LED bulb lamp

Patent metadata

Field	Value
Publication number	US-12066155-B2
Application number	US-202117364891-A
Country	US
Kind code	B2
Filing date	Jul 1, 2021
Priority date	Sep 28, 2014
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

An LED filament comprising: a plurality of LED chips electrically connected with one another; two conductive electrodes, each of the two conductive electrodes being electrically connected to a corresponding LED chip of the LED chips; a light conversion coating coated on the two conductive electrodes, a portion of each of the two conductive electrodes being exposed from the light conversion coating, wherein the light conversion coating comprises a top layer and a base layer, the base layer coats on one side of the LED chips, and the top layer coats on another sides of the LED chips, so that the light conversion coating is coated on at least two sides of the LED chips; and the top layer comprise a wave crest and a wave trough adjacent to the wave crest, and an attaching structure disposed either between the top layer and the base layer, or between the base layer and the conductive electrodes, or between the top layer and the conductive electrodes to enhance fastness between the light conversion coating and the two conductive electrodes.

First claim

What is claimed is:

1. An LED filament comprising:
a plurality of LED chips electrically connected with one another;
two conductive electrodes, each of the two conductive electrodes being electrically connected to a corresponding LED chip of the LED chips;
light conversion coating coated on the two conductive electrodes, a portion of each of the two conductive electrodes being exposed from the light conversion coating, wherein the light conversion coating comprises a top layer and a base layer, the base layer coats on one side of the LED chips, and the top layer coats on another side of the LED chips, so that the light conversion coating is coated on at least two sides of the LED chips; and
wherein the top layer of the light conversion coating comprises a wave crest and a wave trough adjacent to the wave crest, and an attaching structure is disposed between the top layer and the base layer, the base layer comprises a plurality of holes, and the top layer extends into the base layer via the holes.

2. The LED filament of claim 1 , wherein the top layer further extends to another face of the base layer away from contact faces between the top layer and the base layer via the holes.

3. The LED filament of claim 2 , wherein the top layer comprises a phosphor powder glue, and the phosphor powder glue of the top layer extends into the base layer and further extends to another face of the base layer away from the contact faces between the top layer and the base layer via the holes.

4. The LED filament of claim 1 , wherein the base layer is clamped by the top layer, and the top layer and the base layer are riveted together.

5. An LED filament comprising:
a plurality of LED chips electrically connected with one another;
two conductive electrodes, each of the two conductive electrodes being electrically connected to a corresponding LED chip of the LED chips;
a light conversion coating coated on the two conductive electrodes, a portion of each of the two conductive electrodes being exposed from the light conversion coating wherein the light conversion coating comprises a top layer and a base layer, the base layer coats on one side of the LED chips, and layer coats on another sides of the LED chips, so that the light conversion coating is coated on at least two sides of the LED chips; and
wherein the top layer of the light conversion coating comprises a wave crest and a wave trough adjacent to the wave crest, wherein the conductive electrodes are enclosed by the base layer, an attaching structure is disposed between the base layer and the conductive electrodes, each of the conductive electrodes comprises a plurality of holes, and the base layer extends into each of the conductive electrodes via the holes.

6. The LED filament of claim 5 , wherein the base layer passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.

7. The LED filament of claim 6 , wherein the base layer comprises a phosphor powder glue, and the phosphor powder glue of the base layer extends into each of the conductive electrodes and passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.

8. The LED filament of claim 6 , wherein each of the conductive electrodes is clamped by the base layer, and the base layer and each of the conductive electrodes are riveted together.

9. An LED filament comprising,
a plurality of LED chips electrically connected with one another;
two conductive electrodes, each of the two conductive electrodes being electrically connected to a corresponding LED chip of the LED chips;
a light conversion coating coated on the two conductive electrodes, a portion of each of the two conductive electrodes being exposed from the light conversion coating, wherein the light conversion coating comprises a top layer and a base layer, the base layer coats on one side of the LED chips, and the top layer coats on another sides of the LED chips, so that the light conversion coating is coated on at least two sides of the LED chips; and
wherein the top layer of the light conversion coating comprises a wave crest and a wave trough adjacent to the wave crest, wherein the conductive electrodes are enclosed by the top layer, an attaching structure is disposed between the top layer and the conductive electrodes, each of the conductive electrodes comprises a plurality of holes, and the top layer extends into each of the conductive electrodes via the holes.

10. The LED filament of claim 9 , wherein the top layer passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.

11. The LED filament of claim 10 , wherein the top layer comprises a phosphor powder glue, and the phosphor powder glue of the top layer extends into each of the conductive electrodes and passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.

12. The LED filament of claim 10 , wherein each of the conductive electrodes is clamped by the top layer, and the base layer and each of the conductive electrodes are riveted together.

13. The LED filament of claim 9 , further comprising at least two auxiliary pieces, wherein each of the at least two auxiliary pieces extends from a side of a corresponding one of the two conductive electrodes to a side of the corresponding LED chip of the LED chips at an end of the LED filament along an axial direction of the LED filament.

14. The LED filament of claim 13 , wherein the conductive electrodes and the auxiliary pieces are enclosed by the base layer, the attaching structure is between the base layer and the conductive electrodes and between the base layer and the auxiliary pieces, each of the conductive electrodes and each of the auxiliary pieces respectively comprise a plurality of holes, and the base layer extends into each of the conductive electrodes and each of the auxiliary pieces via the holes.

15. The LED filament of claim 14 , wherein the base layer passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.

16. The LED filament of claim 15 , wherein the base layer comprises a phosphor powder glue, and the phosphor powder glue of the base layer extends into each of the conductive electrodes and each of the auxiliary pieces and passes through each of the holes from one side of each of the holes to an opposite side of each of the holes.

17. An LED filament comprising:
an LED chip assembly;
two conductive electrodes, each of the two conductive electrodes being electrically connected to the LED chip assembly; and
a light conversion coating coated on the LED chip assembly and the two conductive electrodes, a portion of each of the two conductive electrodes being exposed from the light conversion coating, the light conversion coating comprises a top layer and a base layer, the base layer covers one side of the LED chip assembly, the top layer covers another side which is not covered by the base layer of the LED chip assembly, and wherein the top layer of the light conversion coating comprises a wave crest and a wave trough adjacent to the wave crest, and the top layer and the base layer is attached through an attaching structure to enhance fastness between the base layer and the top layer,
wherein the attaching structure is between the top layer and the base layer, the base layer comprises a plurality of holes, and the top layer extends into the base layer via the holes.

18. The LED filament of claim 17 , wherein the top layer further extends t

Assignees

• Zhejiang Super Lighting Electric Appliance Co Ltd
• Zhejiang Super Lighting Electric Ap

Inventors

• Jiang Tao

Classifications

• F21Y2109/00

  Light sources with light-generating elements disposed on transparent or translucent supports or substrates · CPC title

• F21Y2107/70

  on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form · CPC title

• F21K9/61

  using light guides · CPC title

• F21V23/06

  the elements being coupling devices {, e.g. connectors} · CPC title

• F21V29/503

  of light sources (cooling arrangements structurally associated with gas-discharge or vapour-discharge lamps H01J61/52; cooling arrangements structurally associated with electric incandescent lamps H01K1/58; cooling arrangements structurally associated with light-emitting diodes H10H20/858) · CPC title