Imaging system and method for material characterization of a sample

Patent metadata

Field	Value
Publication number	US-12078727-B2
Application number	US-202017066185-A
Country	US
Kind code	B2
Filing date	Oct 8, 2020
Priority date	Sep 14, 2020
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

An imaging system for material characterization of a sample is provided. Said imaging system comprises at least two imaging arrays configured to form at least one imaging array pair. In this context, the imaging system is configured to perform at least one reflection measurement with the aid of at least one imaging array. Furthermore, the imaging system is configured to perform at least one transmission measurement with the aid of the at least one imaging array pair. In addition to this, the imaging system is configured to determine material characteristics of the sample on the basis of the at least one reflection measurement and/or the at least one transmission measurement.

First claim

What is claimed is:

1. An imaging system for material characterization of a sample, the imaging system comprising:
at least two imaging arrays configured to form at least one imaging array pair, wherein the imaging system is configured to perform at least one reflection measurement with the aid of at least one imaging array, each of the at least two imaging arrays comprising or being a two-dimensional monostatic or multistatic array,

wherein the imaging system is configured to perform at least one transmission measurement with the aid of the at least one imaging array pair, and
wherein the imaging system is configured to determine material characteristics of the sample on the basis of the at least one reflection measurement and/or the at least one transmission measurement.

2. The imaging system according to claim 1 ,
wherein the sample comprises or is a device under test or a radome.

3. The imaging system according to claim 1 ,
wherein the respective imaging arrays of the corresponding imaging array pair are arranged in a manner that said respective imaging arrays face each other.

4. The imaging system according to claim 1 ,
wherein the respective imaging arrays of the corresponding imaging array pair are synchronized and/or phase coherent.

5. The imaging system according to claim 1 ,
wherein each of the at least two imaging arrays is placed at a desired angle of incidence.

6. The imaging system according to claim 1 ,
wherein the imaging system is configured to determine the electrical thickness across the sample and/or homogeneity information with respect to the sample on the basis of the at least one transmission measurement on corresponding phase information thereof.

7. The imaging system according to claim 1 ,
wherein the imaging system is configured to present the at least one transmission measurement and/or the at least one reflection measurement as at least one image in order to provide information regarding variations across the corresponding material plane of the sample.

8. The imaging system according to claim 1 ,
wherein the imaging system is configured to determine measurement results being comparable to reference measurement results provided by a vector network analyzer.

9. The imaging system according to claim 1 ,
wherein with respect to the at least one reflection measurement and/or the at least one transmission measurement, the imaging system is configured to perform at least one broadband measurement across several frequencies in order to determine a frequency response for various locations of the sample.

10. The imaging system according to claim 9 ,
wherein the imaging system is configured to determine the relative permittivity; of the sample on the basis of the frequency response.

11. An imaging method for material characterization of a sample, the imaging method comprising the steps of:
forming at least one imaging array pair with the aid of at least two imaging arrays,
performing at least one reflection measurement with the aid of at least one of the at least two imaging arrays,
performing at least one transmission measurement with the aid of at least one of the at least one imaging array pair, and
determining material characteristics of the sample on the basis of the at least one reflection measurement and/or the at least one transmission measurement.

12. The imaging method according to claim 11 ,
wherein the imaging method further comprises the step of determining the electrical thickness across the sample and/or homogeneity information with respect to the sample on the basis of the at least one transmission measurement on corresponding phase information thereof.

13. An imaging system for material characterization of a sample, the imaging system comprising:
at least two imaging arrays configured to form at least one imaging array pair, wherein the imaging system is configured to perform at least one two-dimensional reflection measurement with the aid of at least one imaging array, each of the at least two imaging arrays comprising or being a two-dimensional monostatic or multistatic array,

wherein the imaging system is configured to perform at least one two-dimensional transmission measurement with the aid of the at least one imaging array pair, and
wherein the imaging system is configured to determine material characteristics of the sample on the basis of the at least one two-dimensional reflection measurement and/or the at least one two-dimensional transmission measurement.

Assignees

• Rohde & Schwarz

Inventors

• Gumbmann Frank
• Simper Benedikt
• Hamberger Gerhard
• Vonloesecke Andreas
• Beer Matthias

Classifications

• H01Q1/42

  Housings not intimately mechanically associated with radiating elements, e.g. radome · CPC title

• G01S17/003

  Bistatic lidar systems; Multistatic lidar systems · CPC title

• G01S7/4863

  Detector arrays, e.g. charge-transfer gates · CPC title

• G01S13/87

  Combinations of radar systems, e.g. primary radar and secondary radar · CPC title

• G01S7/4004

  of parts of a radar system · CPC title