Light emitting device

Patent metadata

Field	Value
Publication number	US-12068427-B2
Application number	US-202318307874-A
Country	US
Kind code	B2
Filing date	Apr 27, 2023
Priority date	Sep 14, 2020
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

A package includes: a bottom portion having a mounting surface; and a lateral wall portion having a top surface and including: a lateral wall having a rectangular outer shape in a top view and surrounding the mounting surface, and a stepped portion formed along the lateral wall below the top surface. In the top view, the stepped portion includes a wide portion and a narrow portion that are two regions having different widths. The narrow portion is formed on a portion along a one side of an entire circumference of the lateral wall.

First claim

What is claimed is:

1. A light emitting device comprising:
a package comprising:
a bottom portion having a mounting surface; and
a lateral wall portion having a top surface and comprising:
a lateral wall having a rectangular outer shape in a top view and surrounding the mounting surface, and
a stepped portion formed along the lateral wall below the top surface; and

a semiconductor laser element arranged on the mounting surface; and
an optical member, wherein:
in the top view:
the stepped portion includes a wide portion and a narrow portion that are two regions having different widths,
the narrow portion is formed on a portion along a one side of an entire circumference of the lateral wall, and
the optical member is disposed between the semiconductor laser element and the narrow portion.

2. The light emitting device according to claim 1 , wherein the stepped portion is formed along the entire circumference of the lateral wall.

3. The light emitting device according to claim 1 , wherein the wide portion is formed on a portion along three sides of the entire circumference of the lateral wall.

4. The light emitting device according to claim 1 , further comprising one or more wiring regions provided on a top surface of the stepped portion, wherein no wiring regions are provided on a top surface of the narrow portion of the top surface of the stepped portion.

5. The light emitting device according to claim 4 , further comprising a first wire electrically connecting the semiconductor laser element to the one or more wiring regions, wherein, in the top view, the first wire is joined to the wiring regions provided on a top surface of the wide portion formed at a position at which the wide portion faces the narrow portion.

6. The light emitting device according to claim 1 , wherein the narrow portion is formed at a position at which the narrow portion faces a light emitting surface of the semiconductor laser element.

7. The light emitting device according to claim 1 , further comprising a first wire electrically connecting the semiconductor laser element to the wiring regions, wherein, in the top view, the first wire is joined to the wiring regions provided on a top surface of the wide portion formed along a side in contact with a side along which the narrow portion is formed.

8. The light emitting device according to claim 1 , further comprising a second wire electrically connecting the optical member to the wiring regions, wherein, in the top view, the second wire is joined to the wiring regions provided on a top surface of the wide portion formed along a side in contact with a side along which the narrow portion is formed.

9. The light emitting device according to claim 1 , further comprising:
a first wire electrically connecting the semiconductor laser element to the wiring regions; and
a second wire electrically connecting the optical member to the wiring regions, wherein:
in the top view, the first wire is joined to the wiring regions provided on a top surface of the wide portion formed at a position at which the wide portion faces the narrow portion, and
in the top view, the second wire is joined to the wiring regions provided on a top surface of the wide portion formed along a side in contact with a side along which the narrow portion is formed.

10. The light emitting device according to claim 1 , further comprising:
a first wire electrically connecting the semiconductor laser element to the wiring regions; and
a second wire electrically connecting the optical member to the wiring regions, wherein:
in the top view, the first wire is joined to the wiring regions provided on a top surface of the wide portion formed at a position at which the wide portion faces the narrow portion,
in the top view, the first wire is joined to the wiring regions provided on a top surface of the wide portion formed along a side in contact with a side along which the narrow portion is formed, and
in the top view, the second wire is joined to the wiring regions provided on a top surface of the wide portion formed along a side in contact with a side on which the narrow portion is formed.

11. The light emitting device according to claim 10 , wherein the wiring regions to which the first wire is joined and the wiring regions to which the second wire is joined are provided on the wide portion formed along a same side.

Assignees

• Nichia Corp

Inventors

• Hashimoto Takuya
• Miura Soichiro

Classifications

• H10W90/00

  Package configurations · CPC title

• H10H29/10

  Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 (active-matrix LED displays H10H29/30) · CPC title

• H10F77/413

  directly associated or integrated with the devices, e.g. back reflectors (directly associated or integrated with photovoltaic cells H10F77/42) · CPC title

• H10F77/331

  for filtering or shielding light, e.g. multicolour filters for photodetectors · CPC title

• H10F77/50

  Encapsulations or containers (for photovoltaic modules H10F19/80) · CPC title