Production method for bonded article, and bonded article

Patent metadata

Field	Value
Publication number	US-12076972-B2
Application number	US-202017621235-A
Country	US
Kind code	B2
Filing date	Jul 1, 2020
Priority date	Jul 5, 2019
Publication date	Sep 3, 2024
Grant date	Sep 3, 2024

Abstract

In order to thermally cure a thermosetting adhesive quickly and with less energy, the bonded article (10) according to the present invention comprises an adherend member (1) having a thermal conductivity of 1 w/m·K or more, an adherend member (2) made of a material which can adhere to the adherend member (1), and an adhesion portion that is formed of a cured product of a thermosetting adhesive (3) and that is in contact with both the adherend member (1) and the adherend member (2), wherein the adherend member (1) has a heat transfer-inhibiting structure (4) which inhibits the transfer of heat from a portion thereof in contact with the adhesive (3) to a peripheral portion thereof.

First claim

What is claimed is:

1. A bonded article, comprising:
a first member having a thermal conductivity of 1 w/m·K or more, and having a concave portion;
a second member made of a material able to adhere to the first member; and
an adhesion portion that is formed of a cured product of a thermosetting adhesive and that is in contact with both the first member and the second member, and injected into the concave portion, wherein
the first member comprises a heat transfer-inhibiting structure that is separated from the concave portion, and inhibits transfer of heat from a portion in contact with the adhesion portion to a peripheral portion.

2. The bonded article according to claim 1 , wherein
the heat transfer-inhibiting structure comprises concave grooves arranged between the portion in contact with the adhesion portion and the peripheral portion in the first member.

3. The bonded article according to claim 1 , wherein
the heat transfer-inhibiting structure comprises non-through holes arranged between the portion in contact with the adhesion portion and the peripheral portion in the first member.

4. A bonded article, comprising:
a first member having a thermal conductivity of 1 w/m·K or more,
a second member made of a material able to adhere to the first member; and
an adhesion portion that is formed of a cured product of a thermosetting adhesive and that is in contact with both the first member and the second member,
wherein the first member comprises a heat transfer-inhibiting structure that inhibits transfer of heat from a portion in contact with the adhesion portion to a peripheral portion, and the heat transfer-inhibiting structure comprises a thin-wall portion that is arranged closer to a side of the peripheral portion than the portion in contact with the adhesion portion in the first member and has a thickness smaller than that of the portion in contact with the adhesion portion.

5. A bonded article, comprising:
a first member having a thermal conductivity of 1 w/m·K or more,
a second member made of a material able to adhere to the first member; and
an adhesion portion that is formed of a cured product of a thermosetting adhesive and that is in contact with both the first member and the second member,
wherein the first member comprises a heat transfer-inhibiting structure that inhibits transfer of heat from a portion in contact with the adhesion portion to a peripheral portion, and the heat transfer-inhibiting structure comprises a narrow width portion that is narrower than or has a same width as the portion of in contact with the adhesion portion in the first member, and hollow portions penetrating the first member are formed by the narrow width portion.

6. A bonded article, comprising:
a first member having a thermal conductivity of 1 w/m·K or more;
a second member made of a material able to adhere to the first member; and
an adhesion portion that is formed of a cured product of a thermosetting adhesive and that is in contact with both the first member and the second member, wherein
in the first member, an amount of transfer of heat of a first material constituting a portion in contact with the adhesion portion is smaller than that of a second material constituting a portion other than the portion in contact, wherein the portion in contact with the adhesion portion made of the first material has smaller thermal conductivity than the portion other than the portion in contact made of the second material.

7. The bonded article according to claim 6 , wherein the portion in contact with the adhesion portion and the portion other than the portion in contact are configured by separate members, and
the portion in contact with the adhesion portion is arranged as a nesting member inserted into the portion other than the portion in contact.

8. A production method for a bonded article, which is a production method for a bonded article of a first member having a thermal conductivity of 1 w/m·K or more, and having a concave portion, and a second member made of a material able to adhere to the first member, the production method comprising:
an applying step of applying a thermosetting adhesive into the concave portion of the first member so as to contact both the first member and the second member; and
a heat-inputting step of introducing heat from a surface of the first member different from an application surface of the adhesive toward an application region of the adhesive, wherein
the first member comprises a heat transfer-inhibiting structure that is separated from the concave portion, and inhibits transfer of heat from a heat-inputting portion into which heat is introduced to a peripheral portion.

9. A production method for a bonded article, which is a production method for a bonded article of a first member having a thermal conductivity of 1 w/m·K or more and a second member made of a material able to adhere to the first member, the production method comprising:
an applying step of applying a thermosetting adhesive so as to contact both the first member and the second member, and
a heat-inputting step of introducing heat from a surface of the first member different from an application surface of the adhesive toward an application region of the adhesive, wherein
in the first member, an amount of transfer of heat of a first material constituting a heat-inputting portion into which heat is introduced is smaller than that of a second material constituting a portion other than the heat-inputting portion, wherein the first material has smaller thermal conductivity than the second material.

Assignees

• Omron Tateisi Electronics Co

Inventors

• Hiramitsu Norihito
• Komori Takekazu

Classifications

• C09J5/06 Primary

  involving heating of the applied adhesive · CPC title

• B32B2551/00

  Optical elements · CPC title

• B32B2307/302

  Conductive · CPC title

• B32B37/1207

  Heat-activated adhesive (B32B37/04 takes precedence) · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title