Curable resin composition, cured product, and sheet-like formed body

US12060482B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-12060482-B2
Application numberUS-202117223072-A
CountryUS
Kind codeB2
Filing dateApr 6, 2021
Priority dateOct 15, 2018
Publication dateAug 13, 2024
Grant dateAug 13, 2024

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A curable resin composition includes a polyether polyol resin represented by general formula (1) and having an epoxy equivalent of 7,000 to 100,000 g/eq, an epoxy resin having a functionality of 3 or more, and an epoxy resin curing agent. Provided is a curable resin composition that is excellent in heat resistance and also excellent in bending resistance in a well-balanced manner and that is applicable in various fields that require heat resistance and toughness, particularly, electrical and electronic fields.n is an integer of 1 or more. A1 and A2 are each a divalent organic group having an aromatic structure and/or an alicyclic structure. B is a hydrogen atom or a glycidyl group.

First claim

Opening claim text (preview).

The invention claimed is: 1. A curable resin composition comprising: a polyether polyol resin having an epoxy equivalent of 7,000 to 100,000 g/eq; an epoxy resin having a functionality of 3 or more; and an epoxy resin curing agent, the polyether polyol resin being represented by general formula (1): [Chem. 1] wherein, in general formula (1), n is an integer of 1 or more, A 1 and A 2 may be the same as or different from each other and are each a divalent organic group having an aromatic structure and/or an alicyclic structure, provided that the aromatic ring structure and the alicyclic ring structure are contained as either A 1 or A 2 , B is a hydrogen atom or a group represented by formula (2), and at least one of two B's is a group represented by formula (2): [Chem. 2] 2. The curable resin composition according to claim 1 , wherein the polyether polyol resin contains, in a main chain thereof, 35 to 55 mass % of an aromatic structure and 8 to 25 mass % of an alicyclic structure. 3. The curable resin composition according to claim 1 or 2 , wherein the polyether polyol resin has a number average molecular weight of 9,000 to 40,000. 4. The curable resin composition according to claim 1 , wherein the polyether polyol resin is included in an amount of 45 mass % or more in a solids content. 5. The curable resin composition according to claim 1 , wherein A 1 and A 2 in general formula (1) are each a group represented by general formula (3): [Chem. 3] wherein, in general formula (3), R 1 's may be the same as or different from each other and are each a group selected from a hydrogen atom, a hydrocarbon group having 1 to 10 carbon atoms, and a halogen atom, and X is a single bond or a divalent group selected from a divalent hydrocarbon group having 1 to 7 carbon atoms, a divalent organic group having a cyclohexane ring structure or a trimethylcyclohexane ring structure, —O—, —S—, —SO 2 —, and —C(O)—, provided that at least one X in A 1 and A 2 is a divalent group having a cyclohexane ring structure or a trimethylcyclohexane ring structure. 6. The curable resin composition according to claim 1 , wherein the aromatic structure is a benzene ring structure, and the alicyclic structure is a cyclohexane ring structure or a trimethylcyclohexane ring structure. 7. A method for producing the curable resin composition according to claim 1 , comprising producing the polyether polyol resin by reacting a bifunctional epoxy resin with bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane. 8. A cured product formed by curing the curable resin composition according to claim 1 . 9. A sheet-like formed body comprising the cured product according to claim 8 . 10. The sheet-like formed body according to claim 9 , having a Tg of 140° C. or higher.

Assignees

Inventors

Classifications

  • use in electrical or conductive gadgets · CPC title

  • C08L63/00Primary

    Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

  • having two nitrogen atoms in the ring · CPC title

  • aromatic · CPC title

  • Manufacture of films or sheets · CPC title

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Frequently asked questions

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What does patent US12060482B2 cover?
A curable resin composition includes a polyether polyol resin represented by general formula (1) and having an epoxy equivalent of 7,000 to 100,000 g/eq, an epoxy resin having a functionality of 3 or more, and an epoxy resin curing agent. Provided is a curable resin composition that is excellent in heat resistance and also excellent in bending resistance in a well-balanced manner and that is ap…
Who is the assignee on this patent?
Mitsubishi Chem Corp
What technology area does this patent fall under?
Primary CPC classification C08L63/00. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 13 2024 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).