3d semiconductor device and structure
US-2018331073-A1 · Nov 15, 2018 · US
US12077428B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-12077428-B2 |
| Application number | US-202117411707-A |
| Country | US |
| Kind code | B2 |
| Filing date | Aug 25, 2021 |
| Priority date | Aug 27, 2020 |
| Publication date | Sep 3, 2024 |
| Grant date | Sep 3, 2024 |
A practical reading order for non-experts. Skip the full description unless you need deep technical detail.
What the patent document calls the invention.
A short plain-language summary of the technical disclosure.
Who owns or filed the patent and who is credited as inventor.
Filing, priority, publication, and grant dates set the timeline.
The legal scope of protection — read this for what is actually claimed.
Technology tags used to group this patent with similar filings.
Prior art links and similar publications in this corpus.
Official abstract text for this publication.
Compositions and methods related to multiaxially straining defect doped materials as well as their use in electrical circuits are generally described.
Opening claim text (preview).
What is claimed is: 1. An electrical device comprising: a defect doped material forming at least a portion of an electrical circuit; and one or more actuators configured to selectively apply a multiaxial strain to at least a first portion of the defect doped material, wherein the defect doped material is a non-conducting material when the defect doped material is in an unstrained state, and wherein at least a second portion of the defect doped material is a semiconducting material or a conducting material when the one or more actuators apply the multiaxial strain to the defect doped material in a strained state, wherein an activation energy to ionize defects of the defect doped material in the strained state is less than the activation energy to ionize the defects when the defect doped material is in the unstrained state. 2. The electrical device of claim 1 , wherein at least two externally-applied mechanical forces applied to the defect doped material are substantially non-parallel. 3. The electrical device of claim 1 , wherein the multiaxial strain is non-uniform in the defect doped material. 4. The electrical device of claim 1 , wherein the multiaxial strain results from application of stress to a stress concentrator of the defect doped material. 5. The electrical device of claim 1 , wherein the electrical device is configured to apply the multiaxial strain by translating two or more actuators in nonparallel directions. 6. The electrical device of claim 1 , wherein the electrical circuit is configured to transmit current from a first electrode connected to the defect doped material to a second electrode connected to the defect doped material through the second portion of the defect doped material when the defect doped material is selectively strained by the one or more actuators. 7. The electrical device of claim 1 , wherein the defect doped material is single-phase in the strained state. 8. The electrical device of claim 1 , wherein the defect doped material is thermodynamically stable in the strained state. 9. The electrical device of claim 1 , wherein the first portion comprises the second portion. 10. A composition comprising: a defect doped material, wherein a multiaxial strain is applied to at least a first portion of the defect doped material in a strained state, wherein the defect doped material is a non-conducting material when the defect doped material is in an unstrained state, and wherein at least a second portion of the defect doped material is a semiconducting material or a conducting material when the multiaxial strain is applied to the defect doped material, wherein an activation energy to ionize defects of the defect doped material in the strained state is less than the activation energy to ionize the defects when the defect doped material is in the unstrained state. 11. The composition of claim 10 , wherein at least two externally-applied mechanical forces applied to the defect doped material are substantially non-parallel. 12. The composition of claim 10 , wherein the multiaxial strain is non-uniform in the defect doped material. 13. The composition of claim 10 , wherein the multiaxial strain results from application of stress to a stress concentrator of the defect doped material. 14. The composition of claim 10 , wherein the defect doped material is single-phase in the strained state.
Numerical modelling · CPC title
using machine learning, e.g. artificial intelligence, neural networks, support vector machines [SVM] or training a model · CPC title
Devices controlled by mechanical forces, e.g. pressure · CPC title
Impurity distributions or concentrations · CPC title
Orientations of crystalline planes · CPC title
Related publications grouped by family.
Answers are generated from the same data shown on this page.