Multilayer ceramic capacitor

US12080487B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12080487-B2
Application numberUS-202217979030-A
CountryUS
Kind codeB2
Filing dateNov 2, 2022
Priority dateDec 23, 2021
Publication dateSep 3, 2024
Grant dateSep 3, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A multilayer ceramic capacitor includes a multilayer body and a pair of external electrodes at both ends of the multilayer body in a length direction and covering a pair of end surfaces, and connected to internal electrode layers. The pair of external electrodes each include a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers, a second external electrode layer on the first external electrode layer, and a plated layer on the second external electrode layer, the first external electrode layer includes Ni and dielectric particles, the second external electrode layer includes Cu and glass, and a metal group including at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y, or Cu is included at an interface between the first and second external electrode layers.

First claim

Opening claim text (preview).

What is claimed is: 1. A multilayer ceramic capacitor comprising: a multilayer body including a plurality of dielectric ceramic layers and a plurality of internal electrode layers laminated alternately in a lamination direction, a pair of main surfaces opposed to each other in the lamination direction, a pair of side surfaces which are opposed to each other in a width direction orthogonal or substantially orthogonal to the lamination direction, and a pair of end surfaces opposed to each other in a length direction orthogonal or substantially orthogonal to the lamination direction and the width direction; and a pair of external electrodes at both ends of the multilayer body in the length direction to cover at least the pair of end surfaces, and connected to the internal electrode layers; wherein the pair of external electrodes each include: a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers; a second external electrode layer on the first external electrode layer; and a plated layer on the second external electrode layer; the first external electrode layer includes Ni and a dielectric region; the second external electrode layer includes Cu and glass; and a metal group including at least one of Sn, In, Ga, Zn, Bi, Pb, Fe, V, Y, or Cu is included at an interface between the first external electrode layer and the second external electrode layer. 2. The multilayer ceramic capacitor according to claim 1 , wherein the metal group defines a solid solution in the Ni. 3. The multilayer ceramic capacitor according to claim 2 , wherein the metal group defines a solid solution in the Cu. 4. The multilayer ceramic capacitor according to claim 3 , wherein a concentration of the metal group defining the solid solution in the Cu is lower than a concentration of the metal group defining the solid solution in the Ni. 5. The multilayer ceramic capacitor according to claim 1 , wherein dimensions of the multilayer ceramic capacitor are about 0.2 mm or more and about 1.2 mm or less in the length direction, about 0.1 mm or more and about 0.7 mm or less in the width direction, and about 0.1 mm or more and about 0.7 mm or less in the lamination direction. 6. The multilayer ceramic capacitor according to claim 1 , wherein each of the plurality of dielectric ceramic layers includes barium titanate as a main component. 7. The multilayer ceramic capacitor according to claim 6 , wherein each of the plurality of internal electrode layers includes at least one of Ni, Cu, Ag, Pd, a Ag—Pd alloy, or Au. 8. The multilayer ceramic capacitor according to claim 1 , wherein a thickness of each of the plurality of internal electrode layers is about 0.3 μm or more and about 0.4 μm or less. 9. The multilayer ceramic capacitor according to claim 1 , wherein a thickness of each of the plurality of dielectric layers is about 0.10 μm or more and about 1.00 μm or less. 10. The multilayer ceramic capacitor according to claim 1 , wherein the first external electrode layer covers an entirety or substantially an entirety of the pair of end surfaces. 11. The multilayer ceramic capacitor according to claim 10 , wherein the first external electrode layers extends onto portions of each of the pair of main surfaces and the pair of side surfaces. 12. The multilayer ceramic capacitor according to claim 1 , wherein the plated layer includes at least one of a Ni plated layer or a Sn plated layer. 13. The multilayer ceramic capacitor according to claim 1 , wherein the plated layer includes a Ni plated layer and a Sn plated layer on the Ni plated layer. 14. The multilayer ceramic capacitor according to claim 1 , wherein the glass included in the second external electrode layer includes at least one of SiO 2 , Al 2 O 3 , TiO 2 , BaO 2 , or ZrO 2 .

Assignees

Inventors

Classifications

  • based on alkaline earth titanates · CPC title

  • Selection of materials · CPC title

  • H01G4/30Primary

    Stacked capacitors (H01G4/33 takes precedence) · CPC title

  • based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

  • Ceramic dielectrics {(H01G4/085 takes precedence)} · CPC title

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Frequently asked questions

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What does patent US12080487B2 cover?
A multilayer ceramic capacitor includes a multilayer body and a pair of external electrodes at both ends of the multilayer body in a length direction and covering a pair of end surfaces, and connected to internal electrode layers. The pair of external electrodes each include a first external electrode layer covering each of the end surfaces and connected to the internal electrode layers, a seco…
Who is the assignee on this patent?
Murata Manufacturing Co
What technology area does this patent fall under?
Primary CPC classification H01G4/30. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Sep 03 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 6 related publications on this page (citations in our corpus or others sharing the same primary CPC).