode; and
a second signal terminal electrically connected to the second mounting electrode.

11. The circuit board according to claim 10 , wherein
the substrate includes a first region with a first thickness and a second region with a second thickness less than the first thickness;
the first interlayer connection conductor, the second interlayer connection conductor, and the third interlayer connection conductor are in the first region; and
the fourth interlayer connection conductor is in the second region.

12. The circuit board according to claim 11 , wherein a bent portion is provided adjacent to the first region, in the second region.

13. The circuit board according to claim 10 , wherein the adjacent distance between the two of the third interlayer connection conductors is less than about ¼ of the minimum wavelength of the signal.

14. The circuit board according to claim 10 , wherein a diameter of the first interlayer connection conductor is larger than a diameter of the third interlayer connection conductor.

15. The circuit board according to claim 10 , wherein
the third interlayer connection conductor is in a mounting region which is a region overlapping an outer shape of an electronic component to be mounted on the substrate via the first mounting electrode and the second mounting electrode; and
the fourth interlayer connection conductor is a region other than the mounting region.

16. The circuit board according to claim 10 , wherein the plurality of third interlayer connection conductors surround the first interlayer connection conductor and the second interlayer connection conductor in plan view of the substrate.

17. The circuit board according to claim 10 , wherein at least one of the first ground conductor and the second ground conductor includes an opening between adjacent fourth interlayer connection conductors of the plurality of fourth interlayer connection conductors.

18. The circuit board according to claim 10 , wherein the adjacent distance between the two of the plurality of fourth interlayer connection conductors is less than about ½ of the minimum wavelength of the signal.

19. The transmission line according to claim 1 , wherein the substrate is a laminated body of a plurality of base layers being thermoplastic resin sheets.

20. The transmission line according to claim 1 , wherein the adjacent distance between the two of the plurality of fourth interlayer connection conductors is less than about ½ of the minimum wavelength of the signal.

Assignees

• Murata Manufacturing Co

Inventors

• Nagai Tomohiro
• Tenno Nobuyuki

Classifications

• H01P3/081

  Microstriplines · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H05K1/0218

  by printed shielding conductors, ground planes or power plane (H05K1/0236 takes precedence) · CPC title

• H01P5/022

  Transitions between lines of the same kind and shape, but with different dimensions · CPC title

• H05K1/0298

  Multilayer circuits · CPC title