Conductive particle interconnect switch

Patent metadata

Field	Value
Publication number	US-12075702-B2
Application number	US-202217811374-A
Country	US
Kind code	B2
Filing date	Jul 8, 2022
Priority date	May 17, 2019
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

Provided is an apparatus comprising a conductive particle interconnect (CPI). The CPI includes an elastomeric carrier and a plurality of conductive particles dispersed therein. The elastomeric carrier includes an electroactive polymer (EAP) configured to move between a first position and a second position in response to an electrical field. The CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and a second electrical resistance when the EAP is in the second position. The apparatus further comprises one or more electrodes electrically coupled to the CPI. The electrodes are configured to generate the electrical field within the CPI. The apparatus further comprises one or more insulators coupled to the CPI. The one or more insulators are configured to constrain expansion of the CPI in at least one direction.

First claim

What is claimed is:

1. A method comprising:
determining a target state of a conductive particle interconnect (CPI), wherein the CPI includes an elastomeric carrier having an electroactive polymer (EAP) configured to move between a first position and a second position in response to application of an electrical field, the CPI further including a plurality of conductive particles, wherein the second position is associated with the target state;
generating an input signal based on the target state;
transmitting the input signal to a voltage source to cause the voltage source to apply the electrical field to the EAP to move the EAP to the second position;
monitoring, after transmitting the input signal to the voltage source, an output of the CPI, wherein monitoring the output of the CPI includes determining a resistance of the CPI;
determining, based on the monitoring, whether the CPI is in the target state; and
adjusting, in response to determining that the CPI is not in the target state, a voltage applied to the EAP, wherein the adjusting includes:
in response to the resistance of the CPI being too high, decreasing the voltage applied to the EAP to cause further compression of the CPI; and
in response to the resistance of the CPI being too low, increasing the voltage applied to the EAP to reduce compression of the CPI.

2. The method of claim 1 , the method further comprising:
determining a target voltage associated with the target state, wherein the target voltage is a voltage that causes the EAP to move to the second position; and
applying, by the voltage source, the target voltage to the EAP.

3. The method of claim 1 , wherein the plurality of conductive particles includes one or more selected from the group consisting of copper particles, silver particles, gold particles, and nickel particles.

4. The method of claim 1 , wherein:
the CPI is configured to act as a switch having two or more states, each of the two or more states having an associated position of the EAP; and
transmitting the input signal to the voltage source causes the EAP to move into a position associated with the target state.

5. The method of claim 1 , wherein:
the CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and to exhibit a second electrical resistance when the EAP is in the second position.

6. The method of claim 1 , the method further comprising:
detecting that a temperature of the EAP is below a threshold;
applying, in response to detecting that the temperature of the EAP is below the threshold, a DC bias voltage to the EAP, the DC bias voltage being a voltage that causes expansion of the EAP so as to offset constriction caused by the temperature.

7. A system comprising:
a conductive particle interconnect (CPI) comprising:
an elastomeric carrier having an electroactive polymer (EAP), the EAP being configured to move between a first position and a second position in response to application of an electrical field; and
a plurality of conductive particles disposed in the elastomeric carrier;

a voltage source coupled to the CPI;
a temperature sensor configured to measure a temperature of the EAP; and
processing logic configured to perform a method comprising:
determining a target state of the CPI, the target state being associated with the second position;
generating an input signal based on the target state;
transmitting the input signal to the voltage source to cause the voltage source to apply the electrical field to the CPI to move the EAP to the second position; and
applying, in response to detecting that the temperature of the EAP is below a threshold, using the voltage source, a DC bias voltage to the EAP, the DC bias voltage being a voltage that causes expansion of the EAP so as to offset constriction caused by the temperature.

8. The system of claim 7 , wherein:
the CPI is configured to act as a switch having two or more states, each of the two or more states having an associated position of the EAP.

9. The system of claim 7 , wherein:
the CPI is configured to exhibit a first electrical resistance when the EAP is in the first position and to exhibit a second electrical resistance when the EAP is in the second position.

10. The system of claim 7 , wherein the plurality of conductive particles includes one or more selected from the group consisting of copper particles, silver particles, gold particles, and nickel particles.

11. The system of claim 7 , wherein the method further comprises:
monitoring, after transmitting the input signal to the voltage source, an output of the CPI; and
determining, based on the monitoring, whether the CPI is in the target state.

12. A computer program product comprising a computer readable storage medium having program instructions embodied therewith, the program instructions executable by processor to cause the processor to perform a method comprising:
determining a target state of a conductive particle interconnect (CPI), wherein the CPI includes an elastomeric carrier having an electroactive polymer (EAP) configured to move between a first position and a second position in response to application of an electrical field, the CPI further including a plurality of conductive particles, wherein the second position is associated with the target state;
generating an input signal based on the target state;
transmitting the input signal to a voltage source to cause the voltage source to apply the electrical field to the EAP to move the EAP to the second position;
monitoring, after transmitting the input signal to the voltage source, an output of the CPI, wherein monitoring the output of the CPI includes determining a resistance of the CPI;
determining, based on the monitoring, whether the CPI is in the target state; and
adjusting, in response to determining that the CPI is not in the target state, a voltage applied to the EAP, wherein the adjusting includes:
in response to the resistance of the CPI being too high, increasing the voltage applied to the EAP to cause further compression of the CPI; and
in response to the resistance of the CPI being too low, decreasing the voltage applied to the EAP to reduce compression of the CPI.

13. The computer program product of claim 12 , wherein the method further comprises:
determining a target voltage associated with the target state, wherein the target voltage is a voltage that causes the EAP to move to the second position; and
applying, by the voltage source, the target voltage to the EAP.

14. The computer program product of claim 12 , wherein the plurality of conductive particles includes one or more selected from the group consisting of copper particles, silver particles, gold particles, and nickel particles.

Assignees

• IBM

Inventors

• Doyle Matthew
• Kuczynski Joseph
• Egan Patrick
• Judd Jeffrey N
• Tofil Timothy J

Classifications

• H10N30/857

  Macromolecular compositions · CPC title

• H01H57/00

  Electrostrictive relays; Piezoelectric relays · CPC title

• H01H1/029 Primary

  comprising conducting material dispersed in an elastic support or binding material · CPC title

• H10N30/852

  Composite materials, e.g. having 1-3 or 2-2 type connectivity · CPC title

• H10N30/206

  using only longitudinal or thickness displacement, e.g. d33 or d31 type devices · CPC title