Pressure sensor device

Patent metadata

Field	Value
Publication number	US-12072256-B2
Application number	US-202017639167-A
Country	US
Kind code	B2
Filing date	Aug 28, 2020
Priority date	Sep 9, 2019
Publication date	Aug 27, 2024
Grant date	Aug 27, 2024

Abstract

A sensor element suitable for miniaturization. This pressure sensor element has: a metal plate; an insulating film provided on a first surface, which is one surface of the metal plate, so as to form a covered region in which the first plate is covered and an exposed region in which the first surface is exposed; and a pressure detection circuit formed on the insulating film so as to be insulated from the first surface by means of the insulating film.

First claim

What is claimed is:

1. A pressure sensor device, comprising:
a metal plate configured to be deformed in accordance with a pressure;
an insulating film provided on a first surface of the metal plate so as to form a covered region where the first surface is covered and an exposed region where the first surface is exposed; and
a pressure detection circuit formed on the insulating film so as to be insulated from the first surface by the insulating film, wherein
the pressure detection circuit includes a strain gauge configured to detect a deformation occurring in the metal plate,
a second surface of the metal plate opposite the first surface of the metal plate includes a welded portion to be welded to a housing, and
at least a part of the welded portion overlaps with the exposed region when seen from a direction orthogonal to the first surface.

2. The pressure sensor device according to claim 1 , wherein
the exposed region continues in a circumferential direction so as to surround a part where the pressure detection circuit is formed in the covered region.

3. The pressure sensor device according to claim 2 , wherein the exposed region continues along an outer periphery of the first surface.

4. The pressure sensor device according to claim 1 , wherein
a recess sinking toward the first surface side is formed on a second surface opposite the first surface of the metal plate.

5. The pressure sensor device according to claim 1 , wherein
a protruding portion protruding toward an opposite side of the first surface side is formed on the second surface opposite the first surface of the metal plate;
a dented portion corresponding to the protruding portion on the second surface is formed on the first surface; and
the welded portion is formed on the protruding portion.

6. The pressure sensor device according to claim 1 , wherein
an inclined surface inclined from a center side to the outer periphery side, toward the first surface side, is formed on the second surface opposite the first surface of the metal plate; and
the welded portion is formed on the inclined surface.

7. The pressure sensor device according to claim 1 , wherein
the metal plate includes an outer peripheral portion having a thickness thinner than that on the center side;
a stepped portion in a step-like form from the center side to the outer peripheral portion is formed on the second surface opposite the first surface of the metal plate; and
the welded portion is formed on the stepped portion.

Assignees

• Tdk Corp

Inventors

• Kobayashi Masanori
• Unno Ken
• Sasahara Tetsuya
• Nawaoka Kohei

Classifications

• G01L9/0055

  bonded on a diaphragm · CPC title

• G01L9/0048

  Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief · CPC title

• G01L9/0047

  Diaphragm with non uniform thickness, e.g. with grooves, bosses or continuously varying thickness · CPC title

• G01L19/147 Primary

  Details about the mounting of the sensor to support or covering means · CPC title

• G01L19/143

  Two part housings · CPC title