Wire bonding apparatus

Patent metadata

Field	Value
Publication number	US-12057428-B2
Application number	US-202218060012-A
Country	US
Kind code	B2
Filing date	Nov 30, 2022
Priority date	Jul 10, 2020
Publication date	Aug 6, 2024
Grant date	Aug 6, 2024

Abstract

A wire bonding includes a capillary that extrudes a wire; a wire clamp assembly disposed on the capillary; a support disposed on the wire clamp assembly; a wire contact member; and a slide rail that provides a slide hole. The wire clamp assembly includes: a first member; a second member spaced apart from the first member; a first contact member coupled to the first member; and a second contact member coupled to the second member and spaced apart from the first contact member. The first member includes a first body that extends in a first direction and a first tilting member that extends at an acute angle relative to the first direction. The second member includes a second body that extends in the first direction and is spaced apart from the first body in a second direction a second tilting member.

First claim

What is claimed is:

1. A wire bonding apparatus, comprising:
a capillary that extrudes a wire;
a wire clamp assembly disposed on the capillary;
a support disposed on the wire clamp assembly;
a wire contact member; and
a slide rail that provides a slide hole,
wherein the wire clamp assembly includes:
a first member;
a second member spaced apart from the first member;
a first contact member coupled to the first member; and
a second contact member coupled to the second member and spaced apart from the first contact member,

wherein the first member includes:
a first body that extends in a first direction; and
a first tilting member that extends at an acute angle relative to the first direction,

wherein the second member includes:
a second body that extends in the first direction and is spaced apart from the first body in a second direction; and
a second tilting member that extends at the acute angle relative to the first direction and is spaced apart from the first tilting member,

wherein the first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member,
wherein the second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member, and
wherein the second member is movable in the second direction,
wherein the support is coupled to an upper side of the wire clamp assembly and provides a support through hole that extends in a third direction intersecting the first and second directions,
wherein the wire contact member is inserted into the support through hole,
wherein the wire contact member provides a through hole
wherein the slide hole forms an arc shape whose center of curvature is located within the through hole of the wire contact member, and
wherein the wire clamp assembly is slidably coupled to the slide hole.

2. The wire bonding apparatus of claim 1 , wherein the wire clamp assembly is rotatable.

3. The wire bonding apparatus of claim 1 , wherein the wire clamp assembly is coupled through a slide block to the slide hole.

4. A wire bonding apparatus, comprising:
a capillary that extrudes a wire;
a wire clamp assembly disposed on the capillary; and
a support disposed on the wire clamp assembly,
wherein the wire clamp assembly includes:
a first member;
a second member spaced apart from the first member;
wherein the first member includes:
a first body that extends in a first direction; and
a first tilting member that extends at an acute angle relative to the first direction,

wherein the second member includes:
a second body that extends in the first direction and is spaced apart from the first body in a second direction; and
a second tilting member that extends at the acute angle relative to the first direction and is spaced apart from the first tilting member,

wherein the second member is movable in the second direction, and
wherein the wire clamp assembly is rotatable.

5. The wire bonding apparatus of claim 4 , further comprising:
a first contact member coupled to the first member; and
a second contact member coupled to the second member and spaced apart from the first contact member,
wherein the first contact member is coupled to an inner surface of the first tilting member and extends in an extending direction of the first tilting member, and
wherein the second contact member is coupled to an inner surface of the second tilting member and extends in an extending direction of the second tilting member.

6. The wire bonding apparatus of claim 5 , wherein each of the first and second contact members includes sapphire.

7. The wire bonding apparatus of claim 5 , wherein the first member and the second member are connected to each other through a resilient member.

8. The wire bonding apparatus of claim 5 , wherein the support is coupled to an upper side of the wire clamp assembly and provides a support through hole that extends in a third direction intersecting the first and second directions.

9. The wire bonding apparatus of claim 5 , further comprising a wire contact member inserted into the support through hole,
wherein the wire contact member provides a through hole.

10. The wire bonding apparatus of claim 9 , wherein the wire contact member includes sapphire.

11. The wire bonding apparatus of claim 10 , further comprising a slide rail that provides a slide hole,
wherein the slide hole forms an arc shape whose center of curvature is located within the through hole of the wire contact member, and
wherein the wire clamp assembly is slidably coupled to the slide hole.

12. The wire bonding apparatus of claim 11 , wherein the wire clamp assembly is coupled through a slide block to the slide hole.

13. The wire bonding apparatus of claim 5 , further comprising a wire tensioner on the support.

Assignees

• Samsung Electronics Co Ltd

Inventors

• Lee Jongeun

Classifications

• H10W72/07168

  Means for storing or moving the material for the connector · CPC title

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title

• H10W72/07521

  Aligning · CPC title