Element substrate and print head

Patent metadata

Field	Value
Publication number	US-12064965-B2
Application number	US-202217901033-A
Country	US
Kind code	B2
Filing date	Sep 1, 2022
Priority date	Sep 3, 2021
Publication date	Aug 20, 2024
Grant date	Aug 20, 2024

Abstract

According to the present invention, it is possible to provide an element substrate and a print head with which a decrease in yield and an increase in cost in a manufacturing process can be suppressed. For that purpose, a VH wiring line and a GNDH wiring line are provided in parallel in the same layer.

First claim

What is claimed is:

1. An element substrate comprising:
a plurality of arranged heating elements; and
an electrical wiring line configured to supply the heating elements with power,
the electrical wiring line being provided in a first electrical wiring layer and a second electrical wiring layer overlapping the first electrical wiring layer,
wherein the first electrical wiring layer includes a first wiring line connected to one connecting unit of the heating elements and a second wiring line connected to the other connecting unit of the heating elements,
wherein the second electrical wiring layer includes a third wiring line connected to the first wiring line and a fourth wiring line connected to the second wiring line,
the first electrical wiring layer including a first wiring group in which at least one pair of the first wiring line and the second wiring line are provided in parallel,
the second electrical wiring layer including a second wiring group in which at least one pair of the third wiring line and the fourth wiring line are provided in parallel,
wherein a wiring line of the first wiring group and a wiring line of the second wiring group intersect when viewed from a viewpoint of a line orthogonal to the first electrical wiring layer, and
wherein the first wiring group and the second wiring group are different in wiring thickness.

2. The element substrate according to claim 1 , wherein
in the first electrical wiring layer, a plurality of pairs of the first wiring lines and the second wiring lines are provided, the first wiring lines and the second wiring lines being arranged alternately, and
in the second electrical wiring layer, a plurality of pairs of the third wiring lines and the fourth wiring lines are provided, the third wiring lines and the fourth wiring lines being arranged alternately.

3. The element substrate according to claim 1 , wherein
an outer shape is a parallelogram, and
a wiring line of the first wiring group and a wiring line of the second wiring group are provided along respective edges of the outer shape.

4. The element substrate according to claim 1 , wherein
an outer shape is a rectangle, and
a wiring line of the first wiring group and a wiring line of the second wiring group are provided along respective edges of the outer shape.

5. The element substrate according to claim 1 , wherein
a wiring line of the first wiring group and a wiring line of the second wiring group are provided across an entire area of the element substrate, and
one wiring group extending in a longitudinal direction of the element substrate out of the first wiring group and the second wiring group has a wiring thickness larger than a wiring thickness of the other wiring group extending in a lateral direction.

6. The element substrate according to claim 1 , wherein a through hole is provided between the first electrical wiring layer and the second electrical wiring layer, a wiring line of the first wiring group and a wiring line of the second wiring group being connected via a through-hole wiring line passing through the through hole.

7. The element substrate according to claim 1 , wherein the electrical wiring line is a metal and is made of any one of Al, Cu, Ag, Au, Pt, W, Ni, and Co or an alloy including any one of Al, Cu, Ag, Au, Pt, W, Ni, and Co.

8. The element substrate according to claim 1 , further comprising:
a plurality of supply ports capable of supplying the heating elements with a liquid; and
a plurality of collection ports capable of collecting a liquid from the heating elements.

9. The element substrate according to claim 1 , further comprising a plurality of electrodes configured to transfer power from outside to the heating elements.

10. The element substrate according to claim 1 , further comprising:
a third electrical wiring layer including a fifth wiring line connected to the first wiring line and a sixth wiring line connected to the second wiring line,
wherein the third electrical wiring layer includes a third wiring group in which at least one pair of the fifth wiring line and the sixth wiring line are provided in parallel, and
wherein a wiring arrangement in the third wiring group is identical to a wiring arrangement in the first wiring group.

11. A print head comprising the element substrate according to claim 1 .

Assignees

• Canon Kk

Inventors

• Miura Yosuke
• Fujii Yasuo
• Soeda Yasuhiro

Classifications

• B41J2/14129

  Layer structure · CPC title

• B41J2/1404

  Geometrical characteristics · CPC title

• B41J2/14072 Primary

  Electrical connections, e.g. details on electrodes, connecting the chip to the outside... · CPC title