X-ray sensitive materials for data protection

Patent metadata

Field	Value
Publication number	US-12079377-B2
Application number	US-202117189857-A
Country	US
Kind code	B2
Filing date	Mar 2, 2021
Priority date	Mar 2, 2021
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

A method, printed circuit board assembly (PCBA), and device comprising a PCBA are disclosed. The method includes obtaining a material comprising silver halide grains, incorporating the material into a PCBA having at least one component in contact with the material, detecting a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enacting a data protection response. The PCBA includes a material comprising silver halide grains, at least one component in contact with the material, and a monitoring component. The monitoring component is configured to detect a variation in electrical properties of the at least one component that is above a threshold variation and, in response, enact a data protection response.

First claim

What is claimed is:

1. A method, comprising:
obtaining a material comprising silver halide grains;
incorporating the material into a printed circuit board assembly (PCBA), the PCBA comprising at least one component in contact with the material;
detecting a variation in electrical properties of the at least one component that is above a threshold variation; and
in response to the detecting the variation, enacting a data protection response.

2. The method of claim 1 , wherein the enacting the data protection response comprises deleting data.

3. The method of claim 1 , wherein the enacting the data protection response comprises destroying circuit paths.

4. The method of claim 1 , wherein the enacting the data protection response comprises generating an alert.

5. The method of claim 1 , wherein the enacting the data protection response comprises mitigating damage caused by exposure to high energy radiation.

6. The method of claim 1 , further comprising detecting a second variation in the electrical properties of the at least one component that is above a second threshold variation.

7. The method of claim 1 , wherein the incorporating the material comprises emulsifying the material in a thermal interface material.

8. The method of claim 1 , wherein the incorporating the material comprises emulsifying the material in a conformal coating material.

9. The method of claim 1 , wherein the obtaining the material comprises forming shells around droplets of the silver halide grains in a colloidal material.

10. A printed circuit board assembly (PCBA), comprising:
a material comprising silver halide grains;
at least one component in contact with the material; and
a monitoring component configured to:
detect a variation in electrical properties of the at least one component that is above a threshold variation; and
in response to the detecting the variation, enact a data protection response.

11. The PCBA of claim 10 , wherein the material further comprises a carrier medium.

12. The PCBA of claim 10 , wherein the material is deposited on the surface of the at least one component.

13. The PCBA of claim 10 , wherein the material further comprises a colloidal material.

14. The PCBA of claim 10 , wherein the material further comprises a microcapsule containing the silver halide grains.

15. The PCBA of claim 14 , wherein the silver halide grains are embedded in a shell of the microcapsule.

16. The PCBA of claim 14 , wherein the silver halide grains are suspended in a colloidal material in a core of the microcapsule.

17. The PCBA of claim 10 , wherein the material further comprises a reducing agent.

18. A device, comprising:
a printed circuit board assembly (PCBA), comprising:
a material comprising silver halide grains;
at least one component in contact with the material; and
a monitoring component configured to:
detect a variation in electrical properties of the at least one component that is above a threshold variation; and
in response to the detecting the variation, enact a data protection response.

19. The device of claim 18 , further comprising a housing that is opaque to ultraviolet (UV) light.

20. The device of claim 18 , further comprising a UV-light sensor.

Assignees

• IBM

Inventors

• Campbell Eric J
• Doyle Matthew
• Jeanson Mark J
• Bartley Gerald
• Becker Darryl

Classifications

• H10W42/405

  using active circuits · CPC title

• G01R31/2801

  Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] (G01R31/318508 takes precedence; contactless testing G01R31/302; testing contacts or connections G01R31/66) · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• C09D7/61

  inorganic · CPC title

• G01T1/17

  Circuit arrangements not adapted to a particular type of detector {(pulse-selection circuits H03K, G01R)} · CPC title