Laser machining device

Patent metadata

Field	Value
Publication number	US-12059744-B2
Application number	US-201916560603-A
Country	US
Kind code	B2
Filing date	Sep 4, 2019
Priority date	Mar 13, 2017
Publication date	Aug 13, 2024
Grant date	Aug 13, 2024

Abstract

There is provided a laser machining device including a heat radiation measurement unit that measures intensity of heat radiation of a workpiece irradiated with a laser beam, and a determination unit that determines a state of a target by defining an object used in machining work as the target, based on the intensity of the heat radiation measured by the heat radiation measurement unit.

First claim

What is claimed is:

1. A laser machining device comprising:
a scanner that is configured to change an irradiation position of a workpiece irradiated with a laser beam; a sensor that is configured to measure intensity of heat radiation of the workpiece irradiated with the laser beam; and a controller that includes a display and is configured to control the scanner, wherein the controller is configured to: determine an abnormal location of the workpiece, based on the intensity of the heat radiation measured by the sensor,
compare a measurement value of the heat radiation at each scanning position with one or both of an upper limit threshold and a lower limit threshold for identifying an abnormality,
compare the measurement value obtained at a first position of the workpiece with the measurement value obtained at a position of the workpiece other than the first position,
two-dimensionally arrange a series of data items of the measurement values of the heat radiation in accordance with the scanning positions,
compare the measurement value obtained at the first position of the workpiece with the measurement value obtained at the position of the workpiece other than the first position, based on the data of the measurement value of the heat radiation, and
analyze whether or not a distribution of a measurement value has a predetermined characteristic and determine a pattern of a warpage of the workpiece, a position of the warpage, or a size of the warpage, based on a result of the analysis, and
the display is configured to display, based on a determination result of the controller, a type of the abnormality and a location of the abnormality in the workpiece.

2. The laser machining device according to claim 1 ,
wherein the controller is configured to control a state of the workpiece based on the state that is determined by the controller.

3. The laser machining device according to claim 1 ,
wherein the controller is configured to determine whether or not the first position or the position of the workpiece other than the first position of the workpiece is abnormal, based on a comparison between the intensity of the heat radiation obtained when the first position of the workpiece is irradiated with the laser beam and the intensity of the heat radiation obtained when the position of the workpiece other than the first position is irradiated with the laser beam.

4. The laser machining device according to claim 1 ,
wherein the workpiece is a wafer of a semiconductor element material, and
the controller is configured to determine a crack, foreign substance contamination, or warpage of the workpiece.

5. The laser machining device according to claim 2 ,
wherein the display is configured to display, based on the determination result of the controller, a warning light or a notification of the abnormality.

6. The laser machining device according to claim 1 ,
wherein the controller is configured to output the abnormal location.

7. The laser machining device according to claim 2 ,
wherein the controller is configured to identify the abnormality by comparing a measurement value of the heat radiation at each scanning position with one or both of an upper limit threshold and a lower limit threshold.

8. The laser machining device according to claim 2 ,
wherein the controller is configured to:
perform drive control of a scanning optical system, and
compare a measurement value obtained at each scanning position with a measurement value obtained at a front stage position and a measurement value obtained at a rear stage position.

9. A laser machining method comprising:
changing, by a scanner, an irradiation position of a workpiece irradiated with a laser beam; measuring, by a sensor, intensity of heat radiation of the workpiece irradiated with the laser beam; determining, by a controller, an abnormal location of the workpiece, based on the intensity of the heat radiation measured by the sensor; comparing, by the controller, a measurement value of the heat radiation at each scanning position with one or both of an upper limit threshold and a lower limit threshold for identifying an abnormality; comparing, by the controller, the measurement value obtained at a first position of the workpiece with the measurement value obtained at a position of the workpiece other than the first position; two-dimensionally arranging, by the controller, a series of data items of the measurement values of the heat radiation in accordance with the scanning positions; comparing, by the controller, the measurement value obtained at the first position of the workpiece with the measurement value obtained at the position of the workpiece other than the first position, based on the data of the measurement value of the heat radiation; analyzing, by the controller, whether or not a distribution of a measurement value has a predetermined characteristic and determining a pattern of a warpage of the workpiece, a position of the warpage, or a size of the warpage, based on a result of the analysis by the controller, and displaying, by a display, based on a determination result of the controller, a type of the abnormality and a location of the abnormality in the workpiece.

10. The laser machining device according to claim 1 ,
wherein the type of abnormality is one of a crack, foreign substance contamination, and the warpage.

Assignees

• Sumitomo Heavy Industries

Inventors

• Tanaka Teppei
• Aizawa Satoshi
• Aiba Takeshi

Classifications

• H10P34/42

  with electromagnetic radiation, e.g. laser annealing (laser cutting H10P54/20) · CPC title

• B23K26/21

  by welding · CPC title

• B23K26/082

  Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head · CPC title

• B23K26/034 Primary

  Observing the temperature of the workpiece · CPC title

• B23K2101/40

  Semiconductor devices · CPC title