Dual mode cooling system for use with in-wall video-codec and other electronic circuits

Patent metadata

Field	Value
Publication number	US-12075595-B2
Application number	US-202217858527-A
Country	US
Kind code	B2
Filing date	Jul 6, 2022
Priority date	Jul 6, 2022
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

Described herein is a compact combined active and passive cooling system to cool electronic audio-video circuitry, wherein all of the AV circuitry and cooling system fits within an enclosure that can be installed in a standard wall gang-box located in interior walls of structures. The combined active and passive cooling system uses convection, conduction, and radiation in active and passive cooling modes to dissipate heat generated by the AV circuitry into the room in which the gang box is located, and further uses the wall plate surface to dissipate heat into the room.

First claim

What is claimed is:

1. A dual mode cooling system, comprising:
electronic heat generating circuitry;
a printed circuit board upon which the electronic heat generating circuitry is located on a first side;
a substantially adiabatic enclosure adapted to house the electronic heat generating circuitry, printed circuit board and other components of the dual mode cooling system;
a finned heat sink adapted to be in thermal contact with the electronic heat generating circuitry, the finned heat sink comprising a plurality of heat radiating fins;
a faceplate adapted to enclose the substantially adiabatic enclosure and seal the substantially adiabatic enclosure against an interior wall, and wherein the faceplate comprises—
a cool air intake port adapted to receive cool air from an area external to the substantially adiabatic enclosure and provide the cool air to an interior portion of the substantially adiabatic enclosure, and
a heated air exhaust port adapted to exhaust heated air out of the enclosure into an area external to the enclosure;

a fan adapted to receive cool air from the cool air intake port and blow the cool air through the plurality of heat radiating fins of the finned heat sink to remove substantially all of the heat generated by the electronic heat generating circuitry via convection and generate heated air, and wherein the heated air is exhausted through the heated air exhaust port by the fan, and wherein an active cooling path comprises a path of air as it is received from the cool air intake, passes through the fan, over the heated surface, and then is exhausted from the heated air exhaust portal, and further wherein,
the heated air exhaust port comprises—
one or more holes in the faceplate formed at a first acute angle β with respect to an imaginary line perpendicular to the surface of the faceplate such that the heated exhaust air is expelled away from the faceplate in a first direction, and

the cool air intake portal comprises—
one or more holes in the faceplate formed at a second acute angle α with respect to an imaginary line perpendicular to the surface of the faceplate such that the cool intake air is ingested into the substantially adiabatic enclosure from a second direction, and wherein
the first and second acute angles are in opposition to each other, and further wherein
the heated air exhaust port is separated with respect to the cool air intake port; and

a first passive cooling path comprising:
the electronic heat generating circuitry;
the printed circuit board (PCB) upon which the electronic heat generating circuitry is located;
one or more through hole thermal vias located in the PCB that are each adapted to be in thermal contact with the electronic heat generating circuitry and to accept heat generated by the electronic heat generating circuitry and transfer the heat generated by the electronic heat generating circuitry;
a first heat conducting device adapted to be in thermal contact with the one or more through holes vias, and which is adapted to transfer heat via conduction from the one or more through hole vias, and which is further adapted to be a compressible gap pad to form a thermal transfer path between two objects;
a second heat conducting device adapted to be in thermal contact with the first heat conducting device and to accept heat conducted by the first heat conducting device; and
a third heat conducting device adopted to be in thermal contact with the second heat conducting device and to accept heat conducted from the first heat conducting device and is further adapted to be compressible to form a thermal transfer path between two objects, and wherein
the face plate is adapted to be in thermal contact with the third heat conducting device and to accept heat conducted from the second heat conducting device, and is further adapted to convectively transfer received heat from its surface to air surrounding the face plate.

2. The dual mode cooling system according to claim 1 , further comprising:
a second passive cooling path comprising:
the electronic heat generating circuitry; and
a finned heat sink located on the electronic heat generating circuitry, and which is adapted to be in thermal contact with the electronic heat generating circuitry and to accept heat conducted from the electronic heat generating circuitry.

3. The dual mode cooling system according to claim 1 , wherein
the heated air exhaust port is cater cornered with respect to the cool air intake port.

4. The dual mode cooling system according to claim 1 , wherein
the combination of the passive cooling paths is adapted to transfer heat to and through the faceplate such that following the electronic heat generating circuitry being put into an inactive state and the fan being shut off, the combination of the passive cooling paths convectively transfers heat away from the interior of the substantially adiabatic enclosure through the faceplate such that the faceplate remains at a temperature below an unsafe temperature.

5. The dual mode cooling system according to claim 4 , wherein
the convective transfer of heat away from the faceplate and interior of the substantially adiabatic enclosure is such that the faceplate remains at a temperature below an unsafe temperature occurs through the conductive transfer of heat to a first area of the faceplate.

6. The dual mode cooling system according to claim 5 , wherein
the unsafe temperature is about 70° C.

7. The dual mode cooling system according to claim 1 , further comprising:
a baffle wall that separates an interior of the substantially adiabatic enclosure into a cool air baffle zone and a heated air baffle zone, such that substantially only cool air is located in the cool air baffle zone and substantially only heated air is located in the heated air baffle zone.

8. The dual mode cooling system according to claim 7 , further comprising:
at least one or more holes in the printed circuit board that allow cool air to flow from one side of the printed circuit board to the other side of the printed circuit board in the cool air baffle zone; and
at least one or more holes in the printed circuit board that allow heated air to flow from one side of the printed circuit board to the other side of the printed circuit board in the heated air baffle zone.

9. The dual mode cooling system according to claim 1 , wherein the faceplate comprises:
at least one audio video signal connector.

10. The dual mode cooling system according to claim 1 , wherein the electronic heat generating circuitry comprises:
audio-video processing circuitry.

11. The dual mode cooling system according to claim 1 , wherein the substantially adiabatic enclosure comprises:
a standard gang box.

12. The dual mode cooling system according to claim 11 , wherein the standard gang box can be located within an insulated wall.

13. The dual mode cooling system according to claim 1 , further comprising:
one or more through hole thermal vias located in the printed circuit board that are each adapted to be in thermal contact with the electronic heat generating circuitry and to accept heat generated by the electronic heat generating circuitry and to transfer the same to the finned heat sink, the finned heat sink located on a second side of the printed circuit board.

14. The dual mode cooling system according to claim 1 , wherein
the cool air intake port comprises—
one or more holes in the faceplate formed at an angle α with respect to a first imaginary line that is formed perpendicular to an outer surface of the faceplate, such that the cool intake air is ingested into the substantially adiabati

Assignees

• Creston Electronics Inc
• Crestron Electronics Inc

Inventors

• Labosco Mark
• Upasani Sanjay
• Joy Edward
• Pagano Dario
• Magrini Alec

Classifications

• H05K7/20418

  the radiating structures being additional and fastened onto the housing · CPC title

• H05K7/20127

  Natural convection · CPC title

• H05K7/20145

  Means for directing air flow, e.g. ducts, deflectors, plenum or guides · CPC title

• H05K7/205

  Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB] (details of PCBs relating to heat transfer H05K1/0201) · CPC title

• G06F1/206

  comprising thermal management · CPC title