Inductor structure having conductive sheets having fan plate shape arranged in ring structure and fabrication method thereof, electronic package and fabrication method thereof, and method for fabricating packaging carrier

Patent metadata

Field	Value
Publication number	US-12062685-B2
Application number	US-202217586842-A
Country	US
Kind code	B2
Filing date	Jan 28, 2022
Priority date	Feb 5, 2021
Publication date	Aug 13, 2024
Grant date	Aug 13, 2024

Abstract

An inductor structure is provided. A plurality of first and second conductive posts have end surfaces corresponding in profile to ends of first conductive sheets, respectively. As such, the profiles of the end surfaces of the first and second conductive posts are non-cylindrical so as to increase the contact area between the first conductive sheets and the first and second conductive posts, thereby improving the conductive quality and performance of the inductor. Further, since the first and second conductive posts are formed by stacking a plurality of post bodies on one another, the number and cross-sectional area of loops are increased so as to increase the inductance value. A method for fabricating the inductor structure, an electronic package and a fabrication method thereof, and a method for fabricating a packaging carrier are further provided.

First claim

What is claimed is:

1. An inductor structure, comprising:
an insulating body having opposite first and second sides;
a plurality of first conductive sheets having a fan plate shape and embedded in the insulating body from the first side of the insulating body, wherein each of the first conductive sheets has opposite first and second ends, and a width of the first end is less than a width of the second end, wherein the plurality of first conductive sheets are arranged in a ring structure, the first ends of the first conductive sheets form an inner ring boundary of the ring structure, and the second ends of the first conductive sheets form an outer ring boundary of the ring structure relative to the inner ring boundary;
a plurality of first conductive posts embedded in the insulating body and electrically connected to the first ends of the first conductive sheets, respectively, wherein a profile of an end surface of each of the first conductive posts corresponds to a profile of the first end of the first conductive sheet, and each of the first conductive posts comprises a plurality of first post bodies stacked on one another;
a plurality of second conductive posts embedded in the insulating body and electrically connected to the second ends of the first conductive sheets, respectively, wherein a profile of an end surface of each of the second conductive posts corresponds to a profile of the second end of the first conductive sheet, and each of the second conductive posts comprises a plurality of second post bodies stacked on one another;
a plurality of second conductive sheets having a curved plate shape and embedded in the insulating body from the second side of the insulating body, wherein each of the second conductive sheets has opposite third and fourth ends and is disposed on and across adjacent two of the first conductive sheets, a profile of the third end of the second conductive sheet corresponds to the profile of the first end of the first conductive sheet, the third end of the second conductive sheet is electrically connected to the first conductive post on the first end of one of the two adjacent first conductive sheets, a profile of the fourth end of the second conductive sheet corresponds to the profile of the second end of the first conductive sheet, and the fourth end of the second conductive sheet is electrically connected to the second conductive post on the second end of the other one of the two adjacent first conductive sheets, and
wherein at least portions of adjacent two of the first conductive sheets are exposed from the first side of the insulating body or at least portions of adjacent two of the second conductive sheets are exposed from the second side of the insulating body for bonding with electrode pads.

2. The inductor structure of claim 1 , wherein the first end of each of the first conductive sheets has an arc shape, and the end surface of the first conductive post disposed on the first end of the first conductive sheet has a fingertip shape.

3. The inductor structure of claim 1 , wherein the first end of each of the first conductive sheets has a taper shape, and the end surface of the first conductive post disposed on the first end of the first conductive sheet has a triangular shape.

4. The inductor structure of claim 1 , further comprising a connecting pad formed between the plurality of first post bodies stacked on one another or the plurality of second post bodies stacked on one another or both.

5. The inductor structure of claim 1 , wherein widths of the plurality of first post bodies stacked on one another are different or widths of the plurality of second post bodies stacked on one another are different or the widths of both of the first post bodies and the second post bodies are different.

6. The inductor structure of claim 1 , further comprising at least one magnetic conducting metal formed in the insulating body by electroplating, wherein the magnetic conducting metal comprises nickel, zinc, manganese, iron, cobalt, or a combination thereof.

7. The inductor structure of claim 6 , wherein the magnetic conducting metal is disposed around the first conductive post on the first end and the second conductive post on the third end to allow the first conductive post on the first end and the second conductive post on the third end to be positioned within a ring of the magnetic conducting metal.

8. The inductor structure of claim 6 , wherein the magnetic conducting metal is distributed in at least a layer, at least a fine dot, at least a fine block, or at least a fine strip.

9. The inductor structure of claim 1 , wherein the insulating body comprises multi-layers of insulating material, and at least one layer of the multi-layers of the insulating material comprises a magnetic conducting material, wherein the magnetic conducting material comprises iron-nickel-molybdenum alloy powder, iron-silicon-aluminum alloy powder, or iron-nickel alloy powder in combination with a resin material.

10. An electronic package, comprising:
a packaging carrier having a circuit structure;
the inductor structure of claim 1 formed in the packaging carrier and electrically connected to the circuit structure; and
at least one electronic element disposed on one side of the packaging carrier and electrically connected to the circuit structure and the inductor structure.

11. The electronic package of claim 10 , further comprising an encapsulant encapsulating the electronic element.

12. A method for fabricating an inductor structure using a coreless fabrication technique of an integrated circuit carrier, the method comprising:
forming a plurality of first conductive sheets on a carrier via a patterning process, wherein each of the first conductive sheets has opposite first and second ends, a width of the first end is less than a width of the second end, and each of the first conductive sheets has a fan plate shape, wherein the plurality of first conductive sheets are arranged in a ring structure, the first ends of the first conductive sheets form an inner ring boundary of the ring structure, and the second ends of the first conductive sheets form an outer ring boundary of the ring structure relative to the inner ring boundary;
forming a first conductive post on the first end of each of the first conductive sheets via the patterning process, and forming a second conductive post on the second end of each of the first conductive sheets via the patterning process, wherein a profile of an end surface of the first conductive post corresponds to a profile of the first end of the first conductive sheet, a profile of an end surface of the second conductive post corresponds to a profile of the second end of the first conductive sheet, the first conductive post comprises a plurality of first post bodies stacked on one another, and the second conductive post comprises a plurality of second post bodies stacked on one another;
forming an insulating material on the carrier to encapsulate the plurality of first conductive sheets, the first conductive posts and the second conductive posts, wherein portions of the first conductive posts and portions of the second conductive posts are exposed from the insulating material, the insulating body comprises a magnetic conducting material, and a dielectric material is formed on each of the magnetic conducting material for a circuit electroplating process;
forming a plurality of second conductive sheets on the dielectric material on the insulating material via a patterning process, wherein each of the second conductive sheets has opposite third and fourth ends and is disposed on and across adjacent two of the first conductive sheets, a profile of the third

Assignees

• Phoenix Pioneer Technology Co Ltd

Inventors

• Hsu Shih-Ping

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/117

  the substrate having spherical bumps for external connection · CPC title

• H10W70/685

  comprising multiple insulating layers · CPC title

• H10W70/65

  Shapes or dispositions of interconnections · CPC title

• H10W44/501

  Inductive arrangements (H10W44/20 takes precedence) · CPC title