Shaped dielectric component cross-linked via irradiation and method of making thereof

Patent metadata

Field	Value
Publication number	US-12077658-B2
Application number	US-202016953481-A
Country	US
Kind code	B2
Filing date	Nov 20, 2020
Priority date	Nov 22, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

A cured, shaped dielectric component, including a crosslinked product of a composite comprising a thermoplastic polymer, an optional crosslinking co-agent, an optional cure initiator, an optional additive composition, and a ceramic filler composition; wherein the cured, shaped dielectric component has a permittivity of 1.1 to 20 at 10 GHz; and wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.

First claim

What is claimed is:

1. A cured, shaped dielectric component, comprising
a crosslinked product of a composite comprising
a thermoplastic polymer,
an optional crosslinking co-agent,
an optional cure initiator,
an optional additive composition, and
a ceramic filler composition;

wherein the cured, shaped dielectric component has
a permittivity of 1.1 to 20 at 10 GHz, and
wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.

2. The cured, shaped dielectric component of claim 1 , wherein the thermoplastic polymer has a melt flow index of less than 5 grams per 10 minutes measured at 190° C., 2.16 kg, in accordance with ASTM D1238-20.

3. The cured, shaped dielectric component of claim 1 , wherein the thermoplastic polymer comprises a polyethylene, a polypropylene, a polymethylpentene, a fluorinated ethylene propylene copolymer, a polynorbornene, a styrene-ethylene-propylene-styrene block copolymer, or a combination thereof.

4. The cured, shaped dielectric component of claim 1 , wherein the thermoplastic polymer comprises a low-density polyethylene or a linear low-density polyethylene.

5. The cured, shaped dielectric component of claim 1 , wherein the crosslinked product comprises a residue of a crosslinking co-agent.

6. The cured, shaped dielectric component of claim 1 , wherein the crosslinked product comprises no residue of a crosslinking co-agent; and wherein the thermoplastic polymer comprises a thermoplastic polymer that self-crosslinks upon irradiation.

7. The cured, shaped dielectric component of claim 1 , wherein the cure initiator is present and has an initiation temperature greater than a processing temperature of the thermoplastic polymer.

8. The cured, shaped dielectric component of claim 1 , wherein all of the crosslinking co-agent, the cure initiator, and the additive composition are present.

9. The cured, shaped dielectric component of claim 1 , wherein the crosslinking co-agent is present and comprises triallyl cyanurate, triallyl isocyanurate, triallyl phosphate, polybutadiene, zinc diacrylate, zinc dimethacrylate, divinyl benzene, vinyl terminated polyphenylene ether oligomers, m-phenylene dimaleimide, trimethylol propane trimethacrylate, tetramethylene glycol diacrylate, trifunctional acrylic ester, dipentaerythritol pentaacrylate, or a combination thereof.

10. The cured, shaped dielectric component of claim 1 , wherein the additive composition is present and comprises an antioxidant, a metal deactivator, a process aide, an adhesion promoter, or a combination thereof.

11. The cured, shaped dielectric component of claim 1 , wherein the ceramic filler comprises fumed silica, titanium dioxide, barium titanate, strontium titanate, corundum, wollastonite, Ba 2 Ti 9 O 20 , hollow ceramic spheres, boron nitride, aluminum nitride, silicon carbide, beryllia, alumina, alumina trihydrate, magnesia, mica, talc, nanoclay, magnesium hydroxide, solid glass spheres, hollow glass spheres, or a combination thereof.

12. The cured, shaped dielectric component of claim 1 , wherein the ceramic filler has a multimodal particle size distribution, wherein a peak of a first mode of the multimodal particle size distribution is at least seven times that of a peak of a second mode of the multimodal particle size distribution.

13. The cured, shaped dielectric component of claim 1 , wherein the composite before crosslinking comprises
50 to 95 wt % of the thermoplastic polymer,
0 to 10 wt % of the crosslinking co-agent,
0 to 5 wt % the cure initiator,
0 to 2 wt % of the additive composition, and
5 to 50 wt % of the ceramic filler composition,
each based on the total weight of the composite before crosslinking, and wherein the total is 100 wt %, and
wherein the permittivity of the cured, shaped dielectric component is 1.1 to 6, measured at 10 GHz.

14. The cured, shaped dielectric component of claim 1 , wherein the composite before crosslinking comprises
10 to 50 wt % of the thermoplastic polymer,
0 to 10 wt % of the crosslinking co-agent,
0 to 5 wt % the cure initiator,
0 to 2 wt % of the additive composition, and
50 to 90 wt % of the ceramic filler composition,
each based on the total weight of the composite before crosslinking, and wherein the total is 100 wt %, and
wherein the permittivity of the cured, shaped dielectric component is greater than 6, measured at 10 GHz.

15. The cured, shaped dielectric component of claim 1 , wherein a linear dimensional change in the component before curing compared to after curing is less than 2% in any or all linear dimensions.

16. The cured, shaped dielectric component of claim 1 , wherein the component is a dielectric resonator antenna, a dielectric portion of a dielectric resonator antenna, an electromagnetic waveguide, a dielectric electromagnetic lens, a radio-frequency component, a microwave component, an mm-wave component, a terahertz component, or an optical component.

17. The cured, shaped dielectric component of claim 1 , wherein the component is a dielectric electromagnetic lens, preferably a dielectric electromagnetic lens configured to operate at a frequency greater than 5 GHz and less than 300 GHz.

18. A circuit material or circuit substrate comprising the cured, shaped dielectric component of claim 1 .

19. A method of making the cured, shaped dielectric component of claim 1 , the method comprising:
compounding a composite comprising the thermoplastic polymer, the optional crosslinking co-agent, the optional cure initiator, the optional additive composition, and the ceramic filler composition;
melting the compounded composite to form a melt;
shaping the melt to form a shaped article; and
exposing the shaped article to radiation to generate sufficient free radicals in the thermoplastic polymer and crosslink at least a portion of the thermoplastic polymer to form the cured, shaped dielectric component.

20. A cured, shaped dielectric component, comprising
a crosslinked product of a composite comprising
10 to 95 wt % of a thermoplastic polymer having a melt flow index of less than 5 grams per 10 minutes measured at 190° C., 2.16 kg, in accordance with ASTM D1238-20,
0.25 to 10 wt % of a crosslinking co-agent,
0.01 to 5 wt % of a cure initiator,
0.0001 to 2 wt % of a additive composition, and
5 to 90 wt % of a ceramic filler composition comprising silica, titanium dioxide, or a combination thereof,
each based on the total weight of the composite before crosslinking, and wherein the total is 100 wt %,

wherein the cured, shaped dielectric component has
a permittivity of 1.1 to 20 at 10 GHz measured in accordance with “Stripline Test for Permittivity and Loss Tangent at X-Band” test method IPC-TM-650 2.5.5.5 at a temperature of 23 to 25° C., and
wherein the cured, shaped dielectric component has no melt flow index when tested at 190° C., 2.16 kg, in accordance with ASTM D1238-20.

Assignees

• Rogers Corp

Inventors

• Blasius William
• O'Connor Stephen

Classifications

• H01Q15/08

  formed of solid dielectric material · CPC title

• C08L2312/06

  by radiation · CPC title

• C08L2207/066

  LDPE (radical process) · CPC title

• C08K2201/002

  Physical properties · CPC title

• C08K2003/2241

  Titanium dioxide · CPC title