Protective cover member and member supplying sheet

Patent metadata

Field	Value
Publication number	US-12060263-B2
Application number	US-202117801070-A
Country	US
Kind code	B2
Filing date	Aug 5, 2021
Priority date	Aug 7, 2020
Publication date	Aug 13, 2024
Grant date	Aug 13, 2024

Abstract

A provided protective cover member is a protective cover member configured to be placed on a face of an object, the face having an opening. The protective cover member includes a laminate, and the laminate includes: a protective membrane having a shape configured to cover the opening when the member is placed on the face; and an adhesive agent layer. The adhesive agent layer includes a thermosetting adhesive layer including a thermosetting resin composition. The thermosetting resin composition has a storage modulus of 1×10 5 Pa or more at 130 to 170° C. The above protective cover member is suitable for reducing deformation thereof and/or peeling thereof from a placement face in a high-temperature treatment such as reflow soldering.

First claim

The invention claimed is:

1. A protective cover member configured to be placed on a face of an object, the face having an opening, the protective cover member comprising a laminate, wherein
the laminate includes: a protective membrane having a shape configured to cover the opening in a state that the member is placed on the face; and at least one adhesive agent layer, wherein
the at least one adhesive agent layer is placed only on a peripheral portion of the protective membrane,
the at least one adhesive agent layer includes a thermosetting adhesive layer having a thermosetting resin composition, and
the thermosetting resin composition has a storage modulus of 1×10 5 Pa or more to 1×10 7 Pa or less at 130 to 170° C.

2. The protective cover member according to claim 1 , wherein the thermosetting resin composition has a storage modulus of 5×10 5 Pa or more to 1×10 9 Pa or less at 250° C. after thermal curing.

3. The protective cover member according to claim 1 , wherein the thermosetting resin composition is an acrylic composition including an acrylic polymer.

4. The protective cover member according to claim 1 , wherein
the thermosetting resin composition includes an acrylic polymer having a weight-average molecular weight of 200,000 or more to 5,000,000 or less, and
a content of the acrylic polymer in the thermosetting resin composition is 35 weight % or more to 100 weight % or less.

5. The protective cover member according to claim 3 , wherein the acrylic polymer has a thermosetting group.

6. The protective cover member according to claim 5 , wherein the thermosetting group is at least one selected from a group consisting of an epoxy group, a carboxy group, a hydroxy group, a carbonyl group, an aziridinyl group, and an amino group.

7. The protective cover member according to claim 3 , wherein
the thermosetting resin composition further includes a thermosetting resin, and
a content of the thermosetting resin in the thermosetting resin composition is smaller than a content of the acrylic polymer in the thermosetting resin composition.

8. The protective cover member according to claim 7 , wherein the thermosetting resin is a phenolic resin.

9. The protective cover member according to claim 1 , wherein the at least one adhesive agent layer is in contact with the protective membrane.

10. The protective cover member according to claim 1 , wherein the at least one adhesive agent layer forms a joining surface to be joined to the face of the object.

11. The protective cover member according to claim 1 , wherein
the at least one adhesive agent layer comprises a first adhesive agent layer and a second adhesive agent layer, wherein the first adhesive agent layer and/or the second adhesive agent layer includes the thermosetting adhesive layer having the thermosetting resin composition, and
the laminate includes the first adhesive agent layer positioned on a first principal surface side of the protective membrane and the second adhesive agent layer positioned on a second principal surface side of the protective membrane.

12. The protective cover member according to claim 1 , wherein the protective membrane has gas permeability in a thickness direction of the protective membrane.

13. The protective cover member according to claim 1 , wherein the protective membrane includes a polytetrafluoroethylene membrane.

14. The protective cover member according to claim 1 , wherein the protective membrane has an area of 175 mm 2 or less.

15. The protective cover member according to claim 1 , wherein, with respect to a plan view of the protective membrane,
a ratio L 2 /L 1 is 0.3 or less,
wherein, with respect to the plane view of the protective member,
L 1 is defined by a minimum linear dimension from a center of the protective membrane to the perimeter of the protective membrane, and
L 2 is defined by a minimum linear dimension of a region of the adhesive agent layer that overlaps the protective membrane.

16. The protective cover member according to claim 1 , being for a micro electro mechanical system (MEMS).

17. A member supplying sheet comprising:
a substrate sheet; and
at least one protective cover member placed on the substrate sheet, wherein
the at least one protective cover member is the protective cover member according to claim 1 .

Assignees

• Nitto Denko Corp

Inventors

• Kigami Hiroki
• Onishi Kenji

Classifications

• Y10T428/2891

  including addition polymer from alpha-beta unsaturated carboxylic acid [e.g., acrylic acid, methacrylic acid, etc.] Or derivative thereof · CPC title

• C09J2203/326

  for bonding electronic components such as wafers, chips or semiconductors · CPC title

• C09J133/08 Primary

  Homopolymers or copolymers of acrylic acid esters · CPC title

• C09J2301/304

  the adhesive being heat-activatable, i.e. not tacky at temperatures inferior to 30°C · CPC title

• C09J2301/312

  parameters being the characterizing feature · CPC title