Power module

Patent metadata

Field	Value
Publication number	US-12074097-B2
Application number	US-202118265700-A
Country	US
Kind code	B2
Filing date	May 17, 2021
Priority date	May 17, 2021
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

A power module includes: a resin mold; and a lead frame in which a first region is drawn out from a first surface of the resin mold, and a second region extending from the first region in a direction perpendicular to the first surface is sealed inside the resin mold. The first region is bent toward a second surface of the resin mold along the first surface, and the first surface has a shape in which a bending angle is larger than 90 degrees, in which the bending angle is an angle formed by two regions, in the lead frame, adjacent to each other with a bent portion formed by bending the first region interposed in between.

First claim

The invention claimed is:

1. A power module comprising:
a resin mold; and
a lead frame in which a first region of the lead frame is drawn out from a first surface of the resin mold, and a second region of the lead frame extending from the first region in a direction perpendicular to the first surface is sealed inside the resin mold, wherein
the first region of the lead frame is bent toward a second surface of the resin mold along the first surface of the resin mold, and
the first surface of the resin mold has a shape in which a bending angle is larger than 90 degrees, the bending angle being an angle formed by two regions of the lead frame, the two regions being adjacent to each other with a bent portion formed by bending the first region interposed in between.

2. The power module according to claim 1 , wherein
the first surface includes a protruding portion protruding outward, in at least a part of a region, from a position where the first region is drawn out to an end portion on the second surface side, and
the first region is bent toward the second surface along the protruding portion.

3. The power module according to claim 2 , wherein
the first region is provided with a notch at a position corresponding to the bent portion.

4. The power module according to claim 3 , wherein
the notch is a groove formed on an outer surface along a width direction of the first region, the outer surface being surface not facing the protruding portion among two surfaces of the first region facing each other in a thickness direction of the first region.

5. The power module according to claim 3 , wherein
the notch is a perforation formed along a width direction of the first region.

6. The power module according to claim 2 , comprising:
a screw terminal provided in the first region, the first region being bent toward the second surface along the protruding portion and placed on an inclined surface of the protruding portion.

7. The power module according to claim 1 , comprising:
a first terminal provided at a distal end portion of the first region and placed on the second surface; and
a second terminal provided at a height position different from a height position of the first terminal.

8. The power module according to claim 7 , wherein
the second terminal is provided at a distal end portion of a lead frame drawn out from the first surface in a direction perpendicular to the first surface.

9. A power module comprising:
a resin mold; and
a lead frame, wherein
a first region of the lead frame is drawn out from a first surface of the resin mold, and
a second region of the lead frame is sealed inside the resin mold and extends from the first region of the lead frame in a direction perpendicular to the first surface,
a bent region of the lead frame is formed between the first region of the lead frame and the second region of the lead frame to create a bending angle between an extending direction of the first region of the lead frame and an extending direction of the second region of the lead frame, the bending angle being greater than 90 degrees, and
a surface of the resin mold has a shape matching the bending angle.

10. The power module according to claim 9 , wherein
the bending angle is measured on a side of the lead frame closest to the resin mold.

Assignees

• Mitsubishi Electric Corp

Inventors

• Fukumoto Akihisa
• Goto Masaki

Classifications

• H10W74/47

  comprising organic materials, e.g. plastics or resins · CPC title

• H10W70/465

  Bumps or wires · CPC title

• H10W70/481

  for devices being provided for in groups H10D8/00 - H10D48/00 · CPC title

• H10W70/424

  Cross-sectional shapes (H10W70/481 takes precedence) · CPC title

• H10W70/429

  being the outer leads · CPC title