Method to form an inductive component

Patent metadata

Field	Value
Publication number	US-12080472-B2
Application number	US-202318242554-A
Country	US
Kind code	B2
Filing date	Sep 6, 2023
Priority date	Sep 6, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.

First claim

What is claimed is:

1. A method to form an inductive component, said method comprising:
providing a metal plate;
forming a metal structure by removing unwanted portions of the metal plate, said metal structure comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire, wherein a contiguous metal path is formed from a first lateral surface of the first electrode to a second lateral surface of the second electrode via the bare conductor wire; and
forming a magnetic body to encapsulate the bare conductor wire, and at least one portion of the first electrode and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.

2. The method according to claim 1 , wherein the step of forming the metal structure by removing unwanted portions of the metal plate comprises the sub-steps of:
removing at least one first portion of the metal plate to form a first electrode and a second electrode, wherein a contiguous metal path is formed from the first electrode to the second electrode via a remaining portion of the metal plate between the first electrode and the second electrode; and
removing at least one second portion of said remaining portion of the metal plate to form a bare conductor wire between the first electrode and the second electrode.

3. The method according to claim 1 , wherein a first top surface of the first electrode is exposed from the magnetic body.

4. The method according to claim 3 , wherein a bottom surface of the first electrode is exposed from the magnetic body.

5. The method according to claim 4 , wherein a bottom surface of the second electrode is exposed from the magnetic body.

6. The method according to claim 1 , wherein a second top surface of the second electrode is exposed from the magnetic body.

7. The method according to claim 1 , further comprising forming at least one first metal layer on a top surface of the first electrode, wherein a first top surface of the at least one first metal layer is exposed from the magnetic body.

8. The method according to claim 7 , further comprising forming at least one second metal layer on a top surface of the second electrode, wherein a second top surface of the at least one second metal layer is exposed from the magnetic body.

9. The method according to claim 7 , wherein the at least one first metal layer comprises nickel.

10. The method according to claim 8 , wherein the at least one second metal layer comprises nickel.

11. The method according to claim 1 , wherein the metal structure comprises copper.

12. The method according to claim 1 , wherein the metal structure is made of copper.

13. The method according to claim 1 , wherein the distance between a first top surface of the first electrode and a top surface of the bare conductor wire is at least 20 um.

14. The method according to claim 13 , wherein the distance between a second top surface of the second electrode and a top surface of the bare conductor wire is at least 20 um.

15. The method according to claim 1 , wherein the inductive component is an inductor.

16. The method according to claim 1 , wherein the bare conductor wire comprises a curved line.

17. The method according to claim 1 , wherein the bare conductor wire comprises a spiral coil.

18. The method according to claim 1 , wherein a first outer lateral surface of the first electrode and a second outer lateral surface of the second electrode are embedded inside the magnetic body.

19. The method according to claim 1 , wherein the first electrode and the second electrode are at two opposite sides of the bare conductor wire.

20. The method according to claim 1 , wherein the first electrode and the second electrode are at a same side of the bare conductor wire.

Assignees

• Cyntec Co Ltd

Inventors

• Wei Pei-I
• Chang Cheng-Hao
• Li Shing Tak

Classifications

• H01F17/02

  without magnetic core · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H01F41/005

  Impregnating or encapsulating (insulating of windings H01F41/12) · CPC title

• H05K2201/1003

  Non-printed inductor · CPC title

• H01F27/2828

  Construction of conductive connections, of leads · CPC title