Surface-treated copper foil and copper clad laminate

Patent metadata

Field	Value
Publication number	US-12060647-B2
Application number	US-202117543645-A
Country	US
Kind code	B2
Filing date	Dec 6, 2021
Priority date	Jul 6, 2021
Publication date	Aug 13, 2024
Grant date	Aug 13, 2024

Abstract

A surface-treated copper foil includes a treated surface, where the peak extreme height (Sxp) of the treating surface is 0.4 to 3.0 μm. When the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of ( 111 ) plane to the sum of the integrated intensities of diffraction peaks of ( 111 ) plane, ( 200 ) plane, and ( 220 ) plane of the treating surface is at least 60%.

First claim

What is claimed is:

1. A surface-treated copper foil, comprising a treating surface, wherein a peak extreme height (Sxp) of the treating surface is in a range of 0.4 to 3.0 μm, a texture aspect ratio (Str) of the treating surface is not greater than 0.68, and when the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, a ratio of the integrated intensity of diffraction peak of copper ( 111 ) plane to the sum of the integrated intensities of diffraction peaks of copper ( 111 ) plane, copper ( 200 ) plane, and copper ( 220 ) plane of the treating surface is at least 60%, and the integrated intensities of diffraction peaks of copper ( 111 ) plane, copper ( 200 ) plane, and copper ( 220 ) plane are measured by a grazing incidence X-ray diffraction performed on the treating surface.

2. The surface-treated copper foil of claim 1 , wherein a texture aspect ratio (Str) of the treating surface is in a range of 0.10 to 0.65.

3. The surface-treated copper foil of claim 1 , wherein the ratio of the integrated intensity of diffraction peak of copper ( 111 ) plane to the sum of the integrated intensities of diffraction peaks of copper ( 111 ) plane, copper ( 200 ) plane, and copper ( 220 ) plane of the treating surface is in a range of 60% to 90%.

4. The surface-treated copper foil of claim 1 , wherein the integrated intensities of diffraction peaks of copper ( 111 ) plane, copper ( 200 ) plane, and copper ( 220 ) plane of the treating surface are measured by grazing incidence X-ray diffraction with a grazing angle in a range of 0.5° to 1.0°.

5. The surface-treated copper foil of claim 1 , wherein when the surface-treated copper foil is heated at a temperature of 200° C. for 1 hour, the ratio of the integrated intensity of diffraction peak of copper ( 220 ) plane to the sum of the integrated intensities of diffraction peaks of copper ( 111 ) plane, copper ( 200 ) plane, and copper ( 220 ) plane of the treating surface is less than 16.50%, and an absolute value of a signal transmission loss of the surface-treated copper foil is less than or equal to 0.85 dB/in.

6. The surface-treated copper foil of claim 1 , wherein a peel strength of the surface-treated copper foil is greater than 4.0 lb/in after a solder floating test is performed on the surface-treated copper foil at a temperature of 288° C. for 10 seconds and repeated 10 times, and the peel strength is measured in accordance with a standard JIS C 6471.

7. The surface-treated copper foil according to claim 1 , wherein the surface-treated copper foil further comprises:
a bulk copper foil; and
a surface treatment layer, disposed on at least one surface of the bulk copper foil, wherein the outer side of the surface treatment layer is the treating surface.

8. The surface-treated copper foil of claim 7 , wherein the bulk copper foil is an electrodeposited copper foil, the surface treatment layer comprises a sub-layer, and the sub-layer is a roughening layer.

9. The surface-treated copper foil of claim 8 , wherein the surface treatment layer further comprises at least one further sub-layer, the at least one further sub-layer is selected from the group consisting of a barrier layer, an anti-rust layer and a coupling layer.

10. A copper-clad laminate, comprising:
a board; and
a surface-treated copper foil, disposed on at least one surface of the board,
wherein the surface-treated copper foil comprises:
a bulk copper foil; and
a surface treatment layer, disposed between the bulk copper foil and the board, wherein the surface treatment layer comprises a treating surface facing toward the board, and a peak extreme height (Sxp) of the treating surface is in a range of 0.4 to 3.0 μm, a texture aspect ratio (Str) of the treating surface is not greater than 0.68, and a ratio of an integrated intensity of diffraction peak of copper ( 111 ) plane to the sum of integrated intensities of diffraction peaks of copper ( 111 ) plane, copper ( 200 ) plane, and copper ( 220 ) plane of the treating surface is at least 60%, and the integrated intensities of diffraction peaks of copper ( 111 ) plane, copper ( 200 ) plane, and copper ( 220 ) plane are measured by a grazing incidence X-ray diffraction performed on the treating surface.

11. The copper-clad laminate of claim 10 , wherein the treating surface of the surface treatment layer is in direct contact with the board.

Assignees

• Chang Chun Petrochemical Co Ltd

Inventors

• Lai Chien-Ming
• Lai Yao-Sheng
• Chou Jui-Chang

Classifications

• B32B2457/08

  PCBs, i.e. printed circuit boards · CPC title

• B32B2307/538

  Roughness · CPC title

• B32B2255/205

  Metallic coating · CPC title

• B32B2255/06

  on metal layer · CPC title

• B32B15/20

  comprising aluminium or copper {(B32B15/016 and B32B15/017 take precedence)} · CPC title