LED lamp for a vehicle and a method of manufacturing the same using mid and magnetic induction technologies

Patent metadata

Field	Value
Publication number	US-12065073-B2
Application number	US-202318140447-A
Country	US
Kind code	B2
Filing date	Apr 27, 2023
Priority date	May 6, 2022
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

A light-emitting diode (LED) lamp for a vehicle and a method of manufacturing the same use MID and magnetic induction technologies. The LED lamp includes a LED module, a housing accommodating the LED module, and a molded interconnect device (MID) electrode formed on a surface of the housing. The LED module may be mounted on the MID electrode by soldering using magnetic induction heating, the housing may be an injection molded product, and the MID electrode may be formed on the housing using a MID process.

First claim

What is claimed is:

1. A light-emitting diode (LED) lamp for a vehicle using molded interconnect device (MID) and magnetic induction technologies, the LED lamp comprising:
a LED module;
a housing accommodating the LED module;
a socket connecting unit connected to a lower portion of the housing and connected to a lamp socket provided in the vehicle;
a MID electrode including a LED electrode formed on a surface of the housing and a socket electrode formed on a surface of the socket connecting unit; and
a MID heat-dissipation layer formed on the surface of the housing on which the LED module is seated,
wherein the LED module is mounted on the MID electrode,
wherein the MID heat-dissipation layer is connected to the LED electrode and is configured to dissipate heat generated from the LED module through the LED electrode to an outside of the LED lamp,
wherein the LED electrode includes a pair of first and second LED electrodes connected to both sides of the LED module, and
wherein the MID electrode includes a wiring structure in which the first LED electrode has a gear unit wiring wired in a shape of a gear unit and the second LED electrode has a hinge hole wiring extending to a hinge hole.

2. The LED lamp of claim 1 , wherein the MID electrode includes a LED electrode electrically connecting the LED module and a socket electrode, which is configured to electrically connect the LED electrode and the lamp socket.

3. The LED lamp of claim 1 , wherein the MID heat-dissipation layer is formed on the entire outer circumferential surface of the housing on which the LED module is seated.

4. The LED lamp of claim 3 , wherein the MID heat-dissipation layer is formed to be continuously connected to the LED electrode.

5. A light-emitting diode (LED) lamp for a vehicle using molded interconnect device (MID) and magnetic induction technologies, the LED lamp comprising:
a LED module;
a housing formed by injection molding and accommodating the LED module;
a MID electrode formed on a surface of the housing by a MID process and including an LED electrode electrically connecting the LED module and a socket electrode; and
a MID heat-dissipation layer formed on the surface of the housing on which the LED module is seated by the MID process,
wherein the LED module is mounted on the MID electrode by soldering using magnetic induction heating,
wherein the MID heat-dissipation layer is connected to the LED electrode and is configured to dissipate heat generated from the LED module through the LED electrode to an outside of the LED lamp,
wherein the LED electrode includes a pair of first and second LED electrodes connected to both sides of the LED module, and
wherein the MID electrode includes a wiring structure in which the first LED electrode has a gear unit wiring wired in a shape of a gear unit and the second LED electrode has a hinge hole wiring extending to a hinge hole.

6. The LED lamp of claim 5 , further comprising a socket connecting unit formed by injection molding, connected to a lower portion of the housing, and connected to a lamp socket provided in the vehicle.

7. The LED lamp of claim 6 , wherein the socket electrode is configured to electrically connect the LED electrode and the lamp socket.

8. The LED lamp of claim 7 , wherein the MID heat-dissipation layer is formed on the entire outer circumferential surface of the housing on which the LED module is seated and is formed to be continuously connected to the LED electrode.

9. A method of manufacturing a light-emitting diode (LED) lamp for a vehicle using molded interconnect device (MID) and magnetic induction technologies, comprising steps of:
providing an upper housing formed by injection molding;
performing a first etching on the upper housing by laser processing;
forming a LED electrode by plating the first etching portion;
dispensing a solder paste to the LED electrode;
mounting a LED module on the solder paste; and
melting the solder paste by induction heating,
wherein the LED electrode and the LED module are directly implemented and mounted on the housing,
wherein a MID heat-dissipation layer is formed to be connected to the LED electrode and is configured to dissipate heat generated from the LED module through the LED electrode to an outside of the LED lamp,
wherein the LED electrode includes a pair of first and second LED electrodes connected to both sides of the LED module, and
wherein the MID electrode includes a wiring structure in which the first LED electrode has a gear unit wiring wired in a shape of a gear unit and the second LED electrode has a hinge hole wiring extending to a hinge hole.

10. The method of claim 9 , further comprising:
etching, by laser processing, a predetermined region on a surface of the housing of a portion on which the LED module is seated and forming the MID heat-dissipation layer by plating the etching region.

11. The method of claim 10 , wherein the MID heat-dissipation layer is formed on the entire outer circumferential surface of the housing on which the LED module is seated and is formed to be continuously connected to the LED electrode.

12. The method of claim 11 , wherein an induction heating unit is configured to perform an induction heating and includes an induction heating coil disposed above a LED lamp and a magnetic core disposed inside the induction heating coil.

13. The method of claim 12 , wherein the induction heating unit further includes a jig on which the LED lamp is mounted and a lower magnetic body disposed at a position facing the magnetic core to concentrate a magnetic flux to a soldering portion.

Assignees

• Hyundai Motor Co Ltd
• Kia Corp
• Bs Technics Co Ltd
• Nifco Korea Inc
• Hyundai Mobis Co Ltd
• Alps Electric Korea Co Ltd

Inventors

• Kim Jun Sik
• Choi Jung Sik
• Kim Young Do
• Jung Tae Kyoung
• Han Seung-Sik
• Chang Hong-Sik
• Cho Kwang-Pyo
• Lee Young-Ju
• Park Jong-Hyun
• Lee Jin-Won
• Oh Jun-Geun
• Kim Cheon-Ho
• Im Young-Jai
• Oh Sun-Mi
• Lee Kang-Sun
• Kim Sae-Ah
• Park Jong-Eun
• Lee Kwan-Woo
• Lee Jong-Chae
• Park Jun-Hyun
• Lee Won-Il
• Park Dae-Woo

Classifications

• F21V19/002

  the fastening means engaging the encapsulation or the packaging of the semiconductor device · CPC title

• F21V29/70

  characterised by passive heat-dissipating elements, e.g. heat-sinks · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title

• H02J50/10 Primary

  using inductive coupling · CPC title

• B60Y2410/124

  Welded parts · CPC title