Control unit for a motor vehicle and method for producing and measuring the tightness of a control unit

Patent metadata

Field	Value
Publication number	US-12058809-B2
Application number	US-202217654350-A
Country	US
Kind code	B2
Filing date	Mar 10, 2022
Priority date	Sep 11, 2019
Publication date	Aug 6, 2024
Grant date	Aug 6, 2024

Abstract

A control unit for a motor vehicle is provided. The control unit includes a printed circuit board having a first side and an edge. The first side is delimited by the edge. At least one electronic component is arranged on the first side of the printed circuit board and is electrically conductively connected to the printed circuit board. At least one first conductor loop is arranged on the first side of the printed circuit board and at least one second conductor loop is arranged at a distance from the first conductor loop. The first conductor loop is arranged between the edge and the second conductor loop, and the second conductor loop is arranged between the first conductor loop and the at least one electronic component. An encapsulation surrounds at least the first side, the at least one electronic component, the first conductor loop and the second conductor loop.

First claim

What is claimed is:

1. A control unit for a motor vehicle, the control unit comprising:
a printed circuit board having a first side, a second side, and an edge, the first side of the printed circuit board is delimited by the edge, the second side of the printed circuit board is arranged at a distance from the first side and delimited by the edge;
at least one electronic component arranged on the first side of the printed circuit board and electrically conductively connected to the printed circuit board;
at least one first conductor loop arranged on the first side of the printed circuit board;
at least one second conductor loop arranged at a distance from the first conductor loop, wherein the first conductor loop is arranged between the edge and the second conductor loop, and the second conductor loop is arranged between the first conductor loop and the at least one electronic component;
a third conductor loop and a fourth conductor loop arranged at a distance from the third conductor loop, the third conductor loop and the fourth conductor loop are arranged on the second side of the printed circuit board, the third conductor loop is arranged between the edge and the fourth conductor loop; and
an encapsulation of the printed circuit board, the encapsulation surrounding at least the first side, the at least one electronic component, the first conductor loop and the second conductor loop.

2. The control unit of claim 1 , wherein the first conductor loop and the second conductor loop are open and are each wired by a through-plating for a four-point resistance measurement.

3. The control unit of claim 1 , wherein the printed circuit board is arranged on a base plate via an intermediate layer, wherein the intermediate layer is arranged between the second side and the base plate.

4. The control unit of claim 3 , further comprising an opening arranged and/or formed in the base plate in such a way that contact points of the third and the fourth conductor loop and/or, in a case of a through-plating of the first and the second conductor loop to the second side, contact points of the first and the second conductor loop are accessible via the opening.

5. The control unit of claim 1 , wherein the first conductor loop and/or the second conductor loop and/or the third conductor loop and/or the fourth conductor loop contain/contains silver, brass, copper and/or a silver alloy.

6. The control unit of claim 1 , wherein a width and/or thickness of the first conductor loop, the second conductor loop, the third conductor loop and/or the fourth conductor loop are/is less than 500 μm.

7. A method for producing and measuring a tightness of a control unit having a printed circuit board, the printed circuit board having a first side and an edge where the first side is delimited by the edge, at least one electronic component arranged on the first side of the printed circuit board and electrically conductively connected to the printed circuit board, the method comprising:
immersing the control unit in an electrically conductive medium;
measuring an insulation resistance between a first conductor loop and a second conductor loop, wherein the first conductive loop arranged on a first side of the printed circuit, the second conductor loop arranged at a distance from the first conductor loop, the first conductor loop is arranged between the edge and the second conductor loop, and the second conductor loop is arranged between the first conductor loop and the at least one electronic component, an encapsulation surrounds at least the first side, the at least one electronic component, the first conductor loop and the second conductor loop; and
measuring an insulation resistance of the first conductor loop with respect to the electrically conductive medium is measured.

8. The method of claim 7 , further comprising:
measuring an insulation resistance between a third conductor loop and a fourth conductor loop; and/or
measuring an insulation resistance of the third conductor loop with respect to the electrically conductive medium.

9. The method of claim 8 , wherein the insulation resistance between the first conductor loop and the second conductor loop and/or between the third conductor loop and the fourth conductor loop and/or the insulation resistance between the first conductor loop and the electrically conductive medium and/or the insulation resistance between the third conductor loop and the electrically conductive medium are/is determined during the immersion process or after the process of immersing the control unit in the electrically conductive medium.

10. A motor vehicle comprising a control unit of claim 1 .

Assignees

• Vitesco Technologies Germany Gmbh

Inventors

• Walda Christian
• Brunner Johannes
• Bock Johannes
• Beart Karin
• Heinrich Jens

Classifications

• H05K2203/1327

  Moulding over PCB locally or completely · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K1/181

  associated with surface mounted components · CPC title

• H05K3/0061

  onto a metallic substrate, e.g. a heat sink (heat sinks for electric apparatus H05K7/20) · CPC title

• H05K1/0284

  Details of three-dimensional rigid printed circuit boards (H05K1/119 takes precedence; shaping of the substrate H05K3/0014) · CPC title